LAV-AT-G30-3LFG676I

The LAV-AT-G30-3LFG676I is an Avant™-G FPGA from Lattice Semiconductor Corporation, delivering a high-density programmable fabric with 262,000 logic elements and approximately 1.74 Mbits of embedded memory. The device integrates a broad set of on-chip resources—programmable functional units, routing, advanced clocking, sysMEM and sysDSP blocks, programmable I/O, DDRPHY, and SERDES/PCS capabilities—packaged in a 676-FCBGA (27×27) surface-mount package.

Designed for industrial applications, this device provides 298 user I/O pins, a specified supply of 820 mV, and an operating temperature range of −40 °C to 100 °C, making it suitable for embedded systems that require high integration, flexible I/O, and on-chip memory and DSP resources.

Key Features

• Core Capacity  262,000 logic elements provide a programmable fabric for implementing complex digital logic and control functions.
• Embedded Memory  Approximately 1.74 Mbits of on-chip RAM (sysMEM) with support for single, dual and pseudo-dual port modes, FIFO operation, and memory cascading.
• DSP Resources (sysDSP)  Dedicated sysDSP blocks are included for on-chip signal processing acceleration and arithmetic-intensive functions.
• Programmable I/O and Banking  Programmable I/O cells and a banking scheme support a variety of I/O configurations across 298 available I/O pins.
• Advanced Clocking  Comprehensive clock architecture with on-chip oscillator, PLL, global and regional clocks, edge clocks, PHYCLK, clock synchronizers/dividers, and dynamic clock controls.
• DDR Memory Support  Integrated DDRPHY and DQS grouping support for external DDR memory interfaces.
• SERDES and Multi‑Protocol PHY  SERDES/PMA blocks and Multi-Protocol PCS/PHY integration for high-speed serial connectivity and protocol flexibility.
• Device Configuration and Reliability  Enhanced configuration options including JTAG and Single Event Upset (SEU) handling features as documented in the Avant platform overview.
• Package and Mounting  676-BBGA / 676-FCBGA (27×27) surface-mount package suitable for compact board layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, aligned with industrial application requirements.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Memory interface and bridging  Leverage DDRPHY and sysMEM features to implement DDR memory controllers, buffering and protocol bridging functions.
• High-speed serial connectivity  Use SERDES, PCS and MPPHY integration for multi-protocol serial links and data transport applications.
• Embedded signal processing  Deploy sysDSP blocks alongside the programmable fabric for on-chip filtering, transforms, and real-time data processing.
• Industrial control and automation  Industrial-grade temperature range and extensive I/O make the device suitable for industrial embedded control, sensor aggregation, and interface tasks.

Unique Advantages

• High logic density: 262,000 logic elements enable complex system integration on a single device, reducing external component count.
• On-chip memory and DSP: Approximately 1.74 Mbits of embedded RAM and sysDSP resources simplify buffering and signal-processing workloads without external memory for many functions.
• Comprehensive I/O: 298 user I/O pins and programmable I/O cells support diverse interface requirements and flexible bank assignments.
• Advanced timing and clocking: Integrated PLLs, on-chip oscillator and multiple clock domains facilitate complex timing architectures and dynamic clock control.
• Industrial-ready thermal range: −40 °C to 100 °C operation supports deployment in harsh and industrial environments.
• Compact, manufacturable package: 676-FCBGA (27×27) surface-mount package provides a dense footprint for space-constrained designs.

Why Choose LAV-AT-G30-3LFG676I?

The LAV-AT-G30-3LFG676I positions itself as a highly integrated FPGA solution within the Avant™-G family, combining substantial logic capacity, embedded memory, DSP resources, and extensive I/O in a single 676-FCBGA package. Its feature set—clocking, DDR support, SERDES/PCS, programmable I/O, and device configuration options—addresses designs that require on-chip processing, memory interfacing, and high-speed serial connectivity while meeting industrial temperature requirements.

This device is well suited for engineering teams building compact, integrated embedded systems that need programmable logic, DSP acceleration, and flexible I/O. Documentation for the Avant platform describes architecture elements such as Programmable Functional Unit (PFU) blocks, routing structures, sysMEM, sysDSP, and configuration capabilities to support design implementation and verification.

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