LAV-AT-E30-1ASG324C

IC FPGA AVANT 196KLC 324WLCSP
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 208 1740800 196000 324-BGA, WLCSP

Quantity 1,494 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package324-WLCSP (11x9)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGA, WLCSPNumber of I/O208Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells196000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-E30-1ASG324C – Avant™-E Field Programmable Gate Array (FPGA), 196000 logic elements

The LAV-AT-E30-1ASG324C is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, provided in a 324-WLCSP (11×9) package and intended for commercial-grade applications. It combines high logic capacity, embedded RAM, and a broad programmable I/O complement to support reconfigurable digital logic and system-level integration.

This device is targeted at designs that require substantial on-chip logic (196,000 logic elements), approximately 1.74 Mbits of embedded memory, and up to 208 I/O pins, while operating within a commercial temperature range and a specified supply voltage of 820 mV.

Key Features

  • Logic Capacity  Offers 196,000 logic element cells to implement complex programmable logic and custom processing pipelines.
  • Embedded Memory  Approximately 1.74 Mbits of on-chip RAM to support buffering, state storage, and memory-mapped logic functions.
  • Programmable I/O  208 available I/O pins enable flexible interfacing and signal routing for a variety of peripherals and external devices.
  • Architecture and IP Blocks  Datasheet references a comprehensive architecture that includes programmable functional units, clocking structures, sysMEM memory blocks, sysDSP, SerDes/PCS, and security engine components for system-level design options.
  • DDR and High-Speed PHY Support  The platform overview cites DDR memory support and multi-protocol PHY/PCS blocks to facilitate integration with external memory and high-speed serial interfaces.
  • Device Configuration and Reliability  Includes configuration and management features such as JTAG and SEU handling options as noted in the platform overview.
  • Package and Mounting  Supplied in a 324-WLCSP (11×9) package, surface-mountable for compact board layouts and space-constrained designs.
  • Commercial Grade & Environmental  Grade: Commercial; RoHS compliant. Operating temperature range is 0 °C to 85 °C.
  • Supply Voltage  Specified supply level noted as 820 mV.

Typical Applications

  • Custom Logic and Acceleration  Implement custom hardware accelerators, protocol bridges, and data-path logic using the device’s high logic density and embedded memory.
  • Communications Endpoints  Leverage programmable I/O and the platform’s SerDes/PCS and PHY references to implement endpoint-level protocol handling and signal conditioning.
  • Memory-Intensive Functions  Use the on-chip sysMEM blocks and DDR support referenced in the datasheet for buffering, FIFOs, and memory-mapped processing tasks.
  • Secure Embedded Systems  Take advantage of the referenced security engine and device configuration features for designs that require configuration integrity and runtime protection.

Unique Advantages

  • High Logic Density:  196,000 logic elements provide capacity for complex, multi-function designs without immediate need for additional devices.
  • Integrated Memory Resources:  Approximately 1.74 Mbits of embedded RAM reduces external memory dependencies for many buffering and control tasks.
  • Flexible I/O Count:  208 I/O pins support broad interfacing options, enabling integration with sensors, peripherals, and external subsystems.
  • Compact, Surface-Mount Package:  324-WLCSP (11×9) packaging supports high-density board designs where board area is at a premium.
  • Commercial Temperature Range:  Specified 0 °C to 85 °C operation suits a wide range of commercial embedded applications.
  • Platform-Level Features:  The Avant platform overview lists advanced blocks such as programmable functional units, sysDSP, DDRPHY support, and SerDes/PCS that help accelerate development of targeted functions.

Why Choose LAV-AT-E30-1ASG324C?

The LAV-AT-E30-1ASG324C positions itself as a high-capacity, commercially graded FPGA option that balances significant logic resources, embedded RAM, and a substantial I/O complement in a compact WLCSP footprint. Its platform-level features—outlined in the product documentation—provide architects with modular building blocks for clocking, memory, DSP, high-speed PHYs, and device security that simplify system partitioning and integration.

This device is well suited to development teams and product designers building commercial embedded systems that require reprogrammable logic, on-chip memory, and flexible I/O in a space-efficient package, with the long-term value of scalable logic capacity and platform-driven design options.

Request a quote or submit an inquiry to get pricing and availability information for the LAV-AT-E30-1ASG324C. Provide your project details and requirements to receive a tailored response for procurement and integration support.

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