LAV-AT-E70-3LFG1156I
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 553 4239360 637000 1156-BBGA, FCBGA |
|---|---|
| Quantity | 154 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 553 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-E70-3LFG1156I – Avant™-E FPGA, 1156‑FCBGA (35×35)
The LAV-AT-E70-3LFG1156I is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It implements the Avant platform architecture described in the product datasheet, including programmable functional units, on-chip memory and DSP resources, a comprehensive clocking structure, and high-speed I/O subsystems.
Targeted at industrial-grade designs, this device delivers a high logic element count, substantial embedded memory, and a large I/O complement in a compact 1156‑FCBGA package, supporting designs that require dense programmable logic and flexible I/O capability across an extended temperature range.
Key Features
- Core Logic Density Approximately 637,000 logic elements available for implementing complex programmable logic and custom datapaths.
- Embedded Memory Approximately 4.24 Mbits of on-chip RAM (total RAM bits: 4,239,360) for local buffering, FIFOs, and memory-mapped logic.
- I/O Capacity 553 user I/O pins to support extensive peripheral and system interfacing requirements.
- Clocking and Timing Integrated clocking architecture with on-chip oscillator and PLL resources, plus global, regional, and edge clock domains as described in the Avant platform overview.
- Programmable I/O and PHY Programmable I/O cells, sysI/O banking, DDRPHY support, and SERDES/PCS blocks are included in the Avant platform documentation for high-speed interface implementations.
- DSP Resources sysDSP blocks are part of the platform architecture to accelerate arithmetic and signal-processing tasks (see platform documentation).
- Configuration and Reliability Device configuration options include JTAG and documented SEU handling provisions outlined in the Avant platform datasheet.
- Package and Mounting Supplied in a 1156‑FCBGA (35×35 mm) package; mounting type is surface mount.
- Supply and Temperature Voltage supply listed as 820 mV; industrial operating temperature range from -40 °C to 100 °C.
- RoHS Compliance RoHS status: Compliant.
Typical Applications
- Industrial Control Systems Industrial-grade FPGA resources and extended temperature range make the device suitable for programmable logic in control and automation equipment.
- High‑I/O Embedded Systems Large I/O count supports systems requiring many peripheral connections and flexible pin usage.
- Memory‑Rich, Logic‑Intensive Designs Substantial on-chip RAM and high logic element count enable local buffering and complex state machines or datapaths.
Unique Advantages
- High Logic Capacity: The device’s approximately 637,000 logic elements enable integration of large custom functions and complex control logic into a single FPGA.
- Significant Embedded Memory: Roughly 4.24 Mbits of on-chip RAM reduces dependence on external memory for many buffering and FIFO use cases.
- Large I/O Footprint: 553 I/O pins facilitate rich peripheral connectivity and system interfacing without extensive external multiplexing.
- Comprehensive On‑Chip Resources: The Avant platform’s documented features—clocking, PLLs, DDRPHY, sysDSP, and SERDES/PCS—provide integrated building blocks for common FPGA functions.
- Industrial‑Grade Operation: Specified operating range from -40 °C to 100 °C supports deployment in environments requiring wider temperature tolerance.
- Compact FCBGA Packaging: The 1156‑FCBGA (35×35) package delivers high integration density in a surface-mount form factor.
Why Choose LAV-AT-E70-3LFG1156I?
The LAV-AT-E70-3LFG1156I offers a balance of high logic density, meaningful on-chip memory, and a large I/O complement within the Avant platform architecture. Its documented clocking, memory, DSP and I/O subsystems let engineers implement complex, memory- and I/O-intensive applications while keeping system integration compact.
This device is positioned for customers developing industrial-grade programmable logic solutions that require scalability, substantial embedded resources, and support for high-speed interfaces as described in the Avant platform documentation.
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