LAV-AT-500E-3LFG1156I
| Part Description |
Avant-E Field Programmable Gate Array (FPGA) IC 572 4239360 477000 1156-BBGA |
|---|---|
| Quantity | 444 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 572 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 477000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-500E-3LFG1156I – Avant-E Field Programmable Gate Array (FPGA), 477000 logic elements
The LAV-AT-500E-3LFG1156I is an Avant-E platform Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a high-density programmable fabric with 477,000 logic elements, designed for industrial-grade embedded systems and industrial applications that require large I/O counts and significant on-chip memory.
This device combines a large logic capacity with approximately 4.24 Mbits of embedded memory, 572 I/O pins, and package-level integration to address complex custom logic, I/O aggregation, and protocol bridging tasks while operating across an industrial temperature range.
Key Features
- Core Logic 477,000 logic elements for implementing complex programmable logic, state machines, and custom accelerators.
- Embedded Memory Approximately 4.24 Mbits of on-chip RAM bits to support buffering, FIFOs, and localized data storage.
- I/O Density 572 I/O pins to support high-connectivity designs, extensive peripheral interfacing, and multi-protocol I/O configurations.
- Power Supply Core voltage supply listed as 820 mV in product data.
- Package & Mounting 1156-BBGA package (supplier package: 1156-FPBGA, 35 × 35 mm) with surface-mount mounting for compact board integration.
- Operating Range & Grade Industrial grade device rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
- Timing & Interfaces (Datasheet-specified) Datasheet includes sysCLOCK PLL timing, internal oscillator characteristics, and hardened PCIe characteristics spanning multiple link rates, enabling designs that require documented timing and high-speed interface support.
- Reliability & Compliance RoHS compliant; datasheet includes ESD and DC/switching characteristic specifications and recommended operating conditions for design validation.
Typical Applications
- Industrial Control Systems Large logic capacity and broad I/O make the device suitable for custom control, sensor aggregation, and protocol translation in industrial automation.
- High‑Density I/O Aggregation Use the 572 I/O pins to consolidate and bridge multiple digital interfaces or to implement complex I/O management on a single device.
- Protocol Bridging and Interface Conversion On-chip memory and documented timing building blocks support buffering and signal conditioning for protocol conversion tasks.
- Embedded System Prototyping High logic element count and integrated timing resources provide a platform for developing and validating system-level custom logic and accelerators.
Unique Advantages
- High Logic Capacity: 477,000 logic elements enables large, integrated designs that reduce the need for multiple discrete components.
- Substantial On‑Chip Memory: Approximately 4.24 Mbits of embedded RAM reduces external memory dependencies for buffering and local data storage.
- Extensive I/O Count: 572 I/Os support complex board-level integration, allowing designers to consolidate peripheral connections and simplify routing.
- Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
- Package Integration: 1156-ball BGA (35 × 35 mm supplier package) delivers a compact footprint for high-density PCBs while preserving robust connectivity.
- Datasheet Depth: Comprehensive datasheet content covers DC/switching characteristics, PLL and oscillator timing, ESD performance, and PCIe characteristics to support detailed system design and verification.
Why Choose LAV-AT-500E-3LFG1156I?
The LAV-AT-500E-3LFG1156I positions itself as a high-density, industrial-grade FPGA platform offering substantial logic and memory resources alongside a very large I/O count. It is suited to engineers and system designers building complex embedded systems, I/O-intensive controllers, or consolidated interface solutions who require documented electrical and timing specifications for system integration and validation.
With industrial temperature operation, a compact 1156-ball BGA package, and a datasheet that details timing, power, and high-speed interface characteristics, this Avant-E device supports designs where integration density, I/O flexibility, and verifiable specifications are priorities.
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