LAV-AT-G30-3ASG410C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 196 1740800 262000 410-BGA, WLCSP

Quantity 451 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package410-WLCSP (11x9)GradeCommercialOperating Temperature0°C – 85°C
Package / Case410-BGA, WLCSPNumber of I/O196Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-G30-3ASG410C – Avant™-G Field Programmable Gate Array (FPGA)

The LAV-AT-G30-3ASG410C is an Avant™-G series FPGA from Lattice Semiconductor, delivered in a 410-pin WLCSP package. It implements the Avant platform architecture with programmable functional units, on-chip memory, programmable I/O, clocking resources and high-speed PHY/serdes building blocks suitable for embedded logic and interface integration.

With 262,000 logic elements and approximately 1.74 Mbits of embedded RAM, along with 196 I/O pins and advanced clock and memory subsystems, this commercial-grade device targets applications that require substantial programmable logic, flexible I/O and on-chip memory while maintaining a compact surface-mount package footprint.

Key Features

  • Core Logic  262,000 logic elements provide programmable fabric capacity for custom digital logic, control and datapath implementations.
  • On-Chip Memory  Approximately 1.74 Mbits of embedded RAM (1,740,800 total RAM bits) supporting single, dual and pseudo-dual port modes, FIFO operation and memory cascading.
  • Programmable I/O  196 I/O pins with a flexible programmable I/O cell architecture and multiple supported I/O standards for broad interfacing options.
  • Clocking and Timing  Rich clocking infrastructure described in the Avant platform including on-chip oscillator, PLLs, global and regional clocks, dynamic clock control and synchronizers for complex clocking schemes.
  • High-Speed Interfaces  Architectural support for SERDES/PMA and multi-protocol PCS, enabling high-speed serial connectivity and PHY integration as outlined in the Avant platform documentation.
  • DSP and PHY Blocks  Dedicated sysDSP resources and DDRPHY support provide building blocks for signal processing and external DDR memory interfacing.
  • Package and Mounting  410-WLCSP (11×9) surface-mount package offered as 410-BGA/WLCSP for compact board-level integration.
  • Electrical and Thermal  Single supply reported as 820 mV. Operates over a commercial temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed serial interfaces  Leverage SERDES and PCS support for protocol bridging, link adaptation and multi-protocol PHY integration.
  • Memory interface and controllers  Use the device’s DDRPHY and sysMEM capabilities to implement DDR memory controllers, FIFOs and burst buffering.
  • Custom compute and DSP  Implement signal processing pipelines and accelerator blocks using the available logic elements and sysDSP resources.
  • I/O concentrator and protocol bridging  Use the 196 programmable I/Os and flexible PIO cells to aggregate sensors, peripherals and varied interface standards.

Unique Advantages

  • Substantial programmable capacity: 262,000 logic elements enable medium-to-large custom logic implementations without external glue logic.
  • Integrated memory flexibility: Approximately 1.74 Mbits of on-chip RAM supports multiple memory modes and FIFO operation to simplify system memory architecture.
  • Comprehensive clocking: On-chip oscillator, PLLs and dynamic clock control provide designers with versatile timing resources for synchronous and asynchronous domains.
  • High-speed PHY readiness: Built-in SERDES/PMA and multi-protocol PCS support facilitate adoption of high-speed serial links and PHY integration.
  • Compact surface-mount package: 410-WLCSP (11×9) keeps board footprint small while offering a high pin count for dense designs.
  • Commercial-grade deployment: Designed for commercial temperature operation (0 °C to 85 °C) with RoHS compliance for standard production environments.

Why Choose LAV-AT-G30-3ASG410C?

The LAV-AT-G30-3ASG410C combines the Avant platform’s programmable fabric, on-chip memory, advanced clocking and high-speed interface blocks in a compact WLCSP package. It is well suited for designs that require significant programmable logic, embedded RAM and flexible I/O while maintaining a small board footprint.

This device is targeted at engineers building systems that need integrated DDR support, serdes-capable PHY resources and a versatile I/O matrix. Its combination of logic capacity, memory and platform-level features supports scalable designs and streamlines BOM by consolidating functions into a single FPGA device.

Request a quote or submit an inquiry to learn about availability, pricing and lead times for the LAV-AT-G30-3ASG410C.

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