LAV-AT-500E-3CSG676I

IC FPGA AVANT 477KLC 676BGA
Part Description

Avant-E Field Programmable Gate Array (FPGA) IC 312 4239360 477000 676-BGA, FCCSPBGA

Quantity 303 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCCSP (15x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGA, FCCSPBGANumber of I/O312Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells477000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-500E-3CSG676I – Avant-E FPGA — 477000 logic elements, 312 I/Os, 676-FCCSP BGA

The LAV-AT-500E-3CSG676I is an Avant‑E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, optimized for designs that require large programmable logic capacity and substantial on‑chip memory. This device delivers 477,000 logic elements and approximately 4.24 Mbits of embedded memory in a compact 676‑FCCSP package, making it suitable for industrial embedded systems that demand dense logic and high I/O count.

Detailed platform specifications are available in the Avant Platform datasheet, which covers DC and switching characteristics, sysI/O interfaces, PLLs, and platform-level interface performance and timing.

Key Features

  • Logic Capacity — 477,000 logic elements provide substantial programmable fabric for complex logic, custom acceleration, and high‑performance control functions.
  • Embedded Memory — Approximately 4.24 Mbits of total on‑chip RAM for state storage, buffering, and data manipulation within the FPGA fabric.
  • I/O Density — 312 user I/Os to support multiple parallel interfaces, sensor clusters, and board‑level connectivity requirements.
  • Package — 676‑FCCSP (15 × 13 mm) BGA family package (listed as 676‑BGA, FCCSPBGA) for a compact board footprint and high pin count.
  • Mounting — Surface mount package suitable for standard PCB assembly processes.
  • Voltage Supply — Specified supply level shown as 820 mV (listed as 820 mV to 820 mV) for the device power domain.
  • Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for harsher environment deployments.
  • Regulatory — RoHS compliant, supporting lead‑free manufacturing requirements.
  • Platform Documentation — Comprehensive Avant Platform datasheet sections include DC and switching characteristics, sysI/O electrical specs, PLL and oscillator characteristics, and hardened PCIe characteristics (documented through platform specifications).

Typical Applications

  • Industrial Embedded Systems — Deployed in industrial control and automation applications that require high logic density and extended temperature operation.
  • High‑I/O Interface Hubs — Acts as a programmable I/O concentrator or protocol bridge where numerous parallel and serial interfaces are needed.
  • Custom Processing & Acceleration — Suitable for designs needing large amounts of programmable logic and on‑chip RAM for custom data paths and hardware acceleration blocks.

Unique Advantages

  • High Logic Density: 477,000 logic elements enable complex system integration and consolidation of multiple functions into a single device.
  • Substantial On‑Chip Memory: Approximately 4.24 Mbits of embedded RAM reduces reliance on external memory for many buffering and state‑storage needs.
  • Robust I/O Count: 312 I/Os provide flexibility for interfacing to sensors, peripherals, and multiple board interconnects without external I/O expanders.
  • Compact, High‑Pin Package: 676‑FCCSP (15×13 mm) package balances a small PCB footprint with a high pin count for dense designs.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C to meet the thermal demands of industrial environments.
  • Standards‑Aware Documentation: Platform datasheet includes detailed electrical and interface specifications to support design validation and integration.

Why Choose LAV-AT-500E-3CSG676I?

This Avant‑E FPGA device positions itself for projects requiring significant programmable logic, moderate embedded memory, and a high I/O complement in an industrial‑grade package. Its compact 676‑FCCSP form factor and RoHS compliance make it practical for production environments where board space and regulatory conformity matter.

Engineers and procurement teams targeting scalable, high‑density FPGA solutions will find the LAV-AT-500E-3CSG676I suitable for consolidating functions, reducing system BOM, and leveraging the platform datasheet for electrical and timing integration into their designs.

Request a quote or submit an inquiry to obtain pricing, availability, and support information for the LAV-AT-500E-3CSG676I. Our team can provide lead‑time details and assist with your implementation requirements.

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