LAV-AT-G30-3LFG676C
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA |
|---|---|
| Quantity | 248 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-G30-3LFG676C – Avant™-G Field Programmable Gate Array (FPGA), 262,000 logic elements, ~1.74 Mbits RAM, 298 I/Os, 676-FCBGA
The LAV-AT-G30-3LFG676C is an Avant™-G FPGA IC from Lattice Semiconductor, delivering 262,000 logic elements and approximately 1.74 Mbits of embedded memory in a 676-FCBGA (27×27) package. Designed on the Lattice Avant platform, the device integrates rich on-chip memory, DSP resources, advanced clocking, DDRPHY and SERDES/PCS capabilities to support complex programmable-logic implementations.
Packaged for surface-mount assembly and specified for commercial operation (0 °C to 85 °C), this FPGA targets designs that require a high I/O count and flexible memory and interface options while maintaining RoHS compliance.
Key Features
- Core Logic — 262,000 logic elements provide substantial programmable fabric for custom hardware acceleration, protocol implementation, and glue-logic integration.
- Embedded Memory (sysMEM) — Approximately 1.74 Mbits (1,740,800 total RAM bits) of on-chip RAM with support for initialization, ROM operation, memory cascading, single/dual/pseudo-dual port modes and FIFO configurations.
- I/O and Packaging — 298 I/O pins in a 676-FCBGA (27×27) supplier device package; surface-mount mounting suitable for standard PCB assembly processes.
- Clocking and Timing — Platform-level clock features including on‑chip oscillator, PLLs, global and regional clocks, edge clocks, dynamic clock select/control and DLL delay for timing flexibility.
- High-Speed Interfaces — DDR memory support with DDRPHY and SERDES/PMA block capabilities, plus multi-protocol PCS and MPPHY integration for versatile serial and memory interfaces.
- DSP and Data Path — sysDSP resources on the Avant platform for dedicated signal-processing and arithmetic acceleration within the FPGA fabric.
- Configuration and Reliability — Enhanced configuration options, JTAG support, Single Event Upset (SEU) handling, and trace ID functionality as described for the Avant platform.
- Power and Compliance — Voltage supply specified at 820 mV and RoHS compliant; commercial-grade operating temperature range of 0 °C to 85 °C.
Typical Applications
- Programmable system logic and control — Implement state machines, protocol handling, and custom control logic using the device’s large logic fabric and abundant I/O.
- Memory interface and buffering — Use integrated sysMEM and DDRPHY support for memory buffering, FIFO staging, and DDR memory interfacing.
- High-speed serial connectivity — Deploy SERDES, multi-protocol PCS and MPPHY features to implement serial links and protocol bridging within system designs.
- Signal processing and acceleration — Offload compute kernels and fixed-point DSP tasks to on-chip sysDSP resources for deterministic low-latency processing.
Unique Advantages
- High-density programmable fabric: 262,000 logic elements enable large, complex designs without immediate migration to higher-tier devices.
- Integrated memory capabilities: Approximately 1.74 Mbits of embedded RAM with flexible port modes and FIFO support simplifies design of buffering and local storage functions.
- Broad I/O and compact packaging: 298 I/Os in a 676-FCBGA (27×27) package provide a balance of pin count and PCB area for space-constrained systems.
- Comprehensive clocking and timing features: On-chip oscillator, PLLs, and dynamic clock controls support diverse timing architectures and runtime clock domain management.
- Advanced interface support: DDRPHY and SERDES/PCS building blocks enable direct implementation of memory interfaces and high-speed serial protocols on the same device.
- Platform-level configuration and reliability: Enhanced configuration options, JTAG access and SEU handling mechanisms support robust deployment and field configurability.
Why Choose LAV-AT-G30-3LFG676C?
The LAV-AT-G30-3LFG676C positions itself as a versatile, platform-based FPGA solution for designs that require a large logic footprint, embedded memory, significant I/O capacity, and integrated high-speed interface building blocks. Its Avant platform features—clocking flexibility, sysMEM options, sysDSP, DDRPHY and SERDES/PCS—allow engineers to consolidate functions that would otherwise increase board-level complexity.
Ideal for system designers and OEMs building programmable logic into embedded systems, communications peripherals, or data-path acceleration modules, this FPGA provides a combination of integration and configurability aligned with commercial temperature and RoHS requirements.
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