LAV-AT-G30-2ASG410C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 196 1740800 262000 410-BGA, WLCSP

Quantity 1,089 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package410-WLCSP (11x9)GradeCommercialOperating Temperature0°C – 85°C
Package / Case410-BGA, WLCSPNumber of I/O196Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-G30-2ASG410C – Avant™-G FPGA, 262,000 logic elements, approximately 1.74 Mbits RAM, 196 I/Os, 410-WLCSP

The LAV-AT-G30-2ASG410C is an Avant™-G field-programmable gate array (FPGA) offered in a compact 410-WLCSP package. It provides 262,000 logic elements, approximately 1.74 Mbits of on-chip RAM, and 196 user I/Os in a commercial-grade surface-mount device.

Built on the Avant platform architecture, the device targets designs that require flexible logic resources, embedded memory, and integrated I/O and SerDes/PHY capabilities. It is specified for a single-supply operating point (820 mV) and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity — 262,000 logic elements (programmable functional units) for implementing combinational and sequential logic, custom accelerators, and glue logic.
  • Embedded Memory — Approximately 1.74 Mbits of on-chip RAM with sysMEM features including single, dual and pseudo-dual port modes, FIFO modes, and memory cascading.
  • Programmable I/O — 196 I/Os with programmable I/O cell (PIC) functionality including input, output and tri-state register blocks and support for multiple sysI/O standards as provided by the Avant platform.
  • Clocking and Timing — Integrated clocking infrastructure including on-chip oscillator, PLL, global (GCLK) and regional (RCLK) clock networks, edge clocks (ECLK) and PHYCLK, plus clock synchronizers and dynamic clock control options described in the platform datasheet.
  • DSP and Processing Blocks — sysDSP resources for arithmetic and signal-processing tasks as described in the Avant architecture overview.
  • DDR Memory Support — DDRPHY and DQS grouping support for external DDR memory interfaces as documented for the Avant platform.
  • SERDES and PHY — Integrated SERDES/PMA and multi-protocol PCS/PHY building blocks for high-speed serial protocols as part of the Avant family architecture.
  • Device Configuration & Reliability — Enhanced configuration options, JTAG support, and Single Event Upset (SEU) handling mechanisms referenced in the platform documentation.
  • Package & Mounting — 410-BGA WLCSP (supplier package: 410-WLCSP (11×9)), surface-mount mounting type for compact board-area designs.
  • Power & Temperature — Specified supply voltage 820 mV and commercial operating temperature range 0 °C to 85 °C.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • High-speed interface bridging — Implement protocol adaptation and SerDes-based link logic using the device’s SERDES/PCS and flexible I/O resources.
  • Memory controller and buffering — Use the DDRPHY support and sysMEM features for external memory interfaces, FIFO buffering, and memory-matching logic.
  • Signal processing and DSP — Leverage the sysDSP blocks and abundant logic elements for fixed-point signal chains, filtering, and other processing kernels.
  • Custom peripheral integration — Consolidate custom peripherals, glue logic, and I/O adaptation within a single compact WLCSP package to reduce board complexity.

Unique Advantages

  • Significant logic density: 262,000 logic elements enable substantial on-chip implementation of control, processing, and interface functions.
  • Compact package: 410-WLCSP (11×9) package provides high I/O count and a small PCB footprint for space-constrained applications.
  • Flexible memory architecture: Approximately 1.74 Mbits of embedded memory with multiple port and FIFO modes simplifies buffering and data-path design.
  • Integrated clocking and PHY features: On-chip PLLs, oscillator, and multi-level clock networks combined with SERDES/PHY primitives support complex timing and high-speed I/O needs.
  • Commercial-grade supply and temperature: Defined supply point (820 mV) and 0 °C to 85 °C operating range for mainstream electronics applications.
  • Platform-level documentation: The Avant platform datasheet details architecture-level features (routing, PFU blocks, sysI/O, DDR support, and configuration options) to guide system-level integration.

Why Choose LAV-AT-G30-2ASG410C?

The LAV-AT-G30-2ASG410C delivers a balanced combination of logic capacity, embedded memory, and a rich I/O/PHY feature set in a compact 410-WLCSP package. Its Avant platform architecture provides documented clocking, memory, DSP, and high-speed interface building blocks to support medium- to high-complexity FPGA designs.

This commercial‑grade FPGA is suited for designers seeking a dense, integrated solution for custom logic, interface bridging, memory interfacing, and signal processing within a defined supply and temperature envelope. The platform-level documentation supports system integration and configuration trade-offs during development.

Request a quote or submit an inquiry to receive pricing, lead time, and availability for LAV-AT-G30-2ASG410C. Our team can provide additional technical information and support to evaluate this device for your design.

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