ICE40LP1K-SWG16TR

The ICE40LP1K-SWG16TR is an iCE40™ LP series field‑programmable gate array (FPGA) providing 1,280 logic elements and approximately 64 Kbits of embedded RAM in a compact 16‑WLCSP package. It targets low‑power, space‑constrained designs that require programmable logic, embedded memory and flexible I/O in an industrial‑grade device.

Built on the iCE40 family architecture, this device combines ultra‑low power operation, programmable low‑swing differential I/O options, and on‑chip configuration memory to serve consumer and system applications that demand energy efficiency, small footprint and reliable operation across −40 °C to 100 °C.

Key Features

• Logic Capacity – 1,280 logic elements (LUT + flip‑flop) for implementing control, glue‑logic and small to medium FPGA functions.
• On‑chip Memory – Total RAM bits: 65,536 (approximately 64 Kbits) of embedded RAM for data buffering and small state storage.
• I/O Flexibility – 10 programmable I/Os with support for programmable low swing differential and standard LVCMOS interfaces as provided by the iCE40 family architecture.
• Low Power – Part of the ultra‑low power iCE40 family, with standby currents in the low microampere range as described for the family.
• Clocking and PLLs – Family features include analog PLL support for flexible clock management and source‑synchronous I/O with DDR register capability in I/O cells.
• LED Drivers – Family includes high current LED driver capability (three drivers) suitable for multi‑LED or RGB indicator control.
• Configuration Options – Supports SRAM configuration via standard SPI interface and internal Nonvolatile Configuration Memory (NVCM) as part of the iCE40 family feature set.
• Package and Supply – Supplier device package: 16‑WLCSP (1.40 mm × 1.48 mm), surface mount; operating supply range 1.14 V to 1.26 V.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C.
• Environmental Compliance – RoHS compliant.

Typical Applications

• Consumer and System Devices – Compact programmable logic for low‑power consumer electronics and high‑volume system applications where board space and energy budget are constrained.
• LED and Indicator Control – Built‑in high current LED driver capability enables direct drive of multiple LEDs or RGB indicators with programmable control.
• Interface Bridging and Protocol Glue‑Logic – Small FPGA capacity and flexible I/O support make it suitable for translating, buffering or conditioning signals between digital IP blocks and external peripherals.
• Embedded Control and Sensor Interfaces – Use embedded RAM and programmable logic for lightweight control tasks, data staging and sensor interfacing in industrial‑temperature environments.

Unique Advantages

• Compact, production‑friendly package: The 16‑WLCSP (1.40 mm × 1.48 mm) package minimizes PCB area for space‑constrained designs.
• Low power profile: Part of the iCE40 LP family designed for ultra‑low standby and dynamic power, helping extend battery life in portable systems.
• On‑chip nonvolatile configuration: Internal NVCM plus SPI configuration options simplify system boot and reduce external components.
• Industrial operating range: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Integrated memory and I/O: Approximately 64 Kbits of embedded RAM and programmable I/O reduce external memory and buffering requirements.
• LED driver and I/O versatility: High current LED drivers and programmable sysIO buffer options from the family feature set enable direct control of indicators and support a range of signaling standards.

Why Choose ICE40LP1K-SWG16TR?

The ICE40LP1K-SWG16TR delivers a balanced mix of logic capacity, embedded RAM and flexible I/O in a tiny WLCSP footprint, making it well suited for compact, low‑power embedded systems and consumer devices that require programmable logic at industrial temperature ranges. Its inclusion in the iCE40 LP family brings ultra‑low power characteristics, on‑chip configuration options and family‑level I/O and clocking features that simplify system design and reduce BOM.

This device is appropriate for engineers seeking a small, energy‑efficient FPGA for control, interface bridging, LED driving and other embedded tasks where board space, power and temperature robustness are key considerations.

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