ICE40LP640-SWG16TR50

The ICE40LP640-SWG16TR50 is a member of the Lattice iCE40 LP family of ultra-low-power FPGAs. It combines 640 logic elements with approximately 32 Kbits of embedded RAM in a compact 16‑WLCSP (1.40 × 1.48 mm) package suited for space-constrained designs.

Designed for low-cost, high-volume consumer and system applications, this industrial‑grade, surface‑mount FPGA delivers flexible I/O, low standby power characteristics and a small PCB footprint for embedded control, sensor interfacing and compact user‑interface designs.

Key Features

• Core Logic 640 logic elements suitable for glue logic, simple state machines and small custom accelerators.
• Embedded Memory Approximately 32 Kbits of on-chip RAM for buffering, small FIFOs and local storage.
• I/O 10 I/O pins available in the 16‑WLCSP package; family features include programmable low‑swing differential I/Os and flexible sysIO buffering for common interface types.
• Low-Power Architecture Part of the iCE40 LP family built on an advanced low-power process; family-level characteristics include very low standby current to support battery-powered applications.
• Package & Mounting 16‑XFBGA / 16‑WLCSP (1.40 × 1.48 mm) surface-mount package for minimal PCB area and compact system integration.
• Supply & Temperature Operates from 1.14 V to 1.26 V and rated for industrial temperatures from −40 °C to 100 °C.
• Compliance RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Compact user interfaces — Implement simple control logic, input processing and LED/RGB control in space-constrained products using the small WLCSP package and available I/O.
• LED and indicator drivers — Family features include high‑current LED drivers (family-level) suitable for driving multiple LEDs or an RGB LED in portable or consumer devices.
• Sensor interfacing and preprocessing — Low-power operation and programmable I/O make the device suitable for preprocessing sensor signals and handling simple protocol bridging.
• Glue logic and protocol adaptation — 640 logic elements and on-chip RAM enable compact implementations of glue logic, timing adaptation and small buffering tasks in embedded systems.

Unique Advantages

• Compact footprint: The 16‑WLCSP (1.40 × 1.48 mm) package minimizes PCB area for wearable and space-limited designs.
• Low-voltage operation: Narrow supply range (1.14–1.26 V) supports efficient integration with low-voltage power domains.
• Industrial temperature rating: −40 °C to 100 °C qualification supports deployments in extended-temperature environments.
• On-chip RAM and logic: Integrated ~32 Kbits of RAM plus 640 logic elements reduce the need for external memory and discrete glue logic.
• Environmentally compliant: RoHS compliance simplifies regulatory considerations for commercial production.

Why Choose ICE40LP640-SWG16TR50?

The ICE40LP640-SWG16TR50 delivers a balanced combination of compact packaging, low-power family architecture and sufficient logic and memory resources for small to mid-complexity embedded tasks. Its industrial temperature range and WLCSP footprint make it a practical choice for designers building compact, reliable consumer and system-level products that require programmable logic without a large BOM impact.

As a member of the iCE40 LP family, it benefits from family-level low-power features and flexible I/O capabilities, enabling straightforward integration into battery‑sensitive and space-constrained designs while reducing external component count.

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