LAV-AT-500E-1LFG676I
| Part Description |
Avant-E Field Programmable Gate Array (FPGA) IC 312 4239360 477000 676-BBGA, FCBGA |
|---|---|
| Quantity | 898 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 312 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 477000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-500E-1LFG676I – Avant-E FPGA, 477,000 logic elements, 312 I/O
The LAV-AT-500E-1LFG676I is an Avant-E Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, configured in a 676‑FCBGA (27×27) surface-mount package. It provides high-density programmable logic, substantial embedded memory, and a broad set of I/O for demanding industrial applications.
With 477,000 logic elements, approximately 4.24 Mbits of embedded memory and 312 I/O pins, this industrial-grade FPGA is positioned for designs that require dense logic integration, multi-standard I/O support and on-chip high-speed interface capabilities described in the device datasheet.
Key Features
- High-density Logic — 477,000 logic elements for implementing complex digital functions and large-scale programmable designs.
- Embedded Memory — Approximately 4.24 Mbits of on-chip RAM to support buffering, state storage and local data processing.
- Extensive I/O — 312 I/O pins to support broad connectivity needs in multi-channel and multi-protocol systems.
- Package and Mounting — 676‑FCBGA (27×27) package in a surface-mount form factor suitable for compact PCB designs.
- Industrial Temperature Range — Rated for -40 °C to 100 °C operation to meet industrial environment requirements.
- Power Supply — Voltage supply specified at 820 mV per product data.
- Platform-Level I/O and Interface Support — Datasheet details sysI/O support including LVDS, SubLVDS, SLVS, soft MIPI D-PHY and other differential standards, plus on-chip programmable termination options.
- Hardened PCIe Characteristics — Datasheet includes hardened PCIe support with characteristics documented for 2.5, 5, 8 and 16 Gbps link rates.
- Detailed Electrical and Timing Data — Comprehensive datasheet coverage of DC/switching characteristics, PLLs, internal oscillators, power sequencing, ESD performance and recommended operating conditions.
- Regulatory — RoHS compliant.
Typical Applications
- Industrial Automation — Dense logic and robust temperature range support control systems, motor drives and factory automation where reliable programmability is required.
- Communications & Networking — Hardened PCIe capabilities and abundant I/O make the device suitable for interface aggregation, packet processing and interconnect bridging.
- Video and Imaging Systems — Support for LVDS, SubLVDS and MIPI D-PHY (soft) enables high-speed sensor interfaces and video processing front ends.
- Data Acquisition & Control — Large embedded RAM and ample I/O allow for local buffering, sensor interfacing and real-time control tasks in industrial measurement systems.
Unique Advantages
- High integration density: 477,000 logic elements reduce the need for multi-device implementations when consolidating functions onto a single FPGA.
- On-chip memory for local processing: Approximately 4.24 Mbits of embedded RAM supports buffering and stateful logic without external memory.
- Versatile I/O ecosystem: 312 I/O pins and documented support for multiple differential standards allow flexible system interfacing and protocol support.
- Industrial readiness: Specified operation from -40 °C to 100 °C and a 676‑FCBGA surface-mount package facilitate deployment in harsh environments and compact assemblies.
- Platform documentation: Datasheet provides detailed electrical, timing and interface guidance including PLLs, power-sequencing and ESD information to support robust system-level design.
- RoHS compliant: Meets lead-free and hazardous-substance requirements for modern electronics manufacturing.
Why Choose LAV-AT-500E-1LFG676I?
The LAV-AT-500E-1LFG676I delivers a combination of high logic capacity, meaningful on-chip memory and rich I/O capability in a compact 676‑FCBGA package rated for industrial temperatures. The included platform-level documentation—covering I/O standards, hardened PCIe characteristics, PLLs and power sequencing—supports engineering teams in implementing high-performance, reliable systems.
This device is well suited to customers seeking a single-chip programmable solution for complex control, connectivity or signal-processing designs where density, documented interface behavior and industrial thermal range are important considerations.
Request a quote or submit an RFQ to obtain pricing, availability and lead-time information for the LAV-AT-500E-1LFG676I. Technical datasheet materials are available for detailed design planning and system integration.