LAV-AT-300E-3LFG1156I
| Part Description |
Avant-E Field Programmable Gate Array (FPGA) IC 468 2723840 306000 1156-BBGA |
|---|---|
| Quantity | 1,930 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 468 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 306000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-300E-3LFG1156I – Avant-E Field Programmable Gate Array (FPGA) IC
The LAV-AT-300E-3LFG1156I is an Avant‑E FPGA IC from Lattice Semiconductor designed for high-density, industrial-grade programmable logic applications. It delivers a large logic fabric, substantial embedded memory, and a high I/O count in a compact 1156‑BBGA surface‑mount package, making it suitable for complex system interfacing and industrial control designs.
Key Features
- Core Logic — 306,000 logic elements provide significant programmable logic capacity for complex control, signal processing, and glue‑logic implementations.
- Embedded Memory — Approximately 2.72 Mbits of embedded memory for on‑chip buffering, state storage, and intermediate data handling.
- I/O Density — 468 I/O pins support high‑pin‑count designs and extensive external interfacing without external I/O expanders.
- Package & Mounting — 1156‑BBGA package (supplier device package: 1156‑FPBGA, 35 × 35 mm) with surface‑mount mounting type for compact board integration.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
- Voltage Supply — Documented voltage supply at 820 mV.
- Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.
Typical Applications
- Industrial Control — Use the high logic capacity and industrial temperature rating for real‑time control, motion systems, and automation interfaces.
- Communications & Networking — Leverage the large I/O count for multi‑lane interfaces, protocol bridging, and packet processing front‑end functions.
- Sensor and Data Aggregation — Aggregate and pre‑process data from numerous sensors or ADCs using on‑chip logic and embedded memory.
- Embedded System Glue Logic — Replace discrete logic with a single FPGA to simplify board routing and consolidate multiple control functions.
Unique Advantages
- High logic capacity: 306,000 logic elements enable integration of complex functions into a single device, reducing external component count.
- Substantial on‑chip memory: Approximately 2.72 Mbits of embedded memory supports buffering and stateful processing without immediate dependence on external RAM.
- Extensive I/O: 468 I/O pins provide the headroom to support parallel interfaces, multi‑sensor systems, and high‑pin‑count peripherals.
- Industrial robustness: Rated operation from −40 °C to 100 °C addresses many industrial deployment environments.
- Compact, manufacturable package: 1156‑BBGA (35 × 35 mm) surface‑mount footprint balances high integration with board‑level density.
- Regulatory readiness: RoHS compliance supports global electronics manufacturing and environmental requirements.
Why Choose LAV-AT-300E-3LFG1156I?
The LAV-AT-300E-3LFG1156I positions itself as a high‑capacity, industrial‑grade FPGA solution for designers looking to consolidate complex logic, support substantial on‑chip memory, and interface a large number of external signals within a compact BBGA package. Its combination of logic density, embedded memory, and I/O count makes it well suited for industrial automation, communications front ends, and multi‑sensor aggregation designs that require reliable operation across a wide temperature range.
Backed by Lattice’s Avant platform documentation, this device is aimed at teams that need a scalable, integration‑friendly FPGA option with clear electrical and mechanical parameters for production designs.
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