LAV-AT-G30-1LFG676I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA

Quantity 553 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-G30-1LFG676I – Avant™-G FPGA (676‑FCBGA, Industrial)

The LAV-AT-G30-1LFG676I is an Avant™-G field programmable gate array (FPGA) IC from Lattice Semiconductor, built on the Lattice Avant platform. This device delivers 262,000 logic elements with approximately 1.74 Mbits of embedded RAM and supports 298 I/Os, providing a high-density programmable fabric for complex digital designs.

Packaged in a 676‑ball FCBGA (27×27) surface-mount package and rated for industrial operation (–40 °C to 100 °C), the device leverages platform architecture elements such as programmable functional units, on-chip memory (sysMEM), DSP resources (sysDSP), programmable I/O cells, an advanced clocking hierarchy (on-chip oscillator, PLL, global/regional clocks), and high-speed PHY/PCS/SERDES and DDR support as documented in the Avant platform datasheet.

Key Features

  • Core Logic  262,000 logic elements provide a high-density programmable fabric suitable for sizeable logic integration and custom processing pipelines.
  • Embedded Memory  Approximately 1.74 Mbits of on-chip RAM (sysMEM) for data buffering, FIFOs, and memory-coupled logic architectures.
  • I/O Capacity  298 general-purpose I/Os to support broad peripheral connectivity and multi-bank interfacing.
  • Clocking and Timing  Platform-level clock features include an on-chip oscillator, PLLs, global and regional clock domains, and dynamic clock control options described in the Avant documentation.
  • High-Speed Interfaces  Platform support for SERDES/PMA blocks, Multi-Protocol PCS/MPPHY integration, and DDRPHY enable high-speed serial links and DDR memory interfacing as part of the Avant architecture.
  • Package & Mounting  676‑ball FCBGA (27×27) surface-mount package for high-density board integration.
  • Power  Supply specification listed at 820 mV.
  • Industrial Qualification  Rated for operation from –40 °C to 100 °C and supplied as an industrial-grade FPGA; RoHS compliant.
  • Configuration & Reliability  Platform-level configuration options and device management features (JTAG, SEU handling) are described in the Avant platform documentation.

Typical Applications

  • High‑performance embedded processing  Use the device's 262,000 logic elements and sysDSP resources to implement custom compute blocks, signal processing, and control logic.
  • High‑speed data connectivity  Leverage platform SERDES, PCS, and MPPHY capabilities for multi‑protocol serial links and protocol bridging.
  • Memory interface and buffering  Integrate DDRPHY and sysMEM features for memory controllers, buffering, and high-throughput data paths.
  • Industrial control and automation  Industrial temperature rating and extensive I/O count support robust control, monitoring, and deterministic I/O handling in industrial systems.

Unique Advantages

  • High logic density: 262,000 logic elements enable consolidation of multiple functions into a single device, reducing overall system complexity.
  • Integrated on‑chip memory: Approximately 1.74 Mbits of embedded RAM simplifies data buffering and on-chip storage without relying solely on external memory.
  • Large I/O complement: 298 I/Os accommodate extensive peripheral interfacing and flexible bank partitioning for mixed-signal or multi-voltage designs.
  • Industrial temperature range: Rated from –40 °C to 100 °C for deployment in thermally demanding environments.
  • Platform-level connectivity: Avant platform features for clocking, DDR support, and SERDES/PCS integration allow designers to implement high-speed interfaces and complex timing architectures.
  • Compact, high-density packaging: 676‑FCBGA (27×27) package supports integration into space-constrained boards while maintaining signal density.

Why Choose LAV-AT-G30-1LFG676I?

The LAV-AT-G30-1LFG676I positions itself as a high-density, industrial-grade FPGA option within the Lattice Avant platform family. With 262,000 logic elements, approximately 1.74 Mbits of embedded RAM, and 298 I/Os, it is suited to designs that require substantial on-chip logic, memory, and connectivity while operating across a wide temperature range.

Designers benefit from platform-level architectural features—programmable functional units, sysMEM, sysDSP, advanced clocking, and high-speed PHY/PCS resources—documented in the Avant series datasheet, enabling scalable implementations of processing, interface, and control functions in a single device footprint.

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