LAV-AT-G30-2LFG676I

The LAV-AT-G30-2LFG676I is an Avant™-G Field Programmable Gate Array (FPGA) offered in a 676-ball FCBGA package. The device provides a programmable logic fabric with 262,000 logic elements, approximately 1.74 Mbits of embedded memory, and 298 user I/Os, targeting industrial-grade applications that require configurable logic, on-chip memory, and extensive I/O.

Architectural highlights described in the Avant platform overview include on-chip clocking (oscillator, PLLs, global and regional clocks), sysMEM and sysDSP blocks, programmable I/O cells, DDR memory support and SERDES/PCS capabilities, as well as device configuration and SEU handling—enabling integration of complex system functions into a single FPGA footprint.

Key Features

• Core Logic — 262,000 logic elements provide a large programmable fabric for custom digital designs and hardware acceleration.
• Embedded Memory — Approximately 1.74 Mbits of on-chip RAM (sysMEM) supporting single, dual and pseudo-dual port modes, FIFO operation, and memory cascading.
• I/O Capacity — 298 user I/Os with a programmable I/O cell architecture for flexible interface support.
• Clocking and PLLs — Integrated on‑chip oscillator, PLLs, global and regional clocking structures, clock synchronizers and dynamic clock control for robust timing management.
• DSP and High‑Speed Interfaces — sysDSP blocks and SERDES/PCS building blocks described in the platform overview enable DSP functions and high-speed serial connectivity.
• DDR Memory Support — DDRPHY and DQS grouping support for external DDR memory interfaces (as described in platform documentation).
• Configuration and Reliability — Enhanced configuration options, JTAG support, and SEU handling mechanisms documented for the Avant platform.
• Package & Mounting — 676-BBGA / 676-FCBGA (27×27 mm) package, surface mount, suitable for industrial-grade deployment.
• Electrical & Thermal — Specified supply condition listed as 820 mV (820 mV to 820 mV) and operating temperature range of −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control Systems — Configurable logic and extensive I/O allow integration of control, sensor aggregation, and protocol bridging in industrial environments within the specified −40 °C to 100 °C range.
• High‑Speed Communications — SERDES/PCS and DDRPHY capabilities support designs that require high-speed serial links and external memory interfaces.
• Compute Acceleration and DSP — sysDSP and large logic capacity enable signal processing, filtering, and hardware-accelerated compute blocks.
• Memory‑Intensive Designs — sysMEM features and DDR support make the device suitable for designs requiring on-chip RAM and external memory buffering.

Unique Advantages

• High Logic Density: 262,000 logic elements provide substantial capacity for complex custom logic and hardware acceleration without external logic expansion.
• Integrated Memory Resources: Approximately 1.74 Mbits of embedded memory (sysMEM) supports FIFO, ROM, and multiport configurations to simplify system memory architecture.
• Extensive I/O Count: 298 user I/Os offer flexible peripheral interfacing and partitioning for multi-protocol designs.
• Comprehensive Clocking: On-chip oscillator, PLLs, and multiple clock domains described in the platform enable precise timing control and dynamic clock management.
• Industrial‑Grade Operation: Specified operating range from −40 °C to 100 °C and RoHS compliance support deployment in industrial environments.
• Package Options for Production: 676-FCBGA (27×27) BGA package provides a compact surface-mount form factor for board-level integration.

Why Choose LAV-AT-G30-2LFG676I?

The LAV-AT-G30-2LFG676I positions itself as a versatile industrial-grade FPGA optimized for designs that require a large programmable fabric, meaningful on-chip memory, and extensive I/O. Its documented Avant platform features—clocking, memory, DSP, SERDES/PCS, DDR support, and configuration options—allow system designers to consolidate functionality and streamline board-level complexity.

This device is suitable for engineering teams building industrial control, communications, and compute-accelerated systems that benefit from a single, configurable device with documented platform capabilities and production-ready packaging.

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