ICE5LP2K-SG48ITR

IC FPGA 39 I/O 48QFN
Part Description

iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 39 81920 2048 48-VFQFN Exposed Pad

Quantity 1,642 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package48-QFN (7x7)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case48-VFQFN Exposed PadNumber of I/O39Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs256Number of Logic Elements/Cells2048
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of ICE5LP2K-SG48ITR – iCE40 Ultra FPGA, 2,048 logic elements, 48‑VFQFN

The ICE5LP2K-SG48ITR is an iCE40 Ultra™ family field programmable gate array (FPGA) in a 48‑VFQFN exposed pad package. The device combines 2,048 logic elements with embedded RAM and integrated peripherals to address ultra‑low power mobile and embedded sensor-management applications.

Designed for compact, low-power systems, the device targets use cases such as always‑on sensors, sensor pre‑processing, user interface functions and other handheld or industrial embedded designs where small form factor, low supply voltage, and extended operating temperature are required.

Key Features

  • Logic Capacity — 2,048 logic elements suitable for moderate-density FPGA functions and control logic.
  • Embedded Memory — 81,920 total RAM bits (approximately 80 kbits) for local data buffering and state storage.
  • I/O — 39 general-purpose I/O pins to interface with sensors, processors and peripherals.
  • On‑chip Peripherals — Family-level features include hardened SPI and I²C controllers, two on‑chip oscillators (10 kHz LFOSC and 48 MHz HFOSC), RGB LED outputs and a high-current IR LED driver.
  • On‑chip DSP — DSP functional blocks for signed/unsigned 8‑bit and 16‑bit operations including multiplier, accumulator and MAC to off‑load processing from a host processor.
  • Clocking — Flexible on‑chip clocking resources including global signal resources and one PLL with dynamic interface (family-level feature).
  • Power Supply — Low-voltage operation with supply range from 1.14 V to 1.26 V for core logic.
  • Package & Mounting — 48‑VFQFN exposed pad (Supplier Device Package: 48‑QFN, 7×7 mm); surface-mount package for compact board designs.
  • Temperature & Grade — Industrial grade with operating temperature from −40°C to 100°C for robust deployment in field and industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Mobile and Handheld Devices — Implement sensor interfacing, low‑power control and simple preprocessing tasks in smartphones, tablets and consumer handhelds.
  • Always‑On Sensor Management — Manage and preprocess sensor streams using low-frequency oscillator and low standby current for always‑on functions.
  • Sensor Fusion & Pre‑processing — Use on‑chip DSP and embedded RAM to perform local filtering, accumulation and data formatting before forwarding to an application processor.
  • LED and IR Control — Directly drive service LEDs or IR emitters using integrated RGB outputs and a high‑current IR driver for indicator or infrared communication functions.
  • Industrial Handheld Instruments — Compact FPGA functions and industrial temperature range enable control and interface roles in portable industrial devices.

Unique Advantages

  • Ultra‑low power architecture: Family‑level 40 nm low power process and typical standby current as low as 71 μA minimize impact on battery‑powered systems.
  • Integrated interfaces and peripherals: Hardened SPI and I²C controllers, oscillators and LED/IR drivers reduce BOM and simplify board design.
  • On‑chip DSP acceleration: Built‑in DSP blocks enable local signal processing and off‑load of repetitive math operations from the host MCU or application processor.
  • Compact surface‑mount package: 48‑VFQFN (7×7 mm) exposed pad package supports high‑density PCB layouts and thermal management in small form factors.
  • Industrial temperature range: −40°C to 100°C operating range supports deployment in a wide variety of field and industrial environments.
  • RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose ICE5LP2K-SG48ITR?

The ICE5LP2K-SG48ITR brings the iCE40 Ultra family attributes—low power, integrated peripherals, compact packaging and DSP acceleration—into a 2,048‑logic‑element FPGA ideal for embedded sensor management, LED/IR control and compact system logic. Its low core voltage and small QFN footprint make it a practical choice where board space, power budget and thermal characteristics are constrained.

This device is positioned for designers building mobile, handheld and industrial embedded systems who need a tightly integrated FPGA with modest logic capacity, embedded RAM and family‑level features for sensor interfacing and low‑power operation. The combination of industrial temperature rating and RoHS compliance supports reliable, manufacturable designs with predictable long‑term value.

Request a quote or submit an inquiry to purchase the ICE5LP2K-SG48ITR or to get additional ordering and availability information.

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