LAV-AT-500E-3CSG676C

The LAV-AT-500E-3CSG676C is an Avant-E platform FPGA from Lattice Semiconductor Corporation optimized for high-density, surface-mount system designs. This commercial-grade device integrates 477,000 logic elements with approximately 4.24 Mbits of embedded memory and 312 user I/O pins in a compact 676-FCCSP (15×13) package.

Platform-level specifications in the Avant datasheet document detailed DC and switching characteristics, on-chip termination options, ESD performance, sysI/O electrical standards, PLL and oscillator behavior, and hardened PCIe characteristics, enabling developers to address high-speed interfaces and complex custom logic integration while referencing complete electrical and timing data.

Key Features

• High-density logic — 477,000 logic elements for complex custom logic, state machines and programmable datapaths.
• Embedded memory — Approximately 4.24 Mbits of on-chip RAM to support buffers, FIFOs and local storage for dataplane and control functions.
• Generous I/O — 312 I/O pins to support broad peripheral connectivity and multiple interface buses.
• Compact package & surface mount — 676-BGA / 676-FCCSP (15×13) supplier device package designed for space-constrained PCB layouts and automated assembly.
• Power — Voltage supply specified at 820 mV for device core operation as documented in platform specifications.
• Commercial temperature grade — Rated for 0°C to 85°C operation suitable for commercial applications.
• Platform-level interface and timing support — Datasheet coverage includes sysI/O electrical standards (single-ended and differential modes), PLL and oscillator characteristics, on-chip programmable termination and detailed switching characteristics.
• Hardened PCIe characteristics — Avant platform documentation includes PCIe timing and electrical characteristics up to 16 Gbps, supporting designs that require high-speed serial connectivity.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• High-speed connectivity — Leverage platform PCIe characteristics and sysI/O support for designs requiring high-bandwidth serial links and host interfaces.
• Custom dataplane and packet processing — Large logic capacity and embedded memory enable implementation of packet buffering, parsing and custom acceleration functions.
• Compact embedded systems — The 676-FCCSP surface-mount package supports dense PCB layouts for compact controllers and edge devices.

Unique Advantages

• High logic integration: 477,000 logic elements consolidate complex functions into a single device, reducing system-level BOM and board area.
• On-chip memory capacity: Approximately 4.24 Mbits of embedded RAM provides local storage for low-latency buffering and state retention without external memory.
• Broad I/O availability: 312 I/O pins enable multiple interfaces and parallel connections, simplifying board-level routing and external component count.
• Compact, manufacturable package: 676-FCCSP (15×13) surface-mount package optimizes space and supports automated assembly processes.
• Documented platform specifications: Comprehensive datasheet sections cover DC/switching characteristics, ESD, on-chip termination, sysI/O standards, PLLs and PCIe, aiding design verification and signal integrity planning.
• Commercial-grade operation: Rated for 0°C to 85°C to match commercial application environments and deployment scenarios.

Why Choose LAV-AT-500E-3CSG676C?

The LAV-AT-500E-3CSG676C positions itself as a high-density, platform-oriented FPGA for designs that require substantial logic capacity, embedded memory and a large I/O complement in a compact surface-mount package. Its documented Avant platform specifications provide the electrical and timing detail engineers need to evaluate signal integrity, power sequencing and high-speed interface integration.

This device is suited to development teams and OEMs building commercial products that integrate complex programmable logic with high-speed interfaces, offering a balance of integration, documented platform behavior and a compact package to streamline system design and assembly.

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