LAV-AT-G30-1LFG676I
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA |
|---|---|
| Quantity | 553 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-G30-1LFG676I – Avant™-G FPGA (676‑FCBGA, Industrial)
The LAV-AT-G30-1LFG676I is an Avant™-G field programmable gate array (FPGA) IC from Lattice Semiconductor, built on the Lattice Avant platform. This device delivers 262,000 logic elements with approximately 1.74 Mbits of embedded RAM and supports 298 I/Os, providing a high-density programmable fabric for complex digital designs.
Packaged in a 676‑ball FCBGA (27×27) surface-mount package and rated for industrial operation (–40 °C to 100 °C), the device leverages platform architecture elements such as programmable functional units, on-chip memory (sysMEM), DSP resources (sysDSP), programmable I/O cells, an advanced clocking hierarchy (on-chip oscillator, PLL, global/regional clocks), and high-speed PHY/PCS/SERDES and DDR support as documented in the Avant platform datasheet.
Key Features
- Core Logic 262,000 logic elements provide a high-density programmable fabric suitable for sizeable logic integration and custom processing pipelines.
- Embedded Memory Approximately 1.74 Mbits of on-chip RAM (sysMEM) for data buffering, FIFOs, and memory-coupled logic architectures.
- I/O Capacity 298 general-purpose I/Os to support broad peripheral connectivity and multi-bank interfacing.
- Clocking and Timing Platform-level clock features include an on-chip oscillator, PLLs, global and regional clock domains, and dynamic clock control options described in the Avant documentation.
- High-Speed Interfaces Platform support for SERDES/PMA blocks, Multi-Protocol PCS/MPPHY integration, and DDRPHY enable high-speed serial links and DDR memory interfacing as part of the Avant architecture.
- Package & Mounting 676‑ball FCBGA (27×27) surface-mount package for high-density board integration.
- Power Supply specification listed at 820 mV.
- Industrial Qualification Rated for operation from –40 °C to 100 °C and supplied as an industrial-grade FPGA; RoHS compliant.
- Configuration & Reliability Platform-level configuration options and device management features (JTAG, SEU handling) are described in the Avant platform documentation.
Typical Applications
- High‑performance embedded processing Use the device's 262,000 logic elements and sysDSP resources to implement custom compute blocks, signal processing, and control logic.
- High‑speed data connectivity Leverage platform SERDES, PCS, and MPPHY capabilities for multi‑protocol serial links and protocol bridging.
- Memory interface and buffering Integrate DDRPHY and sysMEM features for memory controllers, buffering, and high-throughput data paths.
- Industrial control and automation Industrial temperature rating and extensive I/O count support robust control, monitoring, and deterministic I/O handling in industrial systems.
Unique Advantages
- High logic density: 262,000 logic elements enable consolidation of multiple functions into a single device, reducing overall system complexity.
- Integrated on‑chip memory: Approximately 1.74 Mbits of embedded RAM simplifies data buffering and on-chip storage without relying solely on external memory.
- Large I/O complement: 298 I/Os accommodate extensive peripheral interfacing and flexible bank partitioning for mixed-signal or multi-voltage designs.
- Industrial temperature range: Rated from –40 °C to 100 °C for deployment in thermally demanding environments.
- Platform-level connectivity: Avant platform features for clocking, DDR support, and SERDES/PCS integration allow designers to implement high-speed interfaces and complex timing architectures.
- Compact, high-density packaging: 676‑FCBGA (27×27) package supports integration into space-constrained boards while maintaining signal density.
Why Choose LAV-AT-G30-1LFG676I?
The LAV-AT-G30-1LFG676I positions itself as a high-density, industrial-grade FPGA option within the Lattice Avant platform family. With 262,000 logic elements, approximately 1.74 Mbits of embedded RAM, and 298 I/Os, it is suited to designs that require substantial on-chip logic, memory, and connectivity while operating across a wide temperature range.
Designers benefit from platform-level architectural features—programmable functional units, sysMEM, sysDSP, advanced clocking, and high-speed PHY/PCS resources—documented in the Avant series datasheet, enabling scalable implementations of processing, interface, and control functions in a single device footprint.
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