LAV-AT-500E-2LFG1156CES

The LAV-AT-500E-2LFG1156CES is an Avant™-E Field Programmable Gate Array (FPGA) designed for commercial applications that require high logic density and extensive I/O. The device integrates approximately 477,000 logic elements and approximately 4.24 Mbits of on-chip memory, making it suitable for complex programmable logic tasks and mid-to-high density system functions.

Packaged in a 1156-BBGA FCBGA surface-mount package (supplier package: 1156-FCBGA (35x35)), the device offers 572 user I/Os and a documented operating temperature range of 0 °C to 85 °C. The available product documentation details DC and switching characteristics, programmable I/O standards, PLL and oscillator behavior, and hardened PCIe characteristics relevant to high-speed connectivity designs.

Key Features

• Core Logic  Approximately 477,000 logic elements provide dense programmable logic capacity for implementation of complex state machines, datapaths, and custom accelerators.
• Embedded Memory  Approximately 4.24 Mbits of total on-chip RAM for buffering, FIFOs, and local data storage.
• High I/O Count  572 user I/Os to support wide parallel interfaces, multiple serial lanes, and rich sensor or peripheral connectivity.
• Advanced I/O and Protocol Support  Datasheet documentation covers sysI/O differential and single-ended standards including LVDS, SubLVDS, SLVS and Soft MIPI D-PHY, plus multiple differential output standards—useful for mixed-signal interfacing and high-speed links.
• Hardened High-Speed Interfaces  The platform datasheet includes hardened PCIe characteristics and timing for multiple data rates (2.5, 5, 8 and 16 Gbps), enabling designs that require standard high-speed serial connectivity.
• Clocking and Timing  Internal oscillators and sysCLOCK PLL timing are documented in the platform datasheet for deterministic clock management and multirate designs.
• Power and Supply  Device supply documented at 820 mV; detailed DC and switching characteristics are available in the platform datasheet for power budgeting and sequencing.
• Package & Mounting  1156-BBGA (FCBGA) surface-mount package, supplier device package listed as 1156-FCBGA (35x35), supporting compact board-level integration.
• Commercial Grade & Compliance  Rated for commercial temperature operation (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• Networking & Communications: Leverage the device’s large logic array, extensive I/O and documented hardened PCIe support to implement protocol engines, packet processing, and link aggregation functions.
• Data Processing & Acceleration: Use the dense logic resources and on-chip RAM for custom data-path acceleration, stream processing, and hardware offload tasks.
• High-Speed Sensor & Imaging Interfaces: Support multiple differential I/O standards and abundant I/O pins for camera interfaces, image pre-processing, and multi-lane sensor aggregation.
• Prototyping & System Integration: A high-pin-count FCBGA package and comprehensive platform documentation make the device suitable for system prototyping and integration where many peripheral connections are required.

Unique Advantages

• High Logic Density: Approximately 477,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial On-Chip Memory: Approximately 4.24 Mbits of embedded RAM supports local buffering and reduces external memory dependencies.
• Extensive I/O Flexibility: 572 I/Os and documented support for multiple differential and single-ended standards enable flexible interfacing with a wide range of peripherals and sensors.
• Documented High-Speed Serial Support: Platform datasheet includes hardened PCIe characteristics across multiple data rates, simplifying integration of standard high-speed links.
• Compact, High-Pin Package: 1156-FCBGA (35x35) surface-mount package provides a high pin count in a compact footprint for space-constrained designs.
• Commercial Temperature & RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial product requirements.

Why Choose LAV-AT-500E-2LFG1156CES?

The LAV-AT-500E-2LFG1156CES positions itself as a high-density, feature-rich commercial FPGA option for designers needing significant logic resources, embedded memory, and large I/O capacity in a compact FCBGA package. Its platform-level documentation covers critical areas such as DC and switching characteristics, programmable I/O standards, clocking, and hardened PCIe interfaces—information that supports confident system-level integration and performance planning.

This device is well suited for customers building complex connectivity, data processing, or multi-sensor systems who require detailed electrical and timing guidance and a device that consolidates substantial functionality on-chip. The combination of logic density, on-chip RAM, and extensive I/O makes it a practical choice for consolidating board-level components and accelerating time-to-market.

Request a quote or contact sales to obtain pricing, availability, and further technical information about the LAV-AT-500E-2LFG1156CES.