ICE40UP3K-UWG30ITR

The ICE40UP3K-UWG30ITR is a field-programmable gate array (FPGA) IC from the iCE40 UltraPlus family. It provides reconfigurable logic fabric with 2,800 logic elements and approximately 1.13 Mbits of embedded RAM in a compact 30-WLCSP package targeted at industrial applications.

Designed for space-constrained, temperature-challenging environments, the device operates from a low-voltage supply range of 1.14 V to 1.26 V, supports up to 21 I/Os, and is specified for an operating temperature range of −40 °C to 100 °C.

Key Features

• Reconfigurable Logic – 2,800 logic elements for implementing custom digital functions, control logic, and glue-logic in a single device.
• On-Chip Memory – Approximately 1.13 Mbits of embedded RAM to support buffers, state machines, and local data storage without external RAM.
• I/O Capability – Up to 21 general-purpose I/O pins for sensor interfaces, control signals, and peripheral connections.
• Power and Clock – Supports a 1.14 V to 1.26 V supply and includes family-level features such as on-chip oscillators and PLL/clock resources described in the iCE40 UltraPlus datasheet.
• Package and Mounting – 30-UFBGA / 30-WLCSP (2.54 × 2.12 mm) surface-mount package enabling very compact board layouts.
• Industrial Grade – Specified for an operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
• Family-Level System Features – The iCE40 UltraPlus family datasheet documents integrated features such as embedded DSP blocks, single-port RAM (SPRAM), user SPI, RGB LED drive and PWM IP, non-volatile configuration memory, and power-saving options.
• Standards and Compliance – RoHS compliant.

Typical Applications

• Industrial Control – Implement compact control logic, I/O expansion, and protocol bridging in temperature-demanding industrial systems using the industrial-grade temperature range and small package.
• Embedded Sensor Interfaces – Aggregate and preprocess sensor data using the device’s logic and on-chip RAM before forwarding to a host controller.
• LED and Display Control – Use documented RGB LED drive and PWM IP from the UltraPlus family to manage lighting and simple display tasks in tight form-factor designs.
• Space-Constrained Embedded Systems – Fit reconfigurable logic into small products using the 30-WLCSP 2.54 × 2.12 mm footprint and surface-mount mounting.

Unique Advantages

• Compact, high-density packaging: The 30-WLCSP (2.54 × 2.12 mm) package enables dense board integration and minimal PCB area for embedded designs.
• On-board memory for local buffering: Approximately 1.13 Mbits of embedded RAM reduces dependence on external memory and simplifies BOM.
• Low-voltage operation: The 1.14 V to 1.26 V supply window supports low-power system designs and compatibility with low-voltage rails.
• Industrial temperature rating: Specified −40 °C to 100 °C to meet the thermal requirements of many industrial applications.
• Family-level system IP: Access to documented UltraPlus family features—PLLs, on-chip oscillators, DSP and SPRAM building blocks, I/O buffer options, RGB PWM and non-volatile configuration—helps accelerate system design.
• RoHS compliant: Meets common environmental and manufacturing directives for lead-free assembly.

Why Choose ICE40UP3K-UWG30ITR?

The ICE40UP3K-UWG30ITR positions itself as a compact, industrial-grade FPGA solution that combines reconfigurable logic, significant on-chip RAM, and a tiny WLCSP footprint. Its specifications—2,800 logic elements, approximately 1.13 Mbits of embedded RAM, 21 I/Os, low-voltage operation, and wide temperature range—make it well suited for embedded engineers who need a small, reliable programmable device for industrial and space-constrained applications.

By leveraging documented UltraPlus family features such as PLLs, on-chip oscillators, DSP/SRAM building blocks, RGB PWM IP, and non-volatile configuration options, designers can reduce external components, simplify PCB layout, and accelerate time-to-market while maintaining industrial operating limits.

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