ICE40LP1K-SWG16TR50

The ICE40LP1K-SWG16TR50 is an iCE40™ LP-series FPGA in a compact 16-WLCSP (1.40 × 1.48 mm) package. This device provides 1,280 logic elements, approximately 64 Kbits of embedded RAM, and 10 general-purpose I/O pins in an industrial-grade FPGA footprint.

Built on the iCE40 LP family architecture, the device targets low-power, small-footprint designs and system-level integration. Family features include ultra-low-power operation, programmable I/O buffering, internal non-volatile configuration memory and SPI configuration, and on-chip clocking resources suitable for a variety of consumer, system and industrial applications.

Key Features

• Core Logic — 1,280 logic elements (LUTs + flip-flops) for implementing customized digital functions and glue-logic.
• Embedded Memory — 65,536 bits of on-chip RAM (approximately 64 Kbits) for small data buffers, FIFOs, and state storage.
• I/O — 10 programmable I/O pins in the 16-WLCSP package; sysIO buffer supports multiple interface modes as provided by the iCE40 family.
• Ultra-Low Power — Designed on a 40 nm low-power process; family-level standby currents are as low as 21 μA, enabling battery-friendly designs.
• Configuration Options — SRAM configuration from internal non-volatile configuration memory (NVCM) or external SPI flash, per the iCE40 family specification.
• Clocking — On-chip clock resources and PLL support appropriate for LP1K-class devices (family data indicates one PLL for LP1K devices).
• Package & Temperature — 16-WLCSP (16-XFBGA) small-footprint package (1.40 × 1.48 mm) and industrial operating range of −40 °C to 100 °C.
• Voltage Supply — Core supply operation across a specified range of 1.14 V to 1.26 V.

Typical Applications

• Portable and battery-powered devices — Low standby currents and a compact WLCSP package make the device suitable for space-constrained, low-power designs.
• Consumer and system electronics — Family-targeted for low-cost, high-volume consumer and system applications where small size and embedded memory simplify system design.
• User interfaces and LED control — iCE40 family features include high-current LED drivers (family-specific) and flexible I/O for LED and UI tasks.
• Industrial control and sensor interfacing — Industrial-grade temperature range and programmable I/O enable robust sensor glue-logic and small control tasks.

Unique Advantages

• Small footprint packaging — The 16-WLCSP (1.40 × 1.48 mm) package minimizes PCB area for ultra-compact designs.
• Low-power architecture — 40 nm low-power process and family-level standby figures support extended battery life and low quiescent power.
• Integrated memory and logic — 1,280 logic elements plus approximately 64 Kbits of embedded RAM reduce external component count for simple FPGA-based subsystems.
• Flexible configuration — Support for internal non-volatile configuration memory and standard SPI configuration gives designers multiple deployment options.
• Industrial temperature range — Rated for −40 °C to 100 °C to meet demanding ambient conditions in industrial applications.

Why Choose ICE40LP1K-SWG16TR50?

The ICE40LP1K-SWG16TR50 combines a compact WLCSP footprint with a low-power FPGA architecture and integrated memory, offering a practical solution for designers needing modest logic density and on-chip RAM in tight spaces. Its industrial temperature rating and programmable I/O options make it suitable for both consumer-focused and industrial embedded systems where size, power and integration matter.

For engineers designing small, power-conscious systems that require configurable logic, on-chip configuration options and reliable operation across an industrial temperature range, this iCE40 LP device provides a balanced option with Lattice family-level features and a minimal BOM impact.

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