LAV-AT-G30-3ASG410C
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 196 1740800 262000 410-BGA, WLCSP |
|---|---|
| Quantity | 451 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 410-WLCSP (11x9) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 410-BGA, WLCSP | Number of I/O | 196 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-G30-3ASG410C – Avant™-G Field Programmable Gate Array (FPGA)
The LAV-AT-G30-3ASG410C is an Avant™-G series FPGA from Lattice Semiconductor, delivered in a 410-pin WLCSP package. It implements the Avant platform architecture with programmable functional units, on-chip memory, programmable I/O, clocking resources and high-speed PHY/serdes building blocks suitable for embedded logic and interface integration.
With 262,000 logic elements and approximately 1.74 Mbits of embedded RAM, along with 196 I/O pins and advanced clock and memory subsystems, this commercial-grade device targets applications that require substantial programmable logic, flexible I/O and on-chip memory while maintaining a compact surface-mount package footprint.
Key Features
- Core Logic 262,000 logic elements provide programmable fabric capacity for custom digital logic, control and datapath implementations.
- On-Chip Memory Approximately 1.74 Mbits of embedded RAM (1,740,800 total RAM bits) supporting single, dual and pseudo-dual port modes, FIFO operation and memory cascading.
- Programmable I/O 196 I/O pins with a flexible programmable I/O cell architecture and multiple supported I/O standards for broad interfacing options.
- Clocking and Timing Rich clocking infrastructure described in the Avant platform including on-chip oscillator, PLLs, global and regional clocks, dynamic clock control and synchronizers for complex clocking schemes.
- High-Speed Interfaces Architectural support for SERDES/PMA and multi-protocol PCS, enabling high-speed serial connectivity and PHY integration as outlined in the Avant platform documentation.
- DSP and PHY Blocks Dedicated sysDSP resources and DDRPHY support provide building blocks for signal processing and external DDR memory interfacing.
- Package and Mounting 410-WLCSP (11×9) surface-mount package offered as 410-BGA/WLCSP for compact board-level integration.
- Electrical and Thermal Single supply reported as 820 mV. Operates over a commercial temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High-speed serial interfaces Leverage SERDES and PCS support for protocol bridging, link adaptation and multi-protocol PHY integration.
- Memory interface and controllers Use the device’s DDRPHY and sysMEM capabilities to implement DDR memory controllers, FIFOs and burst buffering.
- Custom compute and DSP Implement signal processing pipelines and accelerator blocks using the available logic elements and sysDSP resources.
- I/O concentrator and protocol bridging Use the 196 programmable I/Os and flexible PIO cells to aggregate sensors, peripherals and varied interface standards.
Unique Advantages
- Substantial programmable capacity: 262,000 logic elements enable medium-to-large custom logic implementations without external glue logic.
- Integrated memory flexibility: Approximately 1.74 Mbits of on-chip RAM supports multiple memory modes and FIFO operation to simplify system memory architecture.
- Comprehensive clocking: On-chip oscillator, PLLs and dynamic clock control provide designers with versatile timing resources for synchronous and asynchronous domains.
- High-speed PHY readiness: Built-in SERDES/PMA and multi-protocol PCS support facilitate adoption of high-speed serial links and PHY integration.
- Compact surface-mount package: 410-WLCSP (11×9) keeps board footprint small while offering a high pin count for dense designs.
- Commercial-grade deployment: Designed for commercial temperature operation (0 °C to 85 °C) with RoHS compliance for standard production environments.
Why Choose LAV-AT-G30-3ASG410C?
The LAV-AT-G30-3ASG410C combines the Avant platform’s programmable fabric, on-chip memory, advanced clocking and high-speed interface blocks in a compact WLCSP package. It is well suited for designs that require significant programmable logic, embedded RAM and flexible I/O while maintaining a small board footprint.
This device is targeted at engineers building systems that need integrated DDR support, serdes-capable PHY resources and a versatile I/O matrix. Its combination of logic capacity, memory and platform-level features supports scalable designs and streamlines BOM by consolidating functions into a single FPGA device.
Request a quote or submit an inquiry to learn about availability, pricing and lead times for the LAV-AT-G30-3ASG410C.