ICE40LP384-SG32TR1K

The ICE40LP384-SG32TR1K is an iCE40™ LP Field Programmable Gate Array (FPGA) in a 32‑lead VFQFN exposed‑pad package. It provides 384 logic elements and 21 programmable I/Os in a compact surface‑mount 5 × 5 mm QFN footprint.

Designed for low‑power and space‑constrained designs, this device operates over an industrial temperature range and runs from a tightly specified core supply. It is positioned for low‑cost, high‑volume consumer and system applications that require small form factor programmable logic with low standby current.

Key Features

• Logic Capacity — 384 logic elements (LUT + flip‑flop) for implementing compact combinational and sequential logic.
• Programmable I/O — 21 I/O pins provided in the 32‑VFQFN package to interface with external signals in a small footprint.
• Low‑Power Architecture — Part of the iCE40 LP family built on a 40 nm low‑power process, with family standby currents reported as low as 21 μA.
• Supply Voltage — Core supply specified from 1.14 V to 1.26 V for stable, defined operation.
• Package and Mounting — 32‑VFQFN exposed pad (supplier device package: 32‑QFN, 5 × 5 mm) for surface‑mount PCB assembly and thermal performance.
• Industrial Temperature Range — Rated to operate from −40 °C to 100 °C for demanding ambient conditions.
• RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.

Typical Applications

• Low‑cost consumer and system products — Compact programmable logic for space‑constrained designs targeted at high‑volume consumer and system applications.
• Embedded glue logic — Small FPGA footprint suitable for consolidating discrete logic and interfacing functions on tight PCBs.
• Industrial embedded designs — Operation across −40 °C to 100 °C enables use in industrial environments where temperature resilience is required.

Unique Advantages

• Compact integration: 384 logic elements and 21 I/Os in a 5 × 5 mm QFN make the device ideal for board areas with constrained space.
• Low standby power: Part of the iCE40 LP family built on a 40 nm low‑power process, supporting designs where idle power matters.
• Industrial temperature support: −40 °C to 100 °C rating supports reliable operation across a wide range of environments.
• Tightly specified core supply: 1.14–1.26 V supply range provides predictable power delivery for the programmable core.
• Surface‑mount packaging with exposed pad: 32‑VFQFN with exposed pad for effective PCB assembly and thermal dissipation in compact layouts.
• Compliance and assembly readiness: RoHS compliance and a standard QFN package simplify integration into modern manufacturing flows.

Why Choose ICE40LP384-SG32TR1K?

The ICE40LP384-SG32TR1K combines compact logic capacity with low‑power family architecture and an industrial temperature rating, making it a practical choice for space‑ and power‑sensitive programmable logic tasks. Its 5 × 5 mm QFN package with exposed pad and surface‑mount mounting supports efficient PCB real estate use and thermal handling.

This part is suited for designers seeking a small, industrial‑rated FPGA from the iCE40 LP family to implement glue logic, protocol adaptation, or other compact programmable functions in consumer and system products where low standby current and a small package are priorities.

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