ICE5LP2K-SG48ITR50
| Part Description |
iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 39 81920 2048 48-VFQFN Exposed Pad |
|---|---|
| Quantity | 205 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 48-QFN (7x7) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 48-VFQFN Exposed Pad | Number of I/O | 39 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 256 | Number of Logic Elements/Cells | 2048 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE5LP2K-SG48ITR50 – iCE40 Ultra™ FPGA, 2,048 logic elements, 48‑VFQFN
The ICE5LP2K-SG48ITR50 is an iCE40 Ultra™ family field programmable gate array (FPGA) from Lattice Semiconductor. It delivers 2,048 logic elements with approximately 80 kbits of embedded memory and a rich set of on-chip peripherals aimed at ultra-low power mobile and sensor-management applications.
Packaged in a 48‑VFQFN exposed pad (48‑QFN, 7×7) and rated for industrial temperature operation, this surface‑mount device targets always‑on sensor interfaces, LED/IR drive functions, and compact embedded designs that require low standby current and tight integration.
Key Features
- Logic Capacity — 2,048 logic elements to implement custom logic, state machines, and peripheral control in a compact FPGA.
- Embedded Memory — Approximately 80 kbits of on‑chip RAM (81,920 bits) for frame buffers, FIFOs, and local data storage.
- On‑chip Interfaces — Hardened SPI and I²C controllers (family feature) to simplify direct sensor and processor interfacing without external controllers.
- Integrated Oscillators — Two on‑chip oscillators (10 kHz LFOSC and 48 MHz HFOSC) to support low‑power always‑on modes and higher‑speed tasks.
- LED and IR Drivers — Embedded RGB PWM outputs with up to 24 mA drive and a 500 mA IR LED drive capability (family feature) to reduce external component count for service LEDs and IR applications.
- DSP and Clocking — On‑chip DSP blocks supporting 8‑ and 16‑bit signed/unsigned multiply/accumulate functions and a PLL for flexible clocking (family feature).
- Power and Supply — Operates from a low core voltage range of 1.14 V to 1.26 V to support low‑power system designs.
- Package and I/O — 39 available I/Os in a 48‑VFQFN exposed pad package (48‑QFN, 7×7) optimized for small PCB area and thermal dissipation.
- Temperature and Reliability — Industrial operating temperature range from −40 °C to 100 °C for deployment in commercial and industrial environments.
- Compliance — RoHS compliant for global electronics manufacturing requirements.
Typical Applications
- Mobile and Handheld Devices — Always‑on sensor management, power‑efficient peripheral control, and compact logic integration in smartphones, tablets, and handhelds.
- Multi‑Sensor Systems — Sensor preprocessing and fusion where local DSP, SPI/I²C interfaces, and embedded memory reduce host processor load.
- Indicator and IR Functions — Service LED control or IR link/emulation using integrated RGB PWM and high‑current IR drive without external MOSFETs.
- Embedded Control and GPIO Expansion — Small‑form programmable I/O expansion, custom protocol bridging, and level‑shifting functions in space‑constrained designs.
Unique Advantages
- Highly integrated feature set: Embedded memory, on‑chip oscillators, hardened SPI/I²C, DSP blocks, and LED/IR drivers reduce external components and BOM complexity.
- Ultra‑low power architecture: Family data shows standby currents as low as 71 μA typical, enabling always‑on applications with minimal power draw.
- Compact, thermally capable package: 48‑VFQFN exposed pad (7×7) provides a small PCB footprint with improved heat dissipation for continuous operation.
- Industrial temperature range: −40 °C to 100 °C rating supports deployment across commercial and industrial environments.
- Flexible clocking and DSP support: On‑chip LFOSC/HFOSC, PLL, and DSP MAC functions enable efficient local processing and timing without extensive external circuitry.
Why Choose ICE5LP2K-SG48ITR50?
The ICE5LP2K-SG48ITR50 is positioned as a highly integrated, low‑power FPGA solution for designers who need compact programmable logic with on‑chip peripherals and drivers. With 2,048 logic elements, approximately 80 kbits of embedded RAM, hardened serial interfaces, and dedicated LED/IR drive capabilities, it simplifies designs that require sensor management, LED/IR control, and local signal preprocessing.
Its industrial temperature rating, low core voltage range, and RoHS compliance make it suitable for reliable, production‑grade embedded systems. As part of the iCE40 Ultra family, this device offers a balanced combination of integration and power efficiency for teams building space‑constrained, always‑on, or sensor‑centric products.
Request a quote or submit an inquiry to get pricing and availability for ICE5LP2K-SG48ITR50 and to discuss how it fits your next embedded design.