ICE40LP4K-CM225
| Part Description |
iCE40™ LP Field Programmable Gate Array (FPGA) IC 167 81920 3520 225-VFBGA |
|---|---|
| Quantity | 614 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 225-UCBGA (7x7) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 225-VFBGA | Number of I/O | 167 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE40LP4K-CM225 – iCE40™ LP Field Programmable Gate Array (FPGA) IC, 3,520 logic elements, ~80 Kbits RAM, 167 I/Os, 225-VFBGA
The ICE40LP4K-CM225 is an industrial-grade iCE40™ LP family FPGA in a 225-ball VFBGA package. It provides 3,520 logic elements, approximately 81,920 bits of embedded RAM, and up to 167 programmable I/O pins in a compact surface-mount package.
Designed for low-power, high-volume applications, this device combines an ultra-low-power 40 nm process, flexible on-chip memory and clocking, and a wide operating temperature range to support consumer, industrial and embedded system use cases.
Key Features
- Core Logic 3,520 logic elements (LUTs + flip-flops) suitable for mid-density programmable logic implementations.
- Embedded Memory Approximately 81,920 bits of on-chip RAM for distributed and block memory needs.
- Programmable I/O Up to 167 I/Os with programmable sysIO buffer support for LVCMOS (3.3/2.5/1.8 V), LVDS25E and subLVDS signaling options and programmable pull-up mode.
- Ultra Low Power Built on an advanced 40 nm low power process with standby currents reported as low as 21 µA in the family data; optimized for energy-conscious designs.
- Clocking Flexible on-chip clocking with multiple low-skew global clock resources and analog PLL support as described for the iCE40 family.
- Configuration Options Supports standard SPI configuration and on-chip non-volatile configuration memory (NVCM) for flexible boot options.
- Package & Mounting 225-ball VFBGA surface-mount package; supplier device package listed as 225-UCBGA (7×7).
- Voltage & Temperature Core supply range 1.14 V to 1.26 V; industrial operating temperature range −40 °C to 100 °C.
- Compliance RoHS-compliant.
Typical Applications
- Consumer Electronics Low-cost, high-volume consumer devices that require compact programmable logic and low standby power.
- Portable and Battery-Powered Systems Applications where low standby current and a small package help extend battery life and reduce overall system power.
- Interface and Sensor Bridging Sensor aggregation, protocol bridging and custom I/O handling using the device’s 167 programmable I/Os and flexible I/O standards support.
- Industrial Control and Monitoring Control interfaces, I/O expansion and embedded logic in industrial environments, supported by the device’s industrial grade and −40 °C to 100 °C operating range.
Unique Advantages
- Balanced Logic and Memory 3,520 logic elements paired with ~81.9 Kbits of embedded RAM provide a mid-density platform for a wide range of designs without external memory.
- Low-Power Operation 40 nm low-power process and family-level standby figures enable more efficient designs for power-sensitive products.
- Flexible I/O Support Wide I/O count and programmable sysIO buffers accommodate multiple signaling standards, simplifying system-level interfacing.
- Robust Thermal Range Industrial-grade temperature ratings make the device suitable for deployments across demanding ambient conditions.
- Compact, Surface-Mount Package 225-ball VFBGA (225-UCBGA, 7×7) allows dense PCB integration while maintaining a high I/O count.
- On-Board Configuration Support for SPI configuration and internal NVCM enables flexible, reliable system boot and field updates.
Why Choose ICE40LP4K-CM225?
The ICE40LP4K-CM225 offers a well-balanced combination of mid-range logic density, embedded RAM and a high I/O count in a compact surface-mount package. Its low-power 40 nm implementation and family-level low standby current make it a strong choice for designs where energy efficiency and compactness are priorities.
Targeted at engineers building consumer, portable, and industrial embedded systems, this device delivers practical on-chip memory, flexible I/O standards, and industrial temperature support—backed by the iCE40 family architecture and configuration options for streamlined development and deployment.
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