ICE40LP384-SG32TR

IC FPGA 21 I/O 32QFN
Part Description

iCE40™ LP Field Programmable Gate Array (FPGA) IC 21 384 32-VFQFN Exposed Pad

Quantity 930 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package32-QFN (5x5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case32-VFQFN Exposed PadNumber of I/O21Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs48Number of Logic Elements/Cells384
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of ICE40LP384-SG32TR – iCE40™ LP Field Programmable Gate Array (FPGA) IC, 384 logic elements, 32-VFQFN Exposed Pad

The ICE40LP384-SG32TR is a low-power iCE40™ LP FPGA in a 32-VFQFN exposed-pad package designed for compact, energy-conscious embedded designs. It provides a LUT-optimized logic fabric with 384 logic elements and a package-appropriate I/O count for control, interface bridging, and low- to mid-complexity programmable logic tasks.

Built on the iCE40 family architecture, the device targets applications that require small footprint, low standby current, and industrial-temperature operation while maintaining flexible I/O and configuration options documented for the iCE40 LP family.

Key Features

  • Logic Fabric — 384 logic elements (LUT + flip-flop) organized across 48 CLBs, suitable for LUT-optimized designs and small programmable-logic tasks.
  • I/O — 21 programmable I/Os in the SG32 (32‑QFN) package, supporting a range of signal interfaces as provided by the iCE40 family programmable I/O buffers.
  • Low-Voltage Core — Core supply range from 1.14 V to 1.26 V for low-power system integration.
  • Low-Power Process — Part of the iCE40 LP family fabricated on a 40 nm low-power process; family data documents ultra-low standby currents (as low as 21 μA) for energy-sensitive applications.
  • Clocking and Configuration — Family-level clocking includes multiple low-skew global clock resources; configuration options in the iCE40 family include standard SPI and internal non-volatile configuration memory (NVCM).
  • Package and Mounting — 32‑VFQFN exposed pad package (5 mm × 5 mm) with surface-mount mounting style and exposed pad for PCB thermal management.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for challenging temperature environments.
  • Regulatory — RoHS-compliant.

Typical Applications

  • Embedded control and glue logic — Compact, low-power programmable logic for glue logic, protocol adaptation, and peripheral control in embedded systems.
  • Sensor and interface bridging — Implement modest I/O aggregation, format adaptation, or simple data conditioning between sensors and host processors.
  • Low-power portable or battery-powered products — Leverage the LP family’s low standby current and low-voltage core to minimize power draw in idle and active states.
  • Industrial equipment control — Use the device’s temperature rating and compact package for control and monitoring functions in industrial environments.

Unique Advantages

  • Right-sized logic capacity: 384 logic elements provide predictable resources for small to mid-scale logic functions without surplus silicon.
  • Compact, PCB-friendly package: 32‑VFQFN (5 × 5 mm) with exposed pad enables small footprint designs while supporting thermal dissipation on the PCB.
  • Low-voltage operation: 1.14–1.26 V core supply reduces power consumption and simplifies integration with low-voltage systems.
  • Industrial temperature support: −40 °C to 100 °C rating helps maintain reliability in temperature-challenging applications.
  • Family-level low-power heritage: As a member of the iCE40 LP family, it benefits from architecture and process choices focused on minimizing standby and dynamic power.
  • RoHS compliance: Conforms to lead-free, halogen-free manufacturing practices for regulatory and environmental requirements.

Why Choose ICE40LP384-SG32TR?

The ICE40LP384-SG32TR delivers a compact, low-power FPGA option for designs that require a modest number of logic elements, a defined small I/O count, and industrial temperature tolerance. Its low-voltage core and the iCE40 LP family’s focus on ultra-low power make it well suited for battery-operated equipment, embedded controllers, and interface bridging tasks where board space and energy efficiency are priorities.

Engineers selecting this device gain access to a predictable resource set in a small 32‑VFQFN exposed-pad package, backed by the iCE40 family design ecosystem and configuration options for SPI or internal non-volatile configuration memory documented in the family datasheet.

Request a quote or submit a purchasing inquiry to receive pricing, availability, and lead-time information for the ICE40LP384-SG32TR.

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