LAV-AT-E30-1CBG484I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 329 1740800 262000 484-BGA, FCCSPBGA

Quantity 588 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGA, FCCSPBGANumber of I/O329Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-E30-1CBG484I – Avant™-E FPGA IC, 262000 logic elements, 329 I/O

The LAV-AT-E30-1CBG484I is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It delivers a high density of programmable logic with 262000 logic elements and approximately 1.74 Mbits of embedded RAM, packaged in a 484-FCCSP (19×19) surface-mount package.

Designed for industrial applications, this device combines substantial on-chip memory, extensive I/O (329 pins), and platform-level features described in the Avant documentation to support system-level integration, memory interfaces, and programmable I/O requirements within a broad operating temperature range.

Key Features

  • Logic Capacity — 262000 logic elements for implementing complex programmable logic and custom processing functions.
  • Embedded Memory — Approximately 1.74 Mbits of total on-chip RAM for local storage, buffering, and DSP data paths.
  • High I/O Count — 329 I/O pins to support wide parallel buses and multiple peripheral interfaces.
  • Package & Mounting — 484-FCCSP (19×19) / 484-BGA FCCSPBGA package in a surface-mount form factor, suitable for compact board designs.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
  • Power Specification — Voltage supply specified at 820 mV.
  • Platform-Level Architecture — Avant platform features documented in the datasheet include programmable functional unit blocks, sysMEM with single/dual/pseudo-dual port modes and FIFO support, sysDSP resources, and a flexible routing and clocking architecture (on-chip oscillator, PLL, global/regional/edge clocks).
  • Memory and Interface Support — Datasheet describes DDR memory support with DDRPHY and DQS grouping, plus SERDES/PMA and multi-protocol PCS blocks for high-speed interface integration.
  • Device Configuration & Reliability — Platform-level options include enhanced configuration modes, JTAG support, and Single Event Upset (SEU) handling mechanisms as described in the Avant documentation.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Implement control logic, I/O aggregation, and local processing in systems that require an extended temperature range and industrial-grade components.
  • Memory-Interface Subsystems — Use DDRPHY support and on-chip memory to build interfaces and buffers for external DDR memories and high-throughput data paths.
  • Communications & Networking — Leverage SERDES, PCS blocks, and flexible clocking architecture for protocol adaptation, aggregation, and custom packet processing.
  • Signal Processing — Combine sysDSP resources with embedded RAM and abundant logic elements for algorithm acceleration and real-time data handling.

Unique Advantages

  • High Logic Density: 262000 logic elements provide a large resource pool for complex designs and multi-function implementations.
  • On-Chip Memory: Approximately 1.74 Mbits of embedded RAM supports buffering, FIFOs, and local data storage to reduce external memory dependence.
  • Flexible I/O: 329 I/O pins and programmable I/O cell architecture support diverse signaling and banking schemes for mixed-interface designs.
  • Platform Feature Set: The Avant platform includes clocking primitives (on-chip oscillator, PLLs, global/regional/edge clocks), sysDSP, DDRPHY, and SERDES/PCS capabilities for system-level integration.
  • Industrial Readiness: Surface-mount 484-FCCSP package and −40 °C to 100 °C operating range align with requirements for industrial deployments.
  • Standards and Compliance: RoHS compliance for environmental and manufacturing considerations.

Why Choose LAV-AT-E30-1CBG484I?

This Avant™-E FPGA IC is positioned for designers who need significant programmable logic capacity combined with embedded memory, extensive I/O, and platform-level features for clocking, memory interfaces, and high-speed serial integration. The device’s package, industrial temperature rating, and RoHS compliance make it suitable for ruggedized and space-constrained system designs.

Choosing this part provides a balance of integration and system-level flexibility—enabling consolidation of functions, reducing external component count, and leveraging the Avant platform capabilities documented in the datasheet for configuration, memory modes, DSP functions, and interface support.

Request a quote or contact sales to discuss availability, pricing, and how LAV-AT-E30-1CBG484I can fit into your next industrial FPGA design.

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