LAV-AT-300E-3LFG676C

The LAV-AT-300E-3LFG676C is an Avant‑E Field Programmable Gate Array (FPGA) IC supplied in a 676‑FCBGA (27×27) package. It delivers a high logic density and substantial on‑chip memory for designs that require large programmable logic resources and plentiful I/O connectivity.

Targeted at commercial‑grade applications, this device combines approximately 306,000 logic elements, roughly 2.72 Mbits of embedded memory, and 312 I/O pins to address complex control, data‑processing and interface aggregation use cases while complying with RoHS requirements.

Key Features

• Core Logic: Approximately 306,000 logic elements (cells) to implement large programmable logic designs and complex finite state machines.
• Embedded Memory: Approximately 2.72 Mbits of total on‑chip RAM bits for buffering, lookup tables and local data storage.
• I/O Capacity: 312 general I/O pins to support multiple high‑pin‑count interfaces and parallel signal routing.
• Package & Mounting: 676‑BBGA / 676‑FCBGA package (supplier device package 676‑FCBGA, 27×27) designed for surface‑mount assembly.
• Power Supply: Specified voltage supply of 820 mV (documented range 820 mV to 820 mV) for core operation.
• Operating Conditions: Commercial grade operating temperature range of 0 °C to 85 °C.
• Regulatory & Environmental: RoHS‑compliant construction.
• Documentation: Detailed electrical and timing specifications are available in the Lattice Avant Platform data sheet included with the product resources.

Typical Applications

• High‑density logic systems: Implement complex digital logic and custom accelerators using the device’s large logic element count and embedded RAM.
• Interface aggregation: Consolidate multiple parallel and serial interfaces using the 312 available I/O pins for board‑level integration.
• Prototyping and development platforms: Use as a programmable hardware platform where sizable logic and memory resources are required for iterative design cycles.
• Commercial embedded systems: Deploy in consumer and commercial products needing substantial programmable logic within a surface‑mount, high‑pin‑count package.

Unique Advantages

• High logic density: Approximately 306,000 logic elements enable implementation of large, integrated digital functions on a single device, reducing external component count.
• Significant on‑chip memory: About 2.72 Mbits of embedded RAM supports local buffering and data‑path acceleration without needing extensive external memory.
• Extensive I/O capability: 312 I/O pins allow flexible partitioning of interfaces and direct connections to multiple peripherals or subsystems.
• Compact, manufacturable package: 676‑FCBGA (27×27) surface‑mount package provides a high pin count in a board‑friendly form factor for automated assembly.
• Commercial operating range: Rated for 0 °C to 85 °C to meet a wide range of commercial deployment environments.
• RoHS compliance: Environmentally compliant construction for installations requiring hazardous‑substance adherence.

Why Choose LAV-AT-300E-3LFG676C?

The LAV-AT-300E-3LFG676C positions itself as a high‑capacity, commercially rated FPGA option for designs that demand significant programmable logic, embedded memory, and extensive I/O in a single surface‑mount package. Its combination of approximately 306,000 logic elements, roughly 2.72 Mbits of on‑chip RAM, and 312 I/O pins enables consolidation of complex functions and interfaces, supporting simplified BOM and board‑level integration.

This device is suitable for design teams building commercial embedded systems, interface aggregation platforms, and advanced prototype hardware. The Lattice Avant Platform data sheet provides detailed electrical, timing and configuration guidance to support system integration and verification.

Request a quote or submit an inquiry for LAV-AT-300E-3LFG676C to get pricing, availability and ordering details for your next design.