LAV-AT-500E-1LFG1156C

The LAV-AT-500E-1LFG1156C is an Avant-E platform FPGA device from Lattice Semiconductor. It combines a high logic element count with substantial on-chip RAM and a very large I/O complement in a compact 1156-ball BGA package, targeted at commercial-grade embedded designs.

This device is supplied in a 1156-FPBGA (35×35) package, supports surface-mount assembly, and ships RoHS compliant. The Avant platform datasheet provides detailed electrical and timing specifications, including sysI/O characteristics, PLL and oscillator behavior, power sequencing, and hardened PCIe capability documented at the platform level.

Key Features

• Logic Capacity  Approximately 477,000 logic elements for implementing complex logic, control and datapath functions.
• Embedded Memory  Approximately 4.24 Mbits of embedded RAM (4,239,360 bits) to support frame buffers, FIFOs and on-chip data storage.
• High I/O Count  572 general-purpose I/Os to support extensive board-level interfacing and parallel bus connectivity.
• Package & Mounting  1156-BBGA footprint (supplier package: 1156-FPBGA, 35×35) designed for surface-mount assembly on modern PCBs.
• Power Supply  Designed around a specified supply point of 820 mV (documented as 820 mV to 820 mV in product data).
• Operating Conditions  Commercial temperature range: 0 °C to 85 °C, suitable for standard commercial embedded applications.
• Platform-Level Capabilities  Avant platform specifications included in the datasheet cover sysI/O electricals, programmable terminations, PLL/oscillator timing, power sequencing, ESD performance, and hardened PCIe characteristics at the platform level.
• Compliance  RoHS compliant for environmental regulatory alignment.

Typical Applications

• High-density I/O systems  Large I/O count (572 pins) supports systems that require many external interfaces or parallel connections.
• On-chip data buffering  Approximately 4.24 Mbits of embedded RAM enables local buffering, FIFOs and intermediate data storage for datapath designs.
• Complex logic and control  Approximately 477k logic elements accommodate sizable custom logic, state machines and processing pipelines.
• Compact FPGA integration  1156-BBGA packaging offers a high-density solution for space-constrained PCBs requiring surface-mount assembly.

Unique Advantages

• High logic density: The device’s ~477k logic elements allow designers to consolidate complex functions into a single FPGA, reducing board-level component count.
• Substantial embedded memory: Approximately 4.24 Mbits of on-chip RAM supports local buffering and on-chip data processing without immediate external memory dependence.
• Extensive I/O capability: 572 I/Os enable broad peripheral connectivity and flexible system partitioning for multi-interface designs.
• Compact, manufacturable package: 1156-FPBGA (35×35) in a surface-mount form factor simplifies assembly for modern production flows.
• Platform-level documentation: Avant platform datasheet provides detailed electrical and timing specifications, aiding design verification and system integration.
• RoHS compliant: Environmentally compliant manufacturing and supply chain compatibility.

Why Choose LAV-AT-500E-1LFG1156C?

The LAV-AT-500E-1LFG1156C positions itself as a high-capacity, commercially graded FPGA for designs that need significant logic resources, on-chip memory, and a very large I/O count in a compact BGA package. Its documented Avant platform specifications provide the electrical, timing and system-level information necessary for engineering evaluation and integration.

This device is suitable for teams seeking a single-chip solution to consolidate complex logic and buffering needs while maintaining a compact board footprint and standard commercial operating temperature range. The combination of logic density, embedded RAM and I/O flexibility supports scalable development and streamlined BOMs.

If you would like pricing, lead-time or availability information, request a quote or submit an inquiry and our team will respond with details to support your procurement and design planning.