ICE40UL640-CM36AITR

IC FPGA 26 I/O 36UCBGA
Part Description

iCE40 UltraLite™ Field Programmable Gate Array (FPGA) IC 26 57344 640 36-VFBGA

Quantity 348 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package36-UCBGA (2.5x2.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case36-VFBGANumber of I/O26Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of ICE40UL640-CM36AITR – iCE40 UltraLite™ FPGA, 640 logic elements, 36‑ball VFBGA

The ICE40UL640-CM36AITR is an iCE40 UltraLite™ Field Programmable Gate Array (FPGA) in a 36‑VFBGA package, offering 640 logic elements and 57,344 bits of embedded RAM. Designed for ultra‑low power, small‑footprint applications, this industrial‑grade device targets mobile and handheld sensor-management tasks and compact embedded systems that require integrated LED/IR drive and low standby power.

With a 26‑pin I/O count, on‑chip oscillators, hardened LED/IR controllers and flexible configuration options, the ICE40UL640-CM36AITR provides an integrated building block for compact, power‑sensitive designs operating across a wide temperature and voltage range.

Key Features

  • Core Logic — 640 logic elements suitable for lightweight control, glue logic, and sensor-management tasks.
  • Embedded Memory — 57,344 bits of on‑chip RAM (approximately 56 kbits) to support buffering and small data working sets.
  • I/O and Package — 26 general purpose I/Os in a 36‑ball ucBGA (2.5 × 2.5 mm) surface‑mount package for compact board layouts.
  • Ultra‑Low Power — Typical standby current ~35 μA (≈42 μW), enabling always‑on and low‑power standby operation.
  • On‑Chip Oscillators — Two oscillators (10 kHz LFOSC and 48 MHz HFOSC) for low‑power wake and higher speed tasks without external clocks.
  • Hardened LED and IR Drivers — Integrated RGB PWM with three 24 mA constant‑current outputs, a 400 mA IR LED driver (combining to 500 mA with barcode driver), and a 100 mA barcode emulator output for direct LED interfacing.
  • Interfaces — Optional FIFO‑mode I²C interfaces supporting up to 1 MHz operation, configurable as master or slave.
  • Clocking and Timing — One PLL with dynamic interface and multiple low‑skew global routing resources for synchronous designs.
  • Configuration — SRAM configuration via standard SPI or internal nonvolatile configuration memory (NVCM) for flexible system boot and updates.
  • Industrial Temperature and Supply — Rated for operation from −40 °C to 100 °C with a supply range of 1.14 V to 1.26 V; RoHS compliant.

Typical Applications

  • Mobile and Handheld Devices — Instant‑on, ultra‑low power control and sensor management in compact consumer devices.
  • Sensor Hubs and Multi‑Sensor Management — Small FPGA fabric and on‑chip RAM for aggregating and preprocessing sensor signals.
  • IR Remote and Barcode Emulation — Built‑in IR and barcode drivers simplify direct LED interfacing for remote control and scanning applications.
  • RGB Lighting and Status LEDs — Hardened RGB PWM outputs enable direct drive of service and status LEDs without external MOSFETs or buffers.
  • Industrial Handheld Equipment — Industrial temperature range and compact package fit lightweight control tasks in rugged handheld instruments.

Unique Advantages

  • Integrated LED/IR Drivers: On‑chip RGB PWM and high‑current IR/barcode drivers reduce BOM and eliminate external driver components for LED‑centric functions.
  • Extremely Low Standby Power: Typical 35 μA standby current supports always‑on applications where minimal idle power is critical.
  • Small Form Factor: 36‑ball ucBGA (2.5 × 2.5 mm) surface‑mount package enables compact PCB layouts for space‑constrained designs.
  • Flexible On‑Chip Clocking: Dual oscillators plus a PLL provide options for low‑power wakeup and higher performance tasks without extra external oscillators.
  • Configuration Flexibility: Support for SPI configuration or internal nonvolatile configuration memory simplifies manufacturing and field updates.
  • Industrial Temperature Rating: −40 °C to 100 °C operation suits embedded and industrial handheld environments.

Why Choose ICE40UL640-CM36AITR?

The ICE40UL640-CM36AITR delivers a compact, ultra‑low power FPGA solution with integrated drivers and on‑chip memory for designers who need a small‑footprint programmable fabric. Its combination of low standby current, built‑in LED/IR capabilities, dual oscillators and flexible configuration options make it especially well suited to mobile, sensor management, LED control and handheld industrial applications.

As a member of the iCE40 UltraLite family, the device offers a clear density choice for designs that require modest logic capacity with strong integration and low power—helping reduce external components while meeting industrial temperature and supply requirements.

Request a quote or submit a pricing inquiry today to evaluate ICE40UL640-CM36AITR for your next compact, low‑power design.

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