LAV-AT-500E-1LFG676I

IC FPGA AVANT 477KLC 676BGA
Part Description

Avant-E Field Programmable Gate Array (FPGA) IC 312 4239360 477000 676-BBGA, FCBGA

Quantity 898 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O312Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells477000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-500E-1LFG676I – Avant-E FPGA, 477,000 logic elements, 312 I/O

The LAV-AT-500E-1LFG676I is an Avant-E Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, configured in a 676‑FCBGA (27×27) surface-mount package. It provides high-density programmable logic, substantial embedded memory, and a broad set of I/O for demanding industrial applications.

With 477,000 logic elements, approximately 4.24 Mbits of embedded memory and 312 I/O pins, this industrial-grade FPGA is positioned for designs that require dense logic integration, multi-standard I/O support and on-chip high-speed interface capabilities described in the device datasheet.

Key Features

  • High-density Logic — 477,000 logic elements for implementing complex digital functions and large-scale programmable designs.
  • Embedded Memory — Approximately 4.24 Mbits of on-chip RAM to support buffering, state storage and local data processing.
  • Extensive I/O — 312 I/O pins to support broad connectivity needs in multi-channel and multi-protocol systems.
  • Package and Mounting — 676‑FCBGA (27×27) package in a surface-mount form factor suitable for compact PCB designs.
  • Industrial Temperature Range — Rated for -40 °C to 100 °C operation to meet industrial environment requirements.
  • Power Supply — Voltage supply specified at 820 mV per product data.
  • Platform-Level I/O and Interface Support — Datasheet details sysI/O support including LVDS, SubLVDS, SLVS, soft MIPI D-PHY and other differential standards, plus on-chip programmable termination options.
  • Hardened PCIe Characteristics — Datasheet includes hardened PCIe support with characteristics documented for 2.5, 5, 8 and 16 Gbps link rates.
  • Detailed Electrical and Timing Data — Comprehensive datasheet coverage of DC/switching characteristics, PLLs, internal oscillators, power sequencing, ESD performance and recommended operating conditions.
  • Regulatory — RoHS compliant.

Typical Applications

  • Industrial Automation — Dense logic and robust temperature range support control systems, motor drives and factory automation where reliable programmability is required.
  • Communications & Networking — Hardened PCIe capabilities and abundant I/O make the device suitable for interface aggregation, packet processing and interconnect bridging.
  • Video and Imaging Systems — Support for LVDS, SubLVDS and MIPI D-PHY (soft) enables high-speed sensor interfaces and video processing front ends.
  • Data Acquisition & Control — Large embedded RAM and ample I/O allow for local buffering, sensor interfacing and real-time control tasks in industrial measurement systems.

Unique Advantages

  • High integration density: 477,000 logic elements reduce the need for multi-device implementations when consolidating functions onto a single FPGA.
  • On-chip memory for local processing: Approximately 4.24 Mbits of embedded RAM supports buffering and stateful logic without external memory.
  • Versatile I/O ecosystem: 312 I/O pins and documented support for multiple differential standards allow flexible system interfacing and protocol support.
  • Industrial readiness: Specified operation from -40 °C to 100 °C and a 676‑FCBGA surface-mount package facilitate deployment in harsh environments and compact assemblies.
  • Platform documentation: Datasheet provides detailed electrical, timing and interface guidance including PLLs, power-sequencing and ESD information to support robust system-level design.
  • RoHS compliant: Meets lead-free and hazardous-substance requirements for modern electronics manufacturing.

Why Choose LAV-AT-500E-1LFG676I?

The LAV-AT-500E-1LFG676I delivers a combination of high logic capacity, meaningful on-chip memory and rich I/O capability in a compact 676‑FCBGA package rated for industrial temperatures. The included platform-level documentation—covering I/O standards, hardened PCIe characteristics, PLLs and power sequencing—supports engineering teams in implementing high-performance, reliable systems.

This device is well suited to customers seeking a single-chip programmable solution for complex control, connectivity or signal-processing designs where density, documented interface behavior and industrial thermal range are important considerations.

Request a quote or submit an RFQ to obtain pricing, availability and lead-time information for the LAV-AT-500E-1LFG676I. Technical datasheet materials are available for detailed design planning and system integration.

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