LAV-AT-500E-3LFG1156CES
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 572 4239360 477000 1156-BBGA, FCBGA |
|---|---|
| Quantity | 262 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 572 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 477000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-500E-3LFG1156CES – Avant™-E Field Programmable Gate Array (FPGA) IC 572 4239360 477000 1156-BBGA, FCBGA
The LAV-AT-500E-3LFG1156CES is an Avant™-E FPGA from Lattice Semiconductor Corporation designed for high-density programmable logic integration. This device offers approximately 477,000 logic elements and roughly 4.24 Mbits of embedded memory, combined with a high I/O count in a 1156-ball FCBGA package for compact, surface-mount system designs.
Targeted for commercial-grade applications, the part provides a defined operating range and supply requirement to support system-level integration where high logic capacity, large on-chip RAM, and extensive I/O are required.
Key Features
- Core Capacity — Approximately 477,000 logic elements, enabling complex programmable logic and high-density implementation of custom digital functions.
- On-Chip Memory — Approximately 4.24 Mbits of embedded memory for buffering, lookup tables, and state storage within the FPGA fabric.
- High I/O Count — 572 user I/O pins to support multiple external interfaces, parallel buses, and high-pin-count system connections.
- Package & Mounting — 1156-BBGA (1156‑FCBGA, 35×35) surface-mount package that balances density and board-level routing for compact designs.
- Power Supply — Specified supply requirement of 820 mV (documented range 820 mV to 820 mV) for core operation; consult platform datasheet for recommended sequencing and supply details.
- Commercial Grade — Rated for commercial operating conditions with an operating temperature range of 0 °C to 85 °C.
- Regulatory Compliance — RoHS compliant, supporting lead-free assembly and regulatory requirements for many commercial products.
Typical Applications
- Complex Digital System Integration — Use as programmable logic to implement glue logic, custom datapaths, and protocol handling where large logic capacity and on-chip memory are needed.
- High‑Pin‑Count Interface Bridging — High I/O count supports aggregation and routing between multiple external interfaces and daughtercards in compact systems.
- Prototyping and Evaluation — Suitable for development platforms and boards that require significant programmable resources and memory for design validation.
Unique Advantages
- High Logic Density: Approximately 477,000 logic elements provide the capacity to map large, complex designs without external glue logic.
- Significant Embedded Memory: Approximately 4.24 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state requirements.
- Extensive I/O Availability: 572 I/Os enable flexible interfacing to sensors, controllers, and high-speed connectors while minimizing additional interface chips.
- Compact, Surface‑Mount Package: The 1156-ball FCBGA (35×35) package offers a small footprint for space-constrained board layouts while supporting high pin counts.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to meet typical commercial product requirements without over-specifying for industrial ranges.
- Regulatory-Friendly: RoHS compliance simplifies procurement and assembly for lead-free manufacturing processes.
Why Choose LAV-AT-500E-3LFG1156CES?
The LAV-AT-500E-3LFG1156CES positions itself as a high-capacity, commercial-grade FPGA option within the Lattice Avant platform, combining substantial logic resources, meaningful on-chip memory, and an extensive set of I/Os in a compact 1156‑FCBGA package. It is suited for engineering teams building complex digital systems that require dense programmable logic and significant embedded RAM while maintaining a defined commercial operating envelope.
Choosing this part provides scalability for evolving designs, integration benefits from on-chip memory and large I/O counts, and compliance with RoHS for mainstream commercial production. For designs that align with these documented specifications, this FPGA offers a clear path to integration within existing commercial product workflows.
Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the LAV-AT-500E-3LFG1156CES.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016