ICE5LP2K-CM36ITR50
| Part Description |
iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 2048 36-VFBGA |
|---|---|
| Quantity | 375 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 36-UCFBGA (2.5x2.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-VFBGA | Number of I/O | 26 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 256 | Number of Logic Elements/Cells | 2048 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE5LP2K-CM36ITR50 – iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 2048 36-VFBGA
The ICE5LP2K-CM36ITR50 is an iCE40 Ultra™ family ultra‑low power FPGA from Lattice Semiconductor Corporation. It provides a compact, highly integrated programmable logic element with 2,048 logic elements and embedded memory for sensor management and low‑power mobile and industrial applications.
Built on an ultra‑low power architecture, the device integrates hardened SPI and I2C controllers, on‑chip oscillators, DSP resources and LED/IR drivers to reduce external components and simplify system design.
Key Features
- Core Logic 2,048 logic elements for implementing custom logic and control functions in a small FPGA footprint.
- Embedded Memory 81,920 total RAM bits (approximately 80 kbits) of on‑chip memory to support buffering, state storage and small data tables.
- Interfaces Hardened SPI and I2C blocks plus up to 26 I/Os that can be used as dedicated interfaces or general‑purpose I/O for sensors and host processors.
- On‑Chip Oscillators & Clocking Includes low‑frequency (10 kHz) and high‑frequency (48 MHz) on‑chip oscillators and flexible clock resources for always‑on and active modes.
- LED and IR Drive Integrated RGB PWM with three 24 mA constant‑current outputs and a 500 mA IR LED driver for direct LED interfacing without external MOSFETs or buffers.
- DSP Capabilities On‑chip DSP block supporting signed/unsigned 8‑bit and 16‑bit multiply, accumulate and MAC functions for sensor pre‑processing.
- Power and Supply Operates from a 1.14 V to 1.26 V supply range and is built on a 40 nm ultra‑low power process optimized for low standby currents.
- Package & Mounting 36‑VFBGA (supplier device package: 36‑UCFBGA, 2.5 mm × 2.5 mm), surface mount for compact board designs.
- Temperature Grade Industrial operating temperature range from −40 °C to 100 °C for robust operation across a wide set of environments.
- Compliance RoHS compliant.
Typical Applications
- Smartphones & Mobile Devices Always‑on sensor management, level shifting and pre‑processing tasks using on‑chip oscillators and low standby current.
- Tablets & Handheld Devices Peripheral interfacing, RGB status LED control and sensor aggregation using integrated SPI/I2C and LED drivers.
- Industrial Handhelds & Commercial Devices Compact programmable logic for sensor fusion, I/O expansion and control logic within industrial temperature ranges.
- Sensor Pre‑processing and Sensor Fusion Use DSP resources and embedded memory to offload filtering and pre‑processing from the application processor.
Unique Advantages
- Highly integrated solution: Embedded memory, DSP, hardened SPI/I2C and LED/IR drivers reduce bill of materials and external components.
- Ultra‑low power operation: 40 nm low power process and low standby current characteristics enable always‑on and battery‑sensitive designs.
- Direct LED and IR drive: Three 24 mA RGB outputs and a 500 mA IR driver provide direct drive capability for status LEDs and IR functions.
- Compact package: 36‑UCFBGA (2.5 mm × 2.5 mm) surface‑mount package minimizes PCB area for space‑constrained products.
- Industrial temperature rating: −40 °C to 100 °C operating range supports demanding environmental conditions.
- Flexible I/O and clocking: 26 I/Os plus on‑chip oscillators and PLL/clock resources simplify timing and interface design.
Why Choose ICE5LP2K-CM36ITR50?
The ICE5LP2K-CM36ITR50 delivers a balance of integration, low power and small form factor for designs that require compact programmable logic with built‑in interface and driver capabilities. Its 2,048 logic elements, approximately 80 kbits of embedded memory and DSP resources make it suitable for off‑loading sensor processing and handling peripheral control tasks.
With industrial temperature support, integrated SPI/I2C, on‑chip oscillators and direct LED/IR drive, this device is targeted at designers building mobile, handheld and industrial sensor applications who need a reliable, space‑efficient FPGA backed by Lattice Semiconductor Corporation.
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Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016