LAV-AT-500E-2CSG676C

IC FPGA AVANT 477KLC 676BGA
Part Description

Avant-E Field Programmable Gate Array (FPGA) IC 312 4239360 477000 676-BGA, FCCSPBGA

Quantity 576 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCCSP (15x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGA, FCCSPBGANumber of I/O312Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells477000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-500E-2CSG676C – Avant-E Field Programmable Gate Array (FPGA), 676-FCCSP BGA, 312 I/O

The LAV-AT-500E-2CSG676C is an Avant‑E platform FPGA IC offered in a 676‑FCCSP (15×13) package. It provides a large programmable fabric with 477,000 logic elements and approximately 4.24 Mbits of embedded memory, combined with 312 general-purpose I/O pins for complex system integration. Documented platform features include on‑chip PLLs and internal oscillators, comprehensive sysI/O electrical characteristics, and hardened PCIe building blocks.

Key Features

  • Logic Capacity — 477,000 logic elements for implementing large-scale programmable logic and custom hardware acceleration.
  • Embedded Memory — Approximately 4.24 Mbits of on‑chip RAM to support buffering, packet processing, and state storage.
  • Rich I/O — 312 I/O pins documented with detailed sysI/O single‑ended and differential electrical characteristics.
  • High‑speed Interface Support — Datasheet includes hardened PCIe characteristics covering 2.5 Gbps, 5 Gbps, 8 Gbps and 16 Gbps operation.
  • Differential I/O Standards — sysI/O differential interfaces and characteristics are documented for LVDS, LVDSE, SubLVDS/SubLVDSE, SLVS, Soft MIPI D‑PHY and other differential outputs.
  • Clocking and Timing — On‑chip PLLs, sysCLOCK PLL timing, and internal oscillator characteristics are provided for system timing and clock generation.
  • Signal Integrity and Termination — On‑chip programmable termination and detailed switching/DC characteristics assist board‑level signal integrity design.
  • Electrical and ESD Data — DC and switching characteristics, absolute maximum ratings, recommended operating conditions, and ESD performance are documented.
  • Power Supply — Device supply shown as 820 mV in specifications.
  • Package and Mounting — 676‑BGA / FCCSPBGA package (supplier device package: 676‑FCCSP (15×13)); surface‑mount mounting type.
  • Commercial Grade — Operating temperature range 0 °C to 85 °C; grade listed as Commercial.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • Networking and Data Transport — Implement packet processing, protocol offload, and PCIe endpoints using the documented hardened PCIe characteristics and abundant logic resources.
  • High‑speed Serial Interfaces — Leverage documented sysI/O differential standards (LVDS, MIPI D‑PHY, SLVS, etc.) for camera interfaces, serializers/deserializers, and board‑level high‑speed links.
  • Compute Acceleration — Deploy custom accelerators, data path logic, and buffering with large logic element count and multiple Mbits of embedded RAM.
  • System Control and Glue Logic — Use flexible I/O and programmable logic to integrate device control, protocol bridging, and timing generation across complex PCBs.

Unique Advantages

  • Substantial Logic Density: 477,000 logic elements enable extensive custom logic, parallel datapaths, and hardware accelerators without external ASICs.
  • Significant On‑chip Memory: Approximately 4.24 Mbits of embedded RAM reduces the need for external buffering and simplifies memory architecture.
  • Comprehensive I/O Documentation: Detailed sysI/O electrical and timing specifications support robust signal‑integrity design and fast system bring‑up.
  • High‑speed Interface Support: Hardened PCIe characteristics up to 16 Gbps allow integration into high‑throughput data paths with documented timing and physical characteristics.
  • Integrated Clocking Resources: On‑chip PLLs and internal oscillators provide flexible clocking options documented in the platform datasheet.
  • Manufacturing‑friendly Package: 676‑FCCSP (15×13) surface‑mount package provides a compact, high‑density footprint for space‑constrained boards.

Why Choose LAV-AT-500E-2CSG676C?

The LAV-AT-500E-2CSG676C positions itself as a high‑capacity, commercially graded FPGA for designs that require extensive programmable logic, embedded memory, and a wide range of documented I/O and high‑speed interfaces. Its combination of logic density, on‑chip RAM, and comprehensive electrical and timing documentation make it a practical option for networking, compute acceleration, and complex system integration.

Designed for engineers who need verifiable specifications for signal integrity, clocking, and high‑speed interfaces, this Avant‑E device offers the documented data required for confident hardware design and system validation.

Request a quote or submit a procurement inquiry to begin pricing and availability for the LAV-AT-500E-2CSG676C.

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