ICE40UL1K-CM36AITR1K

The ICE40UL1K-CM36AITR1K is an industrial‑grade iCE40 UltraLite Field Programmable Gate Array (FPGA) offering ultra‑low power operation and compact packaging for space‑constrained embedded designs. Built on the iCE40 UltraLite architecture, it combines 1K LUT‑class fabric with on‑chip block RAM, hardened LED/IR peripherals and dual on‑chip oscillators for instant‑on sensor‑management and control tasks.

This device targets mobile and handheld applications as well as industrial sensor and interface functions where low standby current, small form factor and integrated I/O drivers reduce system BOM and simplify board design.

Key Features

• Core logic — 1,248 logic elements (1K LUT‑class) suitable for compact control and glue‑logic functions.
• Embedded memory — 57,344 bits of on‑chip RAM (approximately 56 kbits) for local buffering and state storage.
• I/O count — 26 programmable I/O pins for sensor, peripheral and host interfaces.
• Hardened LED and IR peripherals — Integrated RGB PWM with three 24 mA constant‑current LED outputs, a 400 mA IR LED driver (combinable with 100 mA barcode driver to form up to 500 mA), and a 100 mA barcode emulation driver to drive LEDs directly without external MOSFETs or buffers.
• On‑chip oscillators and clocking — Two oscillators (10 kHz LFOSC and 48 MHz HFOSC) plus one PLL with dynamic interface for flexible clocking.
• Configuration options — SRAM configuration via standard SPI or internal Nonvolatile Configuration Memory (NVCM) for flexible system boot and reconfiguration.
• Low power platform — Fabricated on an ultra‑low power process with a typical standby current of 35 μA (≈42 μW standby power), supporting always‑on and low‑power sensor management use cases.
• Supply and temperature — Core supply range 1.14 V to 1.26 V; industrial operating range −40 °C to 100 °C.
• Package and mounting — 36‑VFBGA (supplier package: 36‑uBGA, 2.5 × 2.5 mm) surface‑mount footprint for ultra‑small board implementations.
• Regulatory — RoHS compliant.

Typical Applications

• Mobile and handheld devices — Instant‑on logic, low standby power and compact package for always‑on sensor aggregation and control in phones, tablets and portable equipment.
• Multi‑sensor management — Embedded RAM, local oscillators and programmable I/Os enable sensor fusion, preprocessing and interface bridging with minimal external components.
• IR remote and barcode emulation — Integrated IR and barcode driver outputs simplify designs for IrDA, remote control transmitters and barcode scanner interface logic.
• RGB and status LED control — Hardened RGB PWM outputs with constant current sinks allow direct drive of service and indicator LEDs without external drivers.
• Handheld industrial instruments — Industrial temperature rating and small form factor fit compact handheld tools requiring reliable control logic and direct LED/IR interfaces.

Unique Advantages

• Highly integrated peripherals: Built‑in RGB PWM, IR and barcode drivers reduce external component count and simplify board design.
• Ultra‑low idle power: Typical 35 μA standby current (≈42 μW) supports always‑on and battery‑sensitive applications.
• Compact footprint: 36‑ball uBGA (2.5 × 2.5 mm) enables dense PCB layouts for space‑constrained products.
• Flexible configuration: SPI and internal NVCM options provide multiple boot and update strategies for fielded devices.
• Robust operating range: Industrial −40 °C to 100 °C rating meets the needs of demanding embedded and handheld environments.
• On‑chip clock resources: Dual oscillators and a PLL deliver immediate and flexible clocking without additional oscillator components.

Why Choose ICE40UL1K-CM36AITR1K?

The ICE40UL1K-CM36AITR1K positions itself as a compact, industrial‑grade FPGA for designs that require low standby power, integrated LED/IR drivers, and a small BGA footprint. Its combination of 1K LUT‑class logic, ~56 kbits of embedded RAM and dedicated peripheral functions makes it suitable for sensor management, consumer handhelds and industrial portable devices where board space and power budget are constrained.

Design teams benefit from a reduced BOM and simplified I/O and LED/IR interfacing, while the device’s configuration flexibility and industrial temperature range support reliable deployment across a range of embedded products.

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