LAV-AT-E70-3LFG1156I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 553 4239360 637000 1156-BBGA, FCBGA

Quantity 154 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O553Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-3LFG1156I – Avant™-E FPGA, 1156‑FCBGA (35×35)

The LAV-AT-E70-3LFG1156I is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It implements the Avant platform architecture described in the product datasheet, including programmable functional units, on-chip memory and DSP resources, a comprehensive clocking structure, and high-speed I/O subsystems.

Targeted at industrial-grade designs, this device delivers a high logic element count, substantial embedded memory, and a large I/O complement in a compact 1156‑FCBGA package, supporting designs that require dense programmable logic and flexible I/O capability across an extended temperature range.

Key Features

  • Core Logic Density  Approximately 637,000 logic elements available for implementing complex programmable logic and custom datapaths.
  • Embedded Memory  Approximately 4.24 Mbits of on-chip RAM (total RAM bits: 4,239,360) for local buffering, FIFOs, and memory-mapped logic.
  • I/O Capacity  553 user I/O pins to support extensive peripheral and system interfacing requirements.
  • Clocking and Timing  Integrated clocking architecture with on-chip oscillator and PLL resources, plus global, regional, and edge clock domains as described in the Avant platform overview.
  • Programmable I/O and PHY  Programmable I/O cells, sysI/O banking, DDRPHY support, and SERDES/PCS blocks are included in the Avant platform documentation for high-speed interface implementations.
  • DSP Resources  sysDSP blocks are part of the platform architecture to accelerate arithmetic and signal-processing tasks (see platform documentation).
  • Configuration and Reliability  Device configuration options include JTAG and documented SEU handling provisions outlined in the Avant platform datasheet.
  • Package and Mounting  Supplied in a 1156‑FCBGA (35×35 mm) package; mounting type is surface mount.
  • Supply and Temperature  Voltage supply listed as 820 mV; industrial operating temperature range from -40 °C to 100 °C.
  • RoHS Compliance  RoHS status: Compliant.

Typical Applications

  • Industrial Control Systems  Industrial-grade FPGA resources and extended temperature range make the device suitable for programmable logic in control and automation equipment.
  • High‑I/O Embedded Systems  Large I/O count supports systems requiring many peripheral connections and flexible pin usage.
  • Memory‑Rich, Logic‑Intensive Designs  Substantial on-chip RAM and high logic element count enable local buffering and complex state machines or datapaths.

Unique Advantages

  • High Logic Capacity: The device’s approximately 637,000 logic elements enable integration of large custom functions and complex control logic into a single FPGA.
  • Significant Embedded Memory: Roughly 4.24 Mbits of on-chip RAM reduces dependence on external memory for many buffering and FIFO use cases.
  • Large I/O Footprint: 553 I/O pins facilitate rich peripheral connectivity and system interfacing without extensive external multiplexing.
  • Comprehensive On‑Chip Resources: The Avant platform’s documented features—clocking, PLLs, DDRPHY, sysDSP, and SERDES/PCS—provide integrated building blocks for common FPGA functions.
  • Industrial‑Grade Operation: Specified operating range from -40 °C to 100 °C supports deployment in environments requiring wider temperature tolerance.
  • Compact FCBGA Packaging: The 1156‑FCBGA (35×35) package delivers high integration density in a surface-mount form factor.

Why Choose LAV-AT-E70-3LFG1156I?

The LAV-AT-E70-3LFG1156I offers a balance of high logic density, meaningful on-chip memory, and a large I/O complement within the Avant platform architecture. Its documented clocking, memory, DSP and I/O subsystems let engineers implement complex, memory- and I/O-intensive applications while keeping system integration compact.

This device is positioned for customers developing industrial-grade programmable logic solutions that require scalability, substantial embedded resources, and support for high-speed interfaces as described in the Avant platform documentation.

Request a quote or submit an inquiry to our sales team to discuss availability, pricing, and integration support for the LAV-AT-E70-3LFG1156I.

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