ICE40UL640-CM36AI
| Part Description |
iCE40 UltraLite™ Field Programmable Gate Array (FPGA) IC 26 57344 640 36-VFBGA |
|---|---|
| Quantity | 603 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 36-UCBGA (2.5x2.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-VFBGA | Number of I/O | 26 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of ICE40UL640-CM36AI – iCE40 UltraLite™ FPGA, 640 logic elements, 36‑VFBGA
The ICE40UL640-CM36AI is an industrial‑grade iCE40 UltraLite™ Field Programmable Gate Array (FPGA) featuring 640 logic elements and approximately 57,344 bits of embedded RAM. It provides a compact, surface‑mount solution in a 36‑VFBGA (36‑ucBGA, 2.5 mm × 2.5 mm) package with 26 user I/Os.
Built around the iCE40 UltraLite family architecture, the device targets ultra‑low power, small‑form‑factor designs and includes on‑chip oscillators, hardened LED/IR driver logic, on‑chip configuration options, and low standby current for always‑on sensor and interface management applications.
Key Features
- Logic Capacity 640 logic elements providing compact programmable logic; device organization also lists 80 CLBs for architectural partitioning.
- Embedded Memory Approximately 56 kbits of on‑chip Block RAM (57,344 bits) for buffering, state storage, and small data structures.
- I/O and Package 26 programmable I/O pins in a 36‑VFBGA package (supplier package: 36‑ucBGA, 2.5 mm × 2.5 mm), optimized for small footprint surface‑mount applications.
- Ultra‑Low Power Operation Designed on a low‑power process with typical standby current around 35 μA (≈42 μW), supporting always‑on use cases.
- On‑Chip Clocking Two internal oscillators (10 kHz LFOSC and 48 MHz HFOSC) plus a PLL and multiple low‑skew global clock resources for flexible clocking schemes.
- Hardened Peripherals Integrated RGB PWM logic with 24 mA current sinks, hardened TX/RX pulse logic for IR, a 400 mA IR driver (combinable to 500 mA), and a 100 mA barcode emulator driver.
- Interfaces and Configuration Optional FIFO‑mode I²C interface up to 1 MHz and flexible configuration via standard SPI or internal Nonvolatile Configuration Memory (NVCM).
- Operating Range Supply voltage 1.14 V to 1.26 V and operating temperature range −40 °C to 100 °C for industrial environments.
- Mounting Surface‑mount device suitable for automated assembly in compact systems.
Typical Applications
- Mobile and Handheld Interfaces Always‑on sensor management, service LED control, and simple protocol bridging where low standby power and small size are required.
- IoT and Sensor Hubs Local aggregation and preprocessing of sensor data using on‑chip memory and low‑frequency oscillator for ultra‑low power monitoring.
- IR Remote and Barcode Emulation Direct IR LED drive and barcode emulator outputs enable compact implementations of remote control and barcode scanning interfaces.
- RGB Indicator and Lighting Control Hardened RGB PWM with selectable sink currents for driving status or indicator LEDs without external MOSFETs or buffers.
Unique Advantages
- Highly integrated I/O drivers: Built‑in RGB, IR and barcode drivers reduce external component count and simplify BOMs for LED and IR applications.
- Small footprint packaging: 36‑ball ucBGA (2.5 mm × 2.5 mm) enables high‑density board layouts and compact product designs.
- Low standby power: Typical standby current around 35 μA supports always‑on functions while minimizing power draw.
- Flexible configuration options: Standard SPI programming or internal NVCM provides design flexibility for different manufacturing and field update workflows.
- Designed for industrial environments: −40 °C to 100 °C operating range and surface‑mount package suitable for rugged embedded systems.
- Embedded memory and clocking: On‑chip Block RAM and dual oscillators allow compact implementations without relying on extensive external resources.
Why Choose ICE40UL640-CM36AI?
The ICE40UL640-CM36AI combines the iCE40 UltraLite family’s ultra‑low power architecture with a compact 36‑VFBGA package and integrated LED/IR driver functions. Its balance of 640 logic elements, approximately 56 kbits of block RAM, and 26 I/Os makes it well suited for small‑form‑factor sensor managers, user interface controllers, and low‑power embedded peripherals in industrial and handheld devices.
Designers benefit from reduced BOM and simplified board designs thanks to hardened peripherals and flexible configuration options, while the device’s voltage and temperature specifications support robust deployment across a broad set of embedded applications.
Request a quote or submit a sales inquiry to evaluate ICE40UL640-CM36AI for your next low‑power, compact FPGA design.