ICE40UL640-SWG16ITR50

IC FPGA 10 I/O 16WLCSP
Part Description

iCE40 UltraLite™ Field Programmable Gate Array (FPGA) IC 10 57344 640 16-XFBGA, WLCSP

Quantity 381 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package16-WLCSP (1.4x1.48)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case16-XFBGA, WLCSPNumber of I/O10Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of ICE40UL640-SWG16ITR50 – iCE40 UltraLite™ FPGA, 640 LUTs, 16-WLCSP

The ICE40UL640-SWG16ITR50 is an ultra‑small, ultra‑low‑power Field Programmable Gate Array (FPGA) from the iCE40 UltraLite family. It provides 640 logic elements, embedded RAM, integrated peripheral IP and on‑chip oscillators in a compact 16‑ball WLCSP (1.4 × 1.48 mm) package for space‑constrained, battery‑sensitive applications.

Designed for mobile and sensor management use cases, the device targets always‑on and low‑power functions such as RGB LED control, IR and barcode emulation, simple sensor interfacing and small‑form system glue logic, while supporting industrial temperature operation from −40 °C to 100 °C.

Key Features

  • Core Logic  640 logic elements (LUTs) suitable for compact control, interface and glue‑logic implementations.
  • Embedded Memory  57,344 bits of on‑chip RAM (approximately 56 kbits) to store small data structures and FIFOs for user logic.
  • Low I/O Count  10 programmable I/O pins for minimal‑pin interfacing in compact designs.
  • Ultra‑Low Power Operation  Device family is built on a 40 nm low‑power process and designed for always‑on, low standby consumption and instant‑on applications.
  • On‑Chip Oscillators  Includes a 10 kHz low‑frequency oscillator and a 48 MHz high‑frequency oscillator for low‑power timing and wakeup activities.
  • Integrated LED and IR Drivers  Hardened RGB PWM and TX/RX pulse logic, with dedicated current drive options for RGB LEDs and IR/barcode outputs (family feature set).
  • Interfaces and Clocking  Family supports two optional FIFO‑mode I²C interfaces (up to 1 MHz), a PLL and eight low‑skew global clock resources; one PLL with dynamic interface is available per device.
  • Configuration Options  SRAM configuration via standard SPI or Internal Nonvolatile Configuration Memory (NVCM) for flexible startup and field updates.
  • Package & Mounting  16‑XFBGA / WLCSP surface mount package (16‑WLCSP, 1.4 × 1.48 mm) ideal for ultra‑small PCB footprints.
  • Power and Environment  Operates from 1.14 V to 1.26 V and is specified for industrial temperature range (−40 °C to 100 °C); RoHS compliant.

Typical Applications

  • Smartphones and Mobile Devices  Always‑on sensor management, simple peripheral control and power‑efficient wakeup logic in compact footprints.
  • Handheld and Tablet Devices  Service LED and RGB control, IR remote or barcode emulation functions integrated without large external driver circuitry.
  • Multi‑Sensor Management  Aggregation and interface hub for small arrays of sensors where low standby current and instant‑on behavior are critical.
  • Industrial Handhelds  Compact logic and I/O expansion in handheld industrial equipment within an industrial temperature range.

Unique Advantages

  • Compact, production‑ready package: The 16‑WLCSP (1.4 × 1.48 mm) package minimizes PCB area for space‑constrained designs.
  • Integrated driver IP: Hardened RGB PWM and IR/barcode driver logic reduce external BOM and simplify LED/IR implementations.
  • Low‑voltage, low‑power operation: Narrow supply window (1.14–1.26 V) and family focus on ultra‑low power help extend battery life in portable products.
  • Flexible configuration options: Supports SPI configuration or internal NVCM for field updates and reliable startup.
  • Industrial temperature capability: Specified operation from −40 °C to 100 °C for deployment in demanding ambient environments.

Why Choose ICE40UL640-SWG16ITR50?

The ICE40UL640-SWG16ITR50 combines a compact WLCSP footprint with 640 LUTs, embedded RAM and hardened peripheral IP to deliver an efficient, integrated solution for low‑power, small‑form applications. Its family features—on‑chip oscillators, LED/IR drivers, flexible configuration and low standby behavior—make it well suited for designs that need always‑on capability and minimal external components.

This FPGA is ideal for engineers building compact mobile, handheld or sensor management systems who require a balance of integration, low power and industrial temperature operation. The device’s small package and integrated functions reduce BOM complexity and help accelerate time to market.

Request a quote or submit an inquiry to get pricing, availability and technical support for the ICE40UL640-SWG16ITR50.

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