LAV-AT-500E-3LFG1156I

IC FPGA AVANT 477KLC 1156BGA
Part Description

Avant-E Field Programmable Gate Array (FPGA) IC 572 4239360 477000 1156-BBGA

Quantity 444 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGANumber of I/O572Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells477000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-500E-3LFG1156I – Avant-E Field Programmable Gate Array (FPGA), 477000 logic elements

The LAV-AT-500E-3LFG1156I is an Avant-E platform Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a high-density programmable fabric with 477,000 logic elements, designed for industrial-grade embedded systems and industrial applications that require large I/O counts and significant on-chip memory.

This device combines a large logic capacity with approximately 4.24 Mbits of embedded memory, 572 I/O pins, and package-level integration to address complex custom logic, I/O aggregation, and protocol bridging tasks while operating across an industrial temperature range.

Key Features

  • Core Logic  477,000 logic elements for implementing complex programmable logic, state machines, and custom accelerators.
  • Embedded Memory  Approximately 4.24 Mbits of on-chip RAM bits to support buffering, FIFOs, and localized data storage.
  • I/O Density  572 I/O pins to support high-connectivity designs, extensive peripheral interfacing, and multi-protocol I/O configurations.
  • Power Supply  Core voltage supply listed as 820 mV in product data.
  • Package & Mounting  1156-BBGA package (supplier package: 1156-FPBGA, 35 × 35 mm) with surface-mount mounting for compact board integration.
  • Operating Range & Grade  Industrial grade device rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
  • Timing & Interfaces (Datasheet-specified)  Datasheet includes sysCLOCK PLL timing, internal oscillator characteristics, and hardened PCIe characteristics spanning multiple link rates, enabling designs that require documented timing and high-speed interface support.
  • Reliability & Compliance  RoHS compliant; datasheet includes ESD and DC/switching characteristic specifications and recommended operating conditions for design validation.

Typical Applications

  • Industrial Control Systems  Large logic capacity and broad I/O make the device suitable for custom control, sensor aggregation, and protocol translation in industrial automation.
  • High‑Density I/O Aggregation  Use the 572 I/O pins to consolidate and bridge multiple digital interfaces or to implement complex I/O management on a single device.
  • Protocol Bridging and Interface Conversion  On-chip memory and documented timing building blocks support buffering and signal conditioning for protocol conversion tasks.
  • Embedded System Prototyping  High logic element count and integrated timing resources provide a platform for developing and validating system-level custom logic and accelerators.

Unique Advantages

  • High Logic Capacity:  477,000 logic elements enables large, integrated designs that reduce the need for multiple discrete components.
  • Substantial On‑Chip Memory:  Approximately 4.24 Mbits of embedded RAM reduces external memory dependencies for buffering and local data storage.
  • Extensive I/O Count:  572 I/Os support complex board-level integration, allowing designers to consolidate peripheral connections and simplify routing.
  • Industrial Temperature Range:  Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
  • Package Integration:  1156-ball BGA (35 × 35 mm supplier package) delivers a compact footprint for high-density PCBs while preserving robust connectivity.
  • Datasheet Depth:  Comprehensive datasheet content covers DC/switching characteristics, PLL and oscillator timing, ESD performance, and PCIe characteristics to support detailed system design and verification.

Why Choose LAV-AT-500E-3LFG1156I?

The LAV-AT-500E-3LFG1156I positions itself as a high-density, industrial-grade FPGA platform offering substantial logic and memory resources alongside a very large I/O count. It is suited to engineers and system designers building complex embedded systems, I/O-intensive controllers, or consolidated interface solutions who require documented electrical and timing specifications for system integration and validation.

With industrial temperature operation, a compact 1156-ball BGA package, and a datasheet that details timing, power, and high-speed interface characteristics, this Avant-E device supports designs where integration density, I/O flexibility, and verifiable specifications are priorities.

Request a quote or submit an inquiry to receive pricing, lead-time, and ordering information for the LAV-AT-500E-3LFG1156I.

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