LAV-AT-G30-1ASG410I
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 196 1740800 262000 410-BGA, WLCSP |
|---|---|
| Quantity | 900 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 410-WLCSP (11x9) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 410-BGA, WLCSP | Number of I/O | 196 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-G30-1ASG410I – Avant™-G Field Programmable Gate Array (FPGA) IC, 262,000 logic elements, ~1.74 Mbits RAM, 196 I/Os, 410‑WLCSP
The LAV-AT-G30-1ASG410I is an Avant™-G FPGA from Lattice Semiconductor, delivered in a 410‑WLCSP (11×9) surface-mount package. It combines a large programmable fabric with embedded memory and a comprehensive peripheral and clocking architecture described in the Avant platform overview.
Targeted for industrial applications, this device provides a balance of programmable logic capacity, on-chip memory, and I/O density for designs that require integration of memory interfaces, DSP acceleration, and multi‑protocol connectivity while operating from a low supply voltage.
Key Features
- Core Capacity — 262,000 logic element cells provide substantial programmable resource for complex logic, protocol bridges, and custom accelerators.
- Embedded Memory — Approximately 1.74 Mbits of on-chip RAM (1,740,800 bits) with support for single, dual and pseudo-dual port modes, memory cascading and FIFO configurations.
- I/O Density — 196 available I/O pins in a compact package to support multiple peripheral interfaces and board-level connectivity.
- Power Supply — Device supply specified at 820 mV, enabling integration into low-voltage system architectures.
- Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
- Package & Mounting — 410‑WLCSP (11×9) surface-mount package offering high I/O count in a small footprint.
- Clocking and Timing — Avant platform clock architecture includes on‑chip oscillator, PLL, global and regional clocks, edge clocks, dynamic clock select/control and DLL delay support for versatile timing schemes.
- sysMEM & Memory Features — RAM initialization and ROM operation, bus-size matching, memory output reset and dedicated modes for FIFO and cascading as described in the platform documentation.
- sysDSP — Dedicated DSP resources on the Avant platform to support arithmetic and signal-processing functions.
- Programmable I/O and Standards — Programmable I/O cell (PIC) structure and banking scheme with input/output/tri-state register blocks to support a range of I/O requirements.
- DDR Support & PHY — DDRPHY support and DQS grouping for DDR memory interfaces as part of the platform capability set.
- SERDES and Multi‑Protocol PHY/PCS — Platform-level SERDES/PMA blocks and multi-protocol PCS/PHY integration for high-speed serial connectivity options.
- Configuration & Reliability — Device configuration features include enhanced configuration options, JTAG access, SEU handling and trace ID functionality referenced in the Avant documentation.
Typical Applications
- High‑Speed Memory Interfaces — Implement DDR memory controllers and buffering using the device’s DDRPHY support, DQS grouping and embedded sysMEM resources.
- Multi‑Protocol Connectivity — Integrate SERDES and Multi‑Protocol PCS/PHY blocks for serial link bridging, protocol translation, and high‑speed communications.
- Signal Processing & Acceleration — Deploy sysDSP resources alongside abundant logic elements and on‑chip RAM for real‑time filtering, FFTs, and sensor data processing.
- Embedded Control & Custom Logic — Use plentiful I/Os and programmable fabric to implement control logic, protocol offload, and system glue in industrial-grade environments.
Unique Advantages
- Substantial programmable capacity: 262,000 logic element cells enable implementation of complex state machines, datapaths, and custom accelerators without external ASICs.
- On‑chip memory for buffering and local storage: Approximately 1.74 Mbits of embedded RAM supports FIFOs, frame buffers and tightly coupled memory for DSP operations.
- Comprehensive clocking fabric: On‑chip oscillator, PLLs, multi‑level clock domains and dynamic clock controls facilitate flexible timing architectures and clock domain management.
- Compact, high‑density package: 196 I/Os in a 410‑WLCSP (11×9) surface‑mount package minimizes board area while maintaining I/O capability.
- Industrial‑range operation and compliance: −40 °C to 100 °C operating range and RoHS compliance for deployment in industrial applications.
- Platform‑level connectivity and memory support: SERDES/PMA, MPPCS/MPPHY integration and DDRPHY support simplify implementation of high‑speed interfaces and memory subsystems.
Why Choose LAV-AT-G30-1ASG410I?
The LAV-AT-G30-1ASG410I combines the Avant platform’s architectural features with a high logic‑element count, substantial on‑chip memory and a dense I/O footprint in a compact WLCSP package. Its documented clocking, memory and interface blocks enable designers to integrate DSP, memory controllers and multi‑protocol connectivity into a single device while meeting industrial temperature requirements.
This device is appropriate for engineers seeking a scalable FPGA solution that balances programmable capacity, embedded resources and package density for industrial applications, custom accelerators and high‑speed interface designs. Platform-level configuration and reliability features help support long-term deployment and system integration.
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