LAV-AT-G30-1ASG410I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 196 1740800 262000 410-BGA, WLCSP

Quantity 900 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package410-WLCSP (11x9)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case410-BGA, WLCSPNumber of I/O196Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-G30-1ASG410I – Avant™-G Field Programmable Gate Array (FPGA) IC, 262,000 logic elements, ~1.74 Mbits RAM, 196 I/Os, 410‑WLCSP

The LAV-AT-G30-1ASG410I is an Avant™-G FPGA from Lattice Semiconductor, delivered in a 410‑WLCSP (11×9) surface-mount package. It combines a large programmable fabric with embedded memory and a comprehensive peripheral and clocking architecture described in the Avant platform overview.

Targeted for industrial applications, this device provides a balance of programmable logic capacity, on-chip memory, and I/O density for designs that require integration of memory interfaces, DSP acceleration, and multi‑protocol connectivity while operating from a low supply voltage.

Key Features

  • Core Capacity — 262,000 logic element cells provide substantial programmable resource for complex logic, protocol bridges, and custom accelerators.
  • Embedded Memory — Approximately 1.74 Mbits of on-chip RAM (1,740,800 bits) with support for single, dual and pseudo-dual port modes, memory cascading and FIFO configurations.
  • I/O Density — 196 available I/O pins in a compact package to support multiple peripheral interfaces and board-level connectivity.
  • Power Supply — Device supply specified at 820 mV, enabling integration into low-voltage system architectures.
  • Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
  • Package & Mounting — 410‑WLCSP (11×9) surface-mount package offering high I/O count in a small footprint.
  • Clocking and Timing — Avant platform clock architecture includes on‑chip oscillator, PLL, global and regional clocks, edge clocks, dynamic clock select/control and DLL delay support for versatile timing schemes.
  • sysMEM & Memory Features — RAM initialization and ROM operation, bus-size matching, memory output reset and dedicated modes for FIFO and cascading as described in the platform documentation.
  • sysDSP — Dedicated DSP resources on the Avant platform to support arithmetic and signal-processing functions.
  • Programmable I/O and Standards — Programmable I/O cell (PIC) structure and banking scheme with input/output/tri-state register blocks to support a range of I/O requirements.
  • DDR Support & PHY — DDRPHY support and DQS grouping for DDR memory interfaces as part of the platform capability set.
  • SERDES and Multi‑Protocol PHY/PCS — Platform-level SERDES/PMA blocks and multi-protocol PCS/PHY integration for high-speed serial connectivity options.
  • Configuration & Reliability — Device configuration features include enhanced configuration options, JTAG access, SEU handling and trace ID functionality referenced in the Avant documentation.

Typical Applications

  • High‑Speed Memory Interfaces — Implement DDR memory controllers and buffering using the device’s DDRPHY support, DQS grouping and embedded sysMEM resources.
  • Multi‑Protocol Connectivity — Integrate SERDES and Multi‑Protocol PCS/PHY blocks for serial link bridging, protocol translation, and high‑speed communications.
  • Signal Processing & Acceleration — Deploy sysDSP resources alongside abundant logic elements and on‑chip RAM for real‑time filtering, FFTs, and sensor data processing.
  • Embedded Control & Custom Logic — Use plentiful I/Os and programmable fabric to implement control logic, protocol offload, and system glue in industrial-grade environments.

Unique Advantages

  • Substantial programmable capacity: 262,000 logic element cells enable implementation of complex state machines, datapaths, and custom accelerators without external ASICs.
  • On‑chip memory for buffering and local storage: Approximately 1.74 Mbits of embedded RAM supports FIFOs, frame buffers and tightly coupled memory for DSP operations.
  • Comprehensive clocking fabric: On‑chip oscillator, PLLs, multi‑level clock domains and dynamic clock controls facilitate flexible timing architectures and clock domain management.
  • Compact, high‑density package: 196 I/Os in a 410‑WLCSP (11×9) surface‑mount package minimizes board area while maintaining I/O capability.
  • Industrial‑range operation and compliance: −40 °C to 100 °C operating range and RoHS compliance for deployment in industrial applications.
  • Platform‑level connectivity and memory support: SERDES/PMA, MPPCS/MPPHY integration and DDRPHY support simplify implementation of high‑speed interfaces and memory subsystems.

Why Choose LAV-AT-G30-1ASG410I?

The LAV-AT-G30-1ASG410I combines the Avant platform’s architectural features with a high logic‑element count, substantial on‑chip memory and a dense I/O footprint in a compact WLCSP package. Its documented clocking, memory and interface blocks enable designers to integrate DSP, memory controllers and multi‑protocol connectivity into a single device while meeting industrial temperature requirements.

This device is appropriate for engineers seeking a scalable FPGA solution that balances programmable capacity, embedded resources and package density for industrial applications, custom accelerators and high‑speed interface designs. Platform-level configuration and reliability features help support long-term deployment and system integration.

Request a quote or submit an inquiry to receive pricing and availability information for the LAV-AT-G30-1ASG410I.

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