ICE40UP3K-UWG30ITR1K

IC FPGA 21 I/O 30WLCSP
Part Description

iCE40 UltraPlus™ Field Programmable Gate Array (FPGA) IC 21 1130496 2800 30-UFBGA, WLCSP

Quantity 1,670 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package30-WLCSP (2.54x2.12)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case30-UFBGA, WLCSPNumber of I/O21Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs350Number of Logic Elements/Cells2800
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1130496

Overview of ICE40UP3K-UWG30ITR1K – iCE40 UltraPlus FPGA, 2800 logic elements, 30-UFBGA WLCSP

The ICE40UP3K-UWG30ITR1K is an iCE40 UltraPlus™ family FPGA IC from Lattice Semiconductor Corporation, delivering 2,800 logic elements and approximately 1.13 Mbits of embedded RAM in a compact 30‑WLCSP footprint. Its industrial-grade specification and surface-mount WLCSP package are intended for space-constrained designs that require on-chip memory, programmable logic, and a small PCB footprint.

Built on the iCE40 UltraPlus family architecture, the device provides a combination of FPGA fabric, on-chip RAM, DSP and system IP building blocks described in the family data sheet, enabling integration of control, interface, and signal processing functions in a single device.

Key Features

  • Logic Capacity — 2,800 logic elements to implement moderate-density logic, control, and glue‑logic functions.
  • Embedded Memory — Approximately 1.13 Mbits of on-chip RAM for buffers, FIFOs, and small data stores.
  • I/O — 21 user I/O pins to connect peripherals, sensors, and interfaces in compact systems.
  • Power and Voltage — Core supply range 1.14 V to 1.26 V to match low-voltage system rails.
  • Industrial Grade & Temperature — Rated for industrial operation from -40 °C to 100 °C for deployment in demanding environments.
  • Package & Mounting — 30‑UFBGA WLCSP (supplier device package 30‑WLCSP, 2.54 × 2.12 mm) in a surface-mount form factor for minimal board area.
  • iCE40 UltraPlus Family Architecture — Family-level features documented in the data sheet include PLB blocks, routing and clock/control distribution, sysCLOCK PLLs, embedded block RAM and SPRAM, sysDSP, sysI/O buffer banks, on‑chip oscillator, user I2C/SPI IP, RGB drive and PWM IP, and non-volatile configuration options.
  • Compliance — RoHS‑compliant component.

Typical Applications

  • Industrial Control — Use the industrial temperature rating and programmable logic to implement control logic, signal conditioning, and interface glue in factory and process automation.
  • LED and Display Control — Family-level RGB high-current drive and PWM IP support LED and small display driving tasks within compact product designs.
  • Sensor Interfacing and Preprocessing — On-chip RAM and logic elements enable local buffering and preprocessing of sensor data before forwarding to a host processor.
  • Compact Embedded Products — The 30‑WLCSP package and surface-mount mounting make this FPGA suitable for space-limited consumer or industrial modules requiring programmable logic.

Unique Advantages

  • Compact WLCSP package: 30‑WLCSP (2.54 × 2.12 mm) minimizes PCB area and supports high‑density board layouts.
  • Integrated on‑chip memory: Approximately 1.13 Mbits of embedded RAM reduces external memory needs and simplifies BOM.
  • Moderate logic resources: 2,800 logic elements provide the capacity for control, glue logic, and light signal processing without over-provisioning.
  • Industrial temperature range: −40 °C to 100 °C operation expands deployment options to harsher environments.
  • Low-voltage core: 1.14–1.26 V supply compatibility with modern low-voltage designs.
  • Family-level system IP: Leveraging iCE40 UltraPlus architecture (PLLs, DSP, SPRAM, I/O buffers, on‑chip oscillator and configuration options) enables faster system integration aligned with the family data sheet.

Why Choose ICE40UP3K-UWG30ITR1K?

The ICE40UP3K-UWG30ITR1K positions itself as an industrial-grade, compact FPGA option for designs that need programmable logic, embedded memory, and a small package. With 2,800 logic elements and approximately 1.13 Mbits of on‑chip RAM, it offers a balanced resource set for control, interfacing, and modest signal processing tasks while keeping board area and external components to a minimum.

Its WLCSP footprint, low-voltage core supply range, and documented family-level IP blocks make it suitable for engineers building space-constrained modules, industrial controls, LED/display drivers, and sensor interface systems that benefit from integrated FPGA capabilities and Lattice’s iCE40 UltraPlus architecture.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the ICE40UP3K-UWG30ITR1K and support your next compact FPGA-enabled design.

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