ICE40LP4K-CM81TR

The ICE40LP4K-CM81TR is an industrial‑grade iCE40™ LP Field Programmable Gate Array offering 3,520 logic elements and approximately 81,920 bits of embedded RAM. It implements Lattice’s ultra‑low power 40 nm architecture with flexible on‑chip memory, configurable I/O, and on‑chip configuration options.

Designed for low‑power, space‑constrained embedded designs, this surface‑mount FPGA is targeted at consumer, industrial and system applications that require low standby power, flexible interface support and compact 81‑ball VFBGA packaging.

Key Features

• Logic Capacity — 3,520 logic elements to implement combinational and sequential logic for glue‑logic, protocol bridging and control functions.
• Embedded Memory — Approximately 81,920 bits of on‑chip RAM for packet buffering, FIFOs and small data stores.
• I/O Count & Flexibility — 63 general purpose I/O pins with programmable sysIO buffer support for LVCMOS 3.3/2.5/1.8, LVDS25E and subLVDS signaling styles.
• Low‑Power Architecture — Fabricated on a 40 nm low‑power process with family features that reduce static and dynamic power; devices in the family report very low standby currents.
• Configurable I/O Features — Programmable low‑swing differential I/Os, DDR registers in I/O cells and Schmitt‑trigger input support for robust signal interfacing.
• Clocking & PLLs — Family architecture provides multiple low‑skew global clock resources and up to two analog PLLs per device for flexible clock management.
• Configuration Options — SRAM device configuration via standard SPI or internal Nonvolatile Configuration Memory (NVCM) for reliable boot and field updates.
• Package & Mounting — 81‑VFBGA (supplier package listed as 81‑UCBGA 4×4) surface‑mount package for compact PCB placement.
• Power & Temperature — Core supply range from 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• IoT Edge Nodes — Low standby power and compact package make the device suitable for battery‑powered sensor aggregators and protocol bridges.
• Wearables & Portable Electronics — Small footprint and low power consumption enable user‑interface logic, sensor fusion and custom peripheral control.
• Industrial Control & Instrumentation — Industrial temperature range and flexible I/O permit integration into control panels, HMIs and sensor interface modules.
• Interface Bridging — Programmable I/O standards and on‑chip memory support protocol conversion and glue‑logic between disparate peripherals.

Unique Advantages

• Low‑power, compact FPGA: 40 nm LP process and small 81‑ball package reduce board area and power budget for space‑constrained designs.
• Balanced integration: On‑chip RAM and 3,520 logic elements let you implement control logic and buffering without an external FPGA fabric or MCU offload.
• Flexible I/O signaling: Programmable sysIO and differential I/O options simplify interfacing to a variety of peripherals and high‑speed links.
• Robust industrial operation: Specified for −40 °C to 100 °C and surface‑mount packaging for reliable deployment in industrial environments.
• Configurable boot options: Internal NVCM and standard SPI configuration paths enable convenient firmware provisioning and in‑system updates.

Why Choose ICE40LP4K-CM81TR?

ICE40LP4K-CM81TR positions itself as a compact, industrial‑grade FPGA solution for designers who need an efficient mix of logic, embedded memory and flexible I/O in a very small footprint. Its low‑power 40 nm architecture, configurable I/O buffer support and on‑chip configuration options make it well suited for embedded control, interface bridging and low‑power consumer and industrial designs.

For teams focused on minimizing BOM count, reducing power consumption and maintaining rugged operation across a wide temperature range, this device delivers a practical balance of integration, configurability and vendor ecosystem support available for the iCE40 LP family.

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