LAV-AT-300E-3LFG676I

The LAV-AT-300E-3LFG676I is an Avant-E FPGA device from Lattice Semiconductor, delivered in a 676-FCBGA (27×27) package for surface-mount assembly. It provides a high logic capacity and substantial on-chip memory for demanding programmable-logic implementations.

With 306,000 logic elements, approximately 2.72 Mbits of embedded memory, 312 I/Os, an industrial operating range (‑40°C to 100°C), and a core supply of 820 mV, this device targets designs that require dense logic, flexible I/O routing, and extended temperature operation.

Key Features

• Logic Capacity — 306,000 logic elements to implement complex digital functions and custom processing pipelines.
• Embedded Memory — Approximately 2.72 Mbits of on-chip RAM for packet buffers, FIFOs, and working memory.
• I/O Resources — 312 user I/O pins to support multiple interfaces and board-level connectivity.
• Package & Mounting — 676-FCBGA (27×27) package, 676-BBGA footprint; surface-mount mounting for compact board integration.
• Industrial Temperature Range — Rated for operation from ‑40°C to 100°C to meet extended-environment requirements.
• Supply Voltage — Core voltage specified at 820 mV.
• Compliance — RoHS compliant.
• Platform-Level Specifications (Avant datasheet) — The Avant platform datasheet documents device-level details including DC/switching characteristics, PLLs and internal oscillators, sysI/O differential standards, and hardened PCIe characteristics across multiple data rates.

Typical Applications

• High-performance interface bridging — Use the device’s large logic capacity and 312 I/Os to implement protocol translation and multi‑port bridging functions.
• Packet processing and networking — Embedded memory and extensive logic resources support buffering, packet parsing, and hardware-accelerated processing.
• Custom compute and acceleration — Leverage the device’s logic and memory resources for bespoke hardware accelerators and deterministic processing tasks.

Unique Advantages

• High logic density: 306,000 logic elements enable implementation of large-scale FPGA designs without external logic expansion.
• Substantial on-chip RAM: Approximately 2.72 Mbits of embedded memory reduces dependence on external RAM for temporary storage and buffering.
• Generous I/O count: 312 I/Os provide flexibility for multi-interface designs and board-level integration.
• Industrial robustness: Rated for ‑40°C to 100°C operation to support extended-temperature deployments.
• Compact FCBGA packaging: 676-FCBGA (27×27) balances pin count and board footprint for high-density systems.
• Documented platform-level features: The Avant datasheet provides detailed electrical, timing, and interface specifications to support design and validation work.

Why Choose LAV-AT-300E-3LFG676I?

The LAV-AT-300E-3LFG676I combines a large logic fabric, significant embedded memory, and a high I/O count in a compact 676-FCBGA package, making it suited for complex, space-constrained FPGA designs that must operate across a wide temperature range. Its documented Avant platform specifications give engineering teams access to detailed electrical and timing information needed for robust implementation.

This device is positioned for customers seeking a scalable, high-capacity FPGA building block supported by Lattice’s Avant platform documentation, enabling integration into systems that require dense programmable logic and flexible I/O in industrial environments.

Request a quote or submit an inquiry for pricing and availability for the LAV-AT-300E-3LFG676I to discuss lead times and ordering options.