LAV-AT-E30-1ASG410I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 247 1740800 262000 410-BGA, WLCSP

Quantity 217 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package410-WLCSP (11x9)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case410-BGA, WLCSPNumber of I/O247Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-E30-1ASG410I – Avant™-E FPGA, 262,000 logic elements, 247 I/Os, 410‑WLCSP

The LAV-AT-E30-1ASG410I is an Avant™-E field programmable gate array (FPGA) IC from Lattice Semiconductor. It provides a high logic density of 262,000 logic elements and approximately 1.74 Mbits of on‑chip RAM in a 410‑WLCSP (11×9) package for compact, surface‑mount integration.

Targeted for industrial applications, the device offers up to 247 I/Os, a core supply of 820 mV, and an operating range of −40 °C to 100 °C. Per the Avant Platform specifications, the platform includes comprehensive DC and switching characteristics and platform features such as on‑chip PLLs and internal oscillators.

Key Features

  • Core Density  262,000 logic elements for integrating complex programmable logic within a single FPGA device.
  • Embedded Memory  Approximately 1.74 Mbits of on‑chip RAM to support frame buffers, FIFOs, and local data storage.
  • I/O Capability  Up to 247 I/Os to support broad peripheral and system interfacing requirements.
  • Power  Core voltage specified at 820 mV (per product data), enabling predictable power planning for the logic fabric.
  • Package & Mounting  410‑WLCSP (11×9) supplier device package, surface mount mounting type for low-profile, high‑density board designs.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
  • Platform-level Timing & Analog Resources  Avant Platform specifications document includes PLLs, internal oscillators, and detailed DC/switching characteristics to support timing and clocking system design.
  • High‑speed Serial & I/O Standards (Platform)  The Avant Platform datasheet documents sysI/O differential standards and hardened PCIe characteristics covering multiple lane speeds (platform-level details), useful for designs requiring serial connectivity support.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑density embedded logic  Designs that require substantial programmable logic and on‑chip RAM in a compact package.
  • Multi‑I/O systems  Systems needing up to 247 I/O signals for sensors, controls, or peripheral interfaces.
  • Industrial electronics  Applications operating across −40 °C to 100 °C where industrial‑grade temperature tolerance is required.
  • Compact board designs  Small form‑factor assemblies where a 410‑WLCSP package enables space‑efficient placement and surface mount assembly.

Unique Advantages

  • High logic integration: 262,000 logic elements allow consolidation of complex functions into a single device, reducing component count.
  • On‑chip memory capacity: Approximately 1.74 Mbits of embedded RAM supports local buffering and state storage without external memory for many use cases.
  • Broad I/O capacity: 247 available I/Os provide flexibility to interface with many peripherals and subsystems directly.
  • Industrial thermal range: −40 °C to 100 °C rating helps ensure operation across demanding environmental conditions.
  • Compact WLCSP package: 410‑WLCSP (11×9) minimizes PCB area and supports surface‑mount manufacturing processes.
  • Platform specification support: Avant Platform documentation includes detailed DC/switching characteristics, PLLs, internal oscillators, and hardened PCIe characteristics for system designers referencing platform capabilities.

Why Choose LAV-AT-E30-1ASG410I?

The LAV-AT-E30-1ASG410I positions high logic density, significant embedded memory, and extensive I/O capability in a compact 410‑WLCSP package suited to industrial temperature ranges. Its specification set supports demanding board‑level integration where area, thermal tolerance, and programmable logic capacity are critical.

For design teams needing a programmable, high‑density FPGA solution with platform-level timing, PLL and serial connectivity references available in the Avant Platform datasheet, this device provides a tightly integrated option that simplifies system partitioning and hardware consolidation.

Request a quote or submit a procurement inquiry through your preferred purchasing channel to receive pricing and availability for the LAV-AT-E30-1ASG410I.

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