ICE40LP4K-CM225

IC FPGA 167 I/O 225UCBGA
Part Description

iCE40™ LP Field Programmable Gate Array (FPGA) IC 167 81920 3520 225-VFBGA

Quantity 614 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package225-UCBGA (7x7)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case225-VFBGANumber of I/O167Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs440Number of Logic Elements/Cells3520
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of ICE40LP4K-CM225 – iCE40™ LP Field Programmable Gate Array (FPGA) IC, 3,520 logic elements, ~80 Kbits RAM, 167 I/Os, 225-VFBGA

The ICE40LP4K-CM225 is an industrial-grade iCE40™ LP family FPGA in a 225-ball VFBGA package. It provides 3,520 logic elements, approximately 81,920 bits of embedded RAM, and up to 167 programmable I/O pins in a compact surface-mount package.

Designed for low-power, high-volume applications, this device combines an ultra-low-power 40 nm process, flexible on-chip memory and clocking, and a wide operating temperature range to support consumer, industrial and embedded system use cases.

Key Features

  • Core Logic  3,520 logic elements (LUTs + flip-flops) suitable for mid-density programmable logic implementations.
  • Embedded Memory  Approximately 81,920 bits of on-chip RAM for distributed and block memory needs.
  • Programmable I/O  Up to 167 I/Os with programmable sysIO buffer support for LVCMOS (3.3/2.5/1.8 V), LVDS25E and subLVDS signaling options and programmable pull-up mode.
  • Ultra Low Power  Built on an advanced 40 nm low power process with standby currents reported as low as 21 µA in the family data; optimized for energy-conscious designs.
  • Clocking  Flexible on-chip clocking with multiple low-skew global clock resources and analog PLL support as described for the iCE40 family.
  • Configuration Options  Supports standard SPI configuration and on-chip non-volatile configuration memory (NVCM) for flexible boot options.
  • Package & Mounting  225-ball VFBGA surface-mount package; supplier device package listed as 225-UCBGA (7×7).
  • Voltage & Temperature  Core supply range 1.14 V to 1.26 V; industrial operating temperature range −40 °C to 100 °C.
  • Compliance  RoHS-compliant.

Typical Applications

  • Consumer Electronics  Low-cost, high-volume consumer devices that require compact programmable logic and low standby power.
  • Portable and Battery-Powered Systems  Applications where low standby current and a small package help extend battery life and reduce overall system power.
  • Interface and Sensor Bridging  Sensor aggregation, protocol bridging and custom I/O handling using the device’s 167 programmable I/Os and flexible I/O standards support.
  • Industrial Control and Monitoring  Control interfaces, I/O expansion and embedded logic in industrial environments, supported by the device’s industrial grade and −40 °C to 100 °C operating range.

Unique Advantages

  • Balanced Logic and Memory  3,520 logic elements paired with ~81.9 Kbits of embedded RAM provide a mid-density platform for a wide range of designs without external memory.
  • Low-Power Operation  40 nm low-power process and family-level standby figures enable more efficient designs for power-sensitive products.
  • Flexible I/O Support  Wide I/O count and programmable sysIO buffers accommodate multiple signaling standards, simplifying system-level interfacing.
  • Robust Thermal Range  Industrial-grade temperature ratings make the device suitable for deployments across demanding ambient conditions.
  • Compact, Surface-Mount Package  225-ball VFBGA (225-UCBGA, 7×7) allows dense PCB integration while maintaining a high I/O count.
  • On-Board Configuration  Support for SPI configuration and internal NVCM enables flexible, reliable system boot and field updates.

Why Choose ICE40LP4K-CM225?

The ICE40LP4K-CM225 offers a well-balanced combination of mid-range logic density, embedded RAM and a high I/O count in a compact surface-mount package. Its low-power 40 nm implementation and family-level low standby current make it a strong choice for designs where energy efficiency and compactness are priorities.

Targeted at engineers building consumer, portable, and industrial embedded systems, this device delivers practical on-chip memory, flexible I/O standards, and industrial temperature support—backed by the iCE40 family architecture and configuration options for streamlined development and deployment.

Request a quote or submit a quote to obtain pricing, lead time and availability for the ICE40LP4K-CM225.

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