LAV-AT-G30-2LFG676C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA

Quantity 630 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-G30-2LFG676C – Avant™-G FPGA, 262,000 Logic Elements, 676‑FCBGA

The LAV-AT-G30-2LFG676C is an Avant™-G Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, delivered in a 676‑BBGA FCBGA (27×27) surface-mount package. It implements the Avant platform architecture and provides a high-density fabric with on-chip memory and a comprehensive clocking and I/O infrastructure.

Key platform capabilities include programmable functional unit (PFU) blocks, dedicated sysMEM and sysDSP resources, and multi-domain clocking elements such as on‑chip oscillators and PLLs. These capabilities support designs that require substantial logic capacity, embedded memory, and flexible high‑speed I/O.)

Key Features

  • Logic Capacity — 262,000 logic elements suitable for complex programmable logic implementations and custom hardware acceleration.
  • Embedded Memory — Total on-chip RAM of 1,740,800 bits (approximately 1.74 Mbits) for data buffering, state storage, and memory-mapped logic.
  • I/O Resources — 298 I/O pins with a programmable I/O cell (PIC) architecture and sysI/O banking to support multiple interface standards and flexible pin banking.
  • Clocking and Timing — Avant platform clock architecture including on‑chip oscillator, PLL, global and regional clocks, dynamic clock select and control, and DLL delay elements for precise timing management.
  • Memory Subsystem (sysMEM) — Features documented in the Avant platform such as bus size matching, RAM initialization/ROM operation, memory cascading, single/dual/pseudo-dual port modes, and FIFO modes.
  • DSP and Processing — Dedicated sysDSP resources integrated into the Avant architecture for arithmetic and signal-processing functions.
  • High‑Speed Interfaces — Platform-level SERDES/PMA and PCS blocks with multi-protocol PHY integration and DDRPHY support for DDR memory interfaces (as described in the Avant platform overview).
  • Package and Mounting — 676‑FCBGA (27×27) package, surface-mount for compact board integration.
  • Electrical and Environmental — Voltage supply specified as 820 mV to 820 mV; commercial-grade operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Memory Interface and Acceleration — Leveraging sysMEM features and DDRPHY support to implement memory controllers, buffers, and memory-centric accelerators.
  • High‑Speed Serial Connectivity — Utilizing SERDES/PMA and PCS blocks for multi-protocol serial links and PHY integration in communication and networking endpoints.
  • Signal Processing and Compute Offload — Employing sysDSP and abundant logic elements for DSP kernels, hardware accelerators, and real‑time processing tasks.

Unique Advantages

  • Substantial Logic Density: 262,000 logic elements enable complex designs and integration of multiple functions into a single device, reducing board-level component count.
  • Integrated Memory Resources: Approximately 1.74 Mbits of embedded RAM (sysMEM) supports local data storage, FIFO implementations, and memory cascades for larger buffering needs.
  • Comprehensive Clocking Suite: On‑chip oscillator, PLLs, global/regional clocks, and dynamic clock controls help designers implement precise, multi-domain timing strategies.
  • Flexible I/O and PHY Support: 298 I/O and platform SERDES/DDR capabilities allow adaptation to diverse interface requirements without extensive external logic.
  • Compact Package: The 676‑FCBGA (27×27) surface-mount package offers high integration density for space-constrained designs.

Why Choose LAV-AT-G30-2LFG676C?

The LAV-AT-G30-2LFG676C delivers a high-capacity Avant™-G FPGA fabric with integrated memory, DSP resources, and a robust clocking and I/O architecture—assembled in a compact 676‑FCBGA package. Its combination of 262,000 logic elements, approximately 1.74 Mbits of on‑chip RAM, and multi‑protocol I/O capabilities makes it well suited for designs that require significant programmable logic, memory interfacing, and high‑speed connectivity.

Designed for commercial temperature environments and RoHS compliant, this device addresses mid- to high‑density FPGA use cases where integration density, flexible memory modes, and advanced clocking are key selection criteria. The Avant platform documentation provides further architectural detail to support design planning and implementation.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for LAV-AT-G30-2LFG676C.

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