ICE5LP1K-UWG20ITR50
| Part Description |
iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 12 65536 1100 20-UFBGA, WLCSP |
|---|---|
| Quantity | 778 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 20-WLCSP (1.71x2.06) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 20-UFBGA, WLCSP | Number of I/O | 12 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 138 | Number of Logic Elements/Cells | 1100 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of ICE5LP1K-UWG20ITR50 – iCE40 Ultra™ FPGA, 1100 logic elements, 20-WLCSP
The ICE5LP1K-UWG20ITR50 is an iCE40 Ultra™ series ultra‑low power field programmable gate array (FPGA) in a 20‑ball WLCSP package. It integrates programmable logic and on‑chip peripherals targeted at mobile and handheld sensor management and edge preprocessing tasks.
With 1,100 logic elements, 65,536 bits of embedded RAM, hardened SPI/I²C blocks, on‑chip oscillators and LED/IR drivers, this device is positioned for compact, low‑power designs that require peripheral integration and industrial temperature capability.
Key Features
- Programmable Logic — 1,100 logic elements for implementing custom control, signal processing, and interface logic.
- Embedded Memory — 65,536 bits (64 kbits) of on‑chip RAM for local data buffering and state storage.
- I/O and Peripherals — 12 programmable I/O pins and hardened interfaces within the iCE40 Ultra family, including SPI and I²C controllers for direct sensor and host connectivity.
- On‑chip Oscillators & Clocking — Integrated low‑frequency and high‑frequency oscillators for always‑on and active tasks, plus flexible global clock resources and one PLL per device as described for the family.
- LED / IR Drivers — Family includes RGB PWM outputs with user‑selectable sink currents and a high‑current IR LED sink for direct LED drive and IR applications.
- On‑chip DSP — DSP functional block options within the family for signed/unsigned 8‑ or 16‑bit operations (multiplier, accumulator, MAC) to offload preprocessing tasks.
- Low Power Process — Built on an ultra‑low power 40 nm process; family data shows very low standby currents for always‑on use cases.
- Package & Form Factor — 20‑WLCSP (1.71 × 2.06 mm) surface‑mount package for minimal PCB area and compact system integration.
- Voltage & Temperature — Supply voltage range 1.14 V to 1.26 V and rated operating temperature −40 °C to 100 °C for industrial environments.
- Regulatory Status — RoHS compliant.
Typical Applications
- Mobile and Handheld Devices — Sensor management, LED/IR control and low‑power companion logic in smartphones, tablets and consumer handhelds.
- Always‑On Sensor Modules — Low current standby and on‑chip oscillators enable efficient wake/sleep sensor monitoring and preprocessing.
- Multi‑Sensor Fusion — On‑chip DSP and embedded RAM support preprocessing and aggregation of sensor data before passing to a host processor.
- Industrial Handhelds and Commercial Devices — Compact WLCSP package and industrial temperature rating allow integration into space‑constrained, temperature‑variable products.
Unique Advantages
- Highly integrated peripheral set — Hardened SPI and I²C controllers, oscillators, LED/IR drivers and DSP blocks reduce external component count and simplify designs.
- Ultra‑small footprint — 20‑ball WLCSP (1.71 × 2.06 mm) package minimizes PCB area for dense, compact products.
- Low‑power architecture — 40 nm ultra‑low power process and family standby current figures support always‑on and battery‑sensitive applications.
- Industrial temperature range — Rated from −40 °C to 100 °C for reliable operation across a wide range of environments.
- On‑chip preprocessing capability — Embedded RAM and DSP functions enable local data handling that can reduce host processor load and system power.
- Reduced BOM and design complexity — Integrated drivers and interfaces allow direct connection to LEDs and sensors without separate driver components in many designs.
Why Choose ICE5LP1K-UWG20ITR50?
The ICE5LP1K-UWG20ITR50 combines the iCE40 Ultra family’s ultra‑low power architecture with a compact 20‑WLCSP package and industrial temperature rating, making it suitable for designs that demand small size, integrated peripherals and reliable operation across temperature extremes. Its 1,100 logic elements, 65,536 bits of embedded RAM, and family features such as hardened SPI/I²C, on‑chip oscillators, DSP resources and LED/IR drive capability let engineers implement sensor management, preprocessing and LED/IR interfaces with fewer external components.
This device is a fit for engineers building compact mobile, handheld and industrial products who need low power, integrated peripherals and a minimal PCB footprint while maintaining flexibility through programmable logic.
Request a quote or submit an inquiry to receive pricing, availability and technical assistance for the ICE5LP1K-UWG20ITR50.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016