ICE40LP384-SG32

The ICE40LP384-SG32 is a low-power Field Programmable Gate Array (FPGA) from the iCE40™ LP family, delivering 384 logic elements in a compact 32‑VFQFN (5×5 mm) exposed‑pad package. It is designed for space-constrained, power-sensitive designs requiring flexible programmable logic and a small PCB footprint.

Built on the iCE40 LP family architecture and the 40 nm low-power process described in the datasheet, this device targets low-cost, high-volume consumer and system applications where low standby power, flexible I/O and reliable configuration are important design criteria.

Key Features

• Core Logic 384 logic elements (LUT + flip‑flop) providing compact programmable logic capacity for control, glue logic and small custom accelerators.
• Programmable I/O 21 programmable I/O pins in the 32‑VFQFN package; family-level sysIO buffer support includes a broad range of interfaces and signaling options for flexible board-level integration.
• On‑chip Configuration Supports non‑volatile configuration memory (NVCM) and standard SPI configuration schemes for reliable device startup and flexible system integration.
• Power and Supply Optimized for ultra‑low power operation on a core supply range of 1.14 V to 1.26 V, leveraging the iCE40 LP low‑power process for reduced standby current.
• Clocking Resources Family architecture provides low‑skew global clock resources to simplify clock distribution and timing for small to medium logic designs.
• Package, Mounting & Compliance 32‑VFQFN exposed pad (supplier package: 32‑QFN, 5×5 mm) with surface‑mount footprint; RoHS compliant and rated for industrial operation from −40 °C to 100 °C.

Typical Applications

• Low‑cost consumer devices — Compact FPGA logic for feature control, protocol glue and interface adaptation in high‑volume consumer products.
• System control and glue logic — Implement custom control paths, bus conversion and timing logic between discrete components on compact PCBs.
• Portable and battery‑powered equipment — Low standby power and small package make it suitable for space‑ and energy‑constrained designs.

Unique Advantages

• Ultra‑low power architecture: Leverages the iCE40 LP 40 nm low‑power process to minimize standby and dynamic power for battery‑sensitive applications.
• Compact, PCB‑friendly package: 32‑VFQFN (5×5 mm) exposed‑pad package delivers a small footprint and straightforward surface mount integration.
• Industrial temperature rating: Rated for operation from −40 °C to 100 °C to support robust deployment in demanding environments.
• Flexible configuration options: On‑chip non‑volatile configuration memory plus support for standard SPI configuration methods simplifies board bring‑up and field updates.
• Part of a scalable family: Integration into the broader iCE40 LP family enables easy scaling to higher densities or alternate package options as designs evolve.
• Design tool support: The iCE40 family is supported by vendor design tools that help accelerate development and implementation.

Why Choose ICE40LP384-SG32?

ICE40LP384-SG32 is positioned for engineers who need a compact, low‑power FPGA with a modest logic footprint and flexible I/O in a 5×5 mm QFN package. Its industrial temperature rating, RoHS compliance and small PCB footprint make it suitable for space‑ and power‑constrained designs in consumer and system applications.

As a member of the iCE40 LP family, this device offers a straightforward migration path to larger densities and package options, backed by vendor design tools for efficient development and deployment.

Request a quote or submit an inquiry for pricing, lead time and availability for the ICE40LP384-SG32.