LAV-AT-E70-3LFG676I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 297 4239360 637000 676-BBGA, FCBGA

Quantity 1,878 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O297Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-3LFG676I – Avant™-E Field Programmable Gate Array (FPGA) IC 297 4239360 637000 676-BBGA, FCBGA

The LAV-AT-E70-3LFG676I is an Avant™-E FPGA device that integrates a high-capacity programmable fabric with advanced on‑chip memory, DSP resources, clocking and high-speed I/O capabilities described in the Avant platform overview. Its architecture exposes programmable functional units, rich routing and a full suite of clocking and PHY features to support complex logic, memory and protocol implementations.

Designed for applications that require dense logic, embedded memory and flexible I/O, this device delivers a combination of capacity and system-level features—making it suitable for designs that need integrated DSP, DDR memory interfaces, SERDES/PCS blocks and extensive programmable I/O in a 676‑FBGA package.

Key Features

  • Logic Capacity — 637,000 logic elements (programmable logic resources) to implement large, complex designs.
  • Embedded Memory — Approximately 4.24 Mbits of on‑chip RAM (4,239,360 bits) with support for initialization, cascading, single/dual/pseudo‑dual port and FIFO modes as described for the sysMEM blocks.
  • I/O and Packaging — 297 I/O pins in a 676‑FCBGA (27×27) package; surface‑mount mounting for compact board integration.
  • Industrial Operating Range — Rated for industrial grade operation from ‑40 °C to 100 °C; RoHS compliant.
  • Power Supply — Device supply voltage specified at 0.82 V (820 mV) per product data.
  • Clocking and Timing — Rich clocking architecture including on‑chip oscillator, PLLs, global/regional/edge clocks, PHYCLK, dynamic clock select/control and DLL delay resources to support complex timing domains.
  • DSP and Compute — Integrated sysDSP resources to support high‑performance signal processing and arithmetic workloads.
  • Memory Interface and PHY — Dedicated DDRPHY blocks and DQS grouping support for DDR memory interfaces.
  • SERDES and Protocol Support — SERDES/PMA blocks and Multi‑Protocol PCS (MPPCS) plus Multi‑Protocol PHY (MPPHY) integration for high‑speed link implementations.
  • Programmable I/O Cell (PIC) — Configurable input, output and tri‑state register blocks and support for multiple I/O standards and banking schemes.
  • Configuration and Debug — Enhanced configuration options, JTAG support and SEU handling mechanisms described for device configuration and reliability.

Typical Applications

  • Communications & Networking — Implement protocol engines, packet processing and high‑speed links using integrated SERDES, MPPCS/MPPHY and abundant logic and memory resources.
  • Industrial Control & Automation — Deploy control, motor drive and sensor‑fusion functions that benefit from the industrial temperature range and large programmable fabric.
  • High‑Speed Memory Interfaces — Design DDR interfaces and memory controllers leveraging built‑in DDRPHY and sysMEM features for buffering and data path handling.
  • Signal Processing & Embedded Compute — Use sysDSP blocks together with large on‑chip RAM and logic capacity for filtering, transforms and custom compute accelerators.

Unique Advantages

  • High Integration of Logic and Memory: 637,000 logic elements and approximately 4.24 Mbits of on‑chip RAM provide the resources to consolidate functions that otherwise require multiple components.
  • Comprehensive I/O and High‑Speed Links: 297 I/Os in a 676‑FCBGA package with SERDES/PHY support reduces external interface complexity for protocol and link implementations.
  • Robust Clocking and Timing Tools: On‑chip oscillator, PLLs, multiple clock domains and DLL support enable precise timing control for multi‑domain systems.
  • Designed for System-Level Memory Support: Dedicated DDRPHY and DQS grouping simplify implementation of DDR memory interfaces and high‑bandwidth data paths.
  • Industrial Reliability: Industrial grade temperature rating (‑40 °C to 100 °C) and RoHS compliance support deployment in demanding environments.

Why Choose LAV-AT-E70-3LFG676I?

The LAV-AT-E70-3LFG676I brings Avant‑E platform capabilities into a high‑capacity FPGA package that combines large programmable logic, meaningful embedded memory, DSP resources and sophisticated I/O/PHY features. Its architecture—covering programmable functional units, rich routing, clocking and multi‑protocol PHY/SERDES—lets designers integrate complex digital, memory and high‑speed I/O functions on a single device.

This device is suited for engineers and system designers who need a scalable, high‑integration FPGA with industrial temperature operation and comprehensive on‑chip resources for communication, control and signal processing systems. The platform features described in the Avant documentation provide the building blocks to implement advanced timing, memory and interface architectures within a single footprint.

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