LAV-AT-E30-1ASG410I
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 247 1740800 262000 410-BGA, WLCSP |
|---|---|
| Quantity | 217 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 410-WLCSP (11x9) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 410-BGA, WLCSP | Number of I/O | 247 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-E30-1ASG410I – Avant™-E FPGA, 262,000 logic elements, 247 I/Os, 410‑WLCSP
The LAV-AT-E30-1ASG410I is an Avant™-E field programmable gate array (FPGA) IC from Lattice Semiconductor. It provides a high logic density of 262,000 logic elements and approximately 1.74 Mbits of on‑chip RAM in a 410‑WLCSP (11×9) package for compact, surface‑mount integration.
Targeted for industrial applications, the device offers up to 247 I/Os, a core supply of 820 mV, and an operating range of −40 °C to 100 °C. Per the Avant Platform specifications, the platform includes comprehensive DC and switching characteristics and platform features such as on‑chip PLLs and internal oscillators.
Key Features
- Core Density 262,000 logic elements for integrating complex programmable logic within a single FPGA device.
- Embedded Memory Approximately 1.74 Mbits of on‑chip RAM to support frame buffers, FIFOs, and local data storage.
- I/O Capability Up to 247 I/Os to support broad peripheral and system interfacing requirements.
- Power Core voltage specified at 820 mV (per product data), enabling predictable power planning for the logic fabric.
- Package & Mounting 410‑WLCSP (11×9) supplier device package, surface mount mounting type for low-profile, high‑density board designs.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
- Platform-level Timing & Analog Resources Avant Platform specifications document includes PLLs, internal oscillators, and detailed DC/switching characteristics to support timing and clocking system design.
- High‑speed Serial & I/O Standards (Platform) The Avant Platform datasheet documents sysI/O differential standards and hardened PCIe characteristics covering multiple lane speeds (platform-level details), useful for designs requiring serial connectivity support.
- Compliance RoHS compliant.
Typical Applications
- High‑density embedded logic Designs that require substantial programmable logic and on‑chip RAM in a compact package.
- Multi‑I/O systems Systems needing up to 247 I/O signals for sensors, controls, or peripheral interfaces.
- Industrial electronics Applications operating across −40 °C to 100 °C where industrial‑grade temperature tolerance is required.
- Compact board designs Small form‑factor assemblies where a 410‑WLCSP package enables space‑efficient placement and surface mount assembly.
Unique Advantages
- High logic integration: 262,000 logic elements allow consolidation of complex functions into a single device, reducing component count.
- On‑chip memory capacity: Approximately 1.74 Mbits of embedded RAM supports local buffering and state storage without external memory for many use cases.
- Broad I/O capacity: 247 available I/Os provide flexibility to interface with many peripherals and subsystems directly.
- Industrial thermal range: −40 °C to 100 °C rating helps ensure operation across demanding environmental conditions.
- Compact WLCSP package: 410‑WLCSP (11×9) minimizes PCB area and supports surface‑mount manufacturing processes.
- Platform specification support: Avant Platform documentation includes detailed DC/switching characteristics, PLLs, internal oscillators, and hardened PCIe characteristics for system designers referencing platform capabilities.
Why Choose LAV-AT-E30-1ASG410I?
The LAV-AT-E30-1ASG410I positions high logic density, significant embedded memory, and extensive I/O capability in a compact 410‑WLCSP package suited to industrial temperature ranges. Its specification set supports demanding board‑level integration where area, thermal tolerance, and programmable logic capacity are critical.
For design teams needing a programmable, high‑density FPGA solution with platform-level timing, PLL and serial connectivity references available in the Avant Platform datasheet, this device provides a tightly integrated option that simplifies system partitioning and hardware consolidation.
Request a quote or submit a procurement inquiry through your preferred purchasing channel to receive pricing and availability for the LAV-AT-E30-1ASG410I.

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