ICE40LP8K-CM225
| Part Description |
iCE40™ LP Field Programmable Gate Array (FPGA) IC 178 131072 7680 225-VFBGA |
|---|---|
| Quantity | 198 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 225-UCBGA (7x7) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 225-VFBGA | Number of I/O | 178 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 960 | Number of Logic Elements/Cells | 7680 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 131072 |
Overview of ICE40LP8K-CM225 – iCE40™ LP Field Programmable Gate Array (FPGA) IC 178 131072 7680 225-VFBGA
The ICE40LP8K-CM225 is an iCE40™ LP series field programmable gate array (FPGA) in a 225-ball VFBGA/ucBGA package. It provides 7,680 logic elements, approximately 128 kbits of embedded RAM, and up to 178 user I/Os in a compact 7×7 package footprint.
Designed for low-power, configurable logic in consumer and system applications, this industrial-grade device combines flexible I/O, on-chip configuration options and on-chip clocking resources to enable a range of embedded and interface functions while operating across a wide temperature and voltage range.
Key Features
- Core Logic — 7,680 logic elements (LUTs + flip-flops) supporting flexible LUT4-based architecture.
- Embedded Memory — Approximately 128 kbits of sysMEM™ embedded block RAM for data buffering and small local storage.
- I/O Capacity & Flexibility — Up to 178 programmable I/O pins with support for multiple I/O standards (programmable sysIO™ buffer features are part of the iCE40 family).
- Low-Power Architecture — Ultra-low power family architecture fabricated on a 40 nm low-power process; family datasheet cites extremely low standby currents for LP variants.
- On-Chip Clocking — Multiple low-skew global clock resources and up to two PLLs (family-level feature) for flexible clocking and source-synchronous interfaces.
- Configuration Options — SRAM configuration via standard SPI and internal Nonvolatile Configuration Memory (NVCM) as provided by the iCE40 family.
- High-Current LED Drivers (family feature) — Family includes devices with high-current LED drivers suitable for driving three separate LEDs or one RGB LED.
- Package & Mounting — 225-VFBGA package (supplier device package listed as 225-UCBGA, 7×7); surface-mount mounting type.
- Operating Range — Voltage supply range: 1.14 V to 1.26 V; operating temperature range: −40 °C to 100 °C.
- Environmental Compliance — RoHS-compliant.
Typical Applications
- Consumer and High-Volume Systems — Flexible programmable logic for feature integration, protocol bridging and control functions in low-cost, high-volume devices.
- User Interfaces and LED Control — Drives multiple LEDs or RGB lighting and implements UI logic using the family’s high-current LED driver capability.
- Flexible I/O Bridging — Implements interface adaptation and signal conditioning where a high count of programmable I/Os and multiple I/O standards are required.
- Embedded Control and Glue Logic — Local control, glue logic and small data buffering using the device’s logic elements and embedded RAM.
Unique Advantages
- High Logic Density: 7,680 logic elements enable substantial on-chip logic integration to consolidate discrete components and reduce BOM.
- Significant On-Chip RAM: Approximately 128 kbits of embedded RAM provides local storage for buffering, state machines and small data sets without external memory.
- Broad I/O Count: Up to 178 programmable I/Os support complex peripheral and interface requirements on a single device.
- Industrial Operating Range: Specified for −40 °C to 100 °C, making it suitable for industrial-temperature applications.
- Compact, PCB-Friendly Package: 225-ball VFBGA/ucBGA in a 7×7 layout provides a small footprint for space-constrained designs while retaining high I/O availability.
- On-Chip Configuration Flexibility: Support for SPI configuration and internal NVCM simplifies system boot and deployment options.
Why Choose ICE40LP8K-CM225?
ICE40LP8K-CM225 positions itself as a compact, industrial-grade FPGA option for designers needing moderate-to-high logic density, substantial I/O capability and embedded RAM in a small BGA package. Its combination of 7,680 logic elements, approximately 128 kbits of on-chip memory and up to 178 I/Os delivers integration and interface flexibility for consumer and system-level designs.
Backed by the iCE40 family design resources, the device is suited to teams that need low-power, configurable logic with multiple configuration and clocking options. The device’s operating voltage and temperature ranges, along with RoHS compliance, support deployment in industrial environments where long-term availability and ecosystem support are important.
Request a quote or submit an inquiry for ICE40LP8K-CM225 to receive pricing and availability information for your design needs.