ICE40LP8K-CM121TR1K

The ICE40LP8K-CM121TR1K is an iCE40™ LP Field Programmable Gate Array (FPGA) IC designed for low-power, high-integration system and consumer applications. It combines a flexible LUT-based logic fabric with embedded block RAM and configurable I/O to deliver compact, energy-efficient programmable logic in a 121‑VFBGA surface‑mount package.

With 7,680 logic elements, approximately 131,072 bits of embedded memory, and programmable I/O features, this device targets low-cost, high-volume designs that require configurable logic, low standby power, and a small PCB footprint. The device supports on-chip nonvolatile configuration memory and standard SPI configuration options for flexible system boot strategies.

Key Features

• Core Logic — 7,680 logic elements provide LUT-based programmable logic resources for glue logic, protocol bridging, and custom control functions.
• Embedded Memory — Approximately 131,072 bits of on-chip RAM (sysMEM™ Embedded Block RAM) for FIFOs, frame buffers, and state storage.
• I/O Capacity & Flexibility — 93 I/O pins with programmable sysIO™ buffers supporting multiple standards including LVCMOS (3.3/2.5/1.8 V) and differential interfaces; programmable pull-up and Schmitt trigger options enhance signal robustness.
• Differential & Source-Synchronous I/O — Programmable low-swing differential I/Os and pre-engineered source-synchronous I/O with DDR registers in I/O cells for high-speed interfacing.
• Clocking & PLLs — Multiple low-skew global clock resources and up to two analog PLLs per device for flexible clock management.
• Low-Power Architecture — Fabricated on an advanced 40 nm low-power process with standby currents as low as 21 μA (family data); optimized for reduced static and dynamic power.
• High-Current LED Drivers — Three high-current drivers suitable for driving three individual LEDs or a single RGB LED for status and user-interface lighting.
• Configuration Options — Supports SRAM configuration via standard SPI interface and internal Nonvolatile Configuration Memory (NVCM) for on-chip configuration storage.
• Package & Mounting — Surface-mount 121‑VFBGA package (supplier device package listed as 121‑UCBGA, 5×5 mm) optimized for compact PCB layouts.
• Operating Range — Industrial-grade operation from −40 °C to 100 °C with a supply voltage range of 1.14 V to 1.26 V.

Typical Applications

• Consumer & System Devices — Low-power programmable logic for control, protocol bridging, and feature customization in consumer electronics and embedded systems.
• LED and User-Interface Control — Integrated high-current LED drivers for multi-LED status indicators or RGB lighting in compact devices.
• High-speed I/O and Interface Bridging — Programmable low-swing differential I/Os and DDR registers in I/O cells enable reliable source-synchronous and differential signal interfacing.
• On-board Memory and Buffering — Embedded block RAM supports FIFO buffering, small frame stores, and temporary data storage for real-time processing tasks.

Unique Advantages

• High logic density in a small package: 7,680 logic elements in a 121‑VFBGA enable complex designs without a large PCB footprint.
• Integrated embedded memory: Approximately 131 kbits of on-chip RAM reduces external memory dependency and simplifies board-level design.
• Flexible, programmable I/O: Wide-ranging I/O standards and programmable low-swing differential support simplify interface integration across voltage domains.
• Low-power operation: 40 nm low-power process and family-level standby figures enable energy-efficient designs where static power matters.
• Built-in configuration options: Internal NVCM plus standard SPI configuration provides deployment flexibility for diverse manufacturing and boot scenarios.
• Industrial temperature support: Rated for −40 °C to 100 °C, suitable for a broad set of industrial and ruggedized environments.

Why Choose ICE40LP8K-CM121TR1K?

The ICE40LP8K-CM121TR1K positions itself as a compact, low-power FPGA solution for designers who need substantial programmable logic, embedded RAM, and flexible I/O in a small surface-mount package. Its combination of 7,680 logic elements, embedded memory, programmable differential I/O, and on-chip configuration options makes it well suited for consumer and system-level applications that require energy-efficient, configurable hardware.

Choose this device when you need a balance of integration, low standby power, and temperature resilience, backed by a family-level ecosystem of design tools and configuration options to streamline development and deployment.

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