LAV-AT-E70-3LFG676C

The LAV-AT-E70-3LFG676C is an Avant™-E Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It integrates a high logic element count with substantial on-chip memory and a flexible I/O complement in a 676‑FCBGA (27×27) surface-mount package for commercial-grade deployments.

Architected for complex programmable logic, the device includes on-chip memory, DSP resources, advanced clocking, DDR PHY capability and multi-protocol SERDES/PMA building blocks as described in the Avant platform documentation. Its combination of 637,000 logic elements, approximately 4.24 Mbits of embedded memory, and 297 I/Os targets designs that require dense logic capacity and extensive I/O in a compact package.

Key Features

• Core Logic  637,000 logic elements providing a high-capacity programmable fabric suitable for complex logic integration as documented for the Avant platform.
• Embedded Memory  Approximately 4.24 Mbits of on-chip RAM (4,239,360 bits) with support for single, dual and pseudo-dual port modes, FIFO modes, and RAM initialization/ROM operation as described in the sysMEM section.
• I/O and Packaging  297 general-purpose I/Os in a 676‑FCBGA (27×27) surface-mount package, allowing dense external connectivity in a compact form factor.
• Clocking and Timing  Integrated clocking features including on-chip oscillator, PLL, global and regional clocks, dynamic clock select/control and DLL delay options for flexible timing architectures.
• Memory and DSP Support  sysDSP and sysMEM blocks on the Avant platform provide dedicated resources for signal processing and embedded memory-centric functions; DDR memory support is available via DDRPHY and DQS grouping.
• High-Speed Serial and PHY  SERDES/PMA blocks and multi-protocol PCS/PHY integration are included on the Avant platform for high-speed serial link implementation.
• Configuration and Reliability  Device configuration features include enhanced configuration options, JTAG support and Single Event Upset (SEU) handling mechanisms as outlined in the platform documentation.
• Electrical and Environmental  Nominal supply documented at 820 mV and rated for commercial operating temperatures from 0 °C to 85 °C. The device is RoHS compliant.

Unique Advantages

• High logic density: 637,000 logic elements support large, integrated designs without external programmable logic expansion.
• Substantial embedded memory: Approximately 4.24 Mbits of on-chip RAM enables memory-intensive functions and efficient data buffering on-chip.
• Extensive I/O in a compact package: 297 I/Os in a 676‑FCBGA (27×27) surface-mount package help reduce PCB area while maintaining connectivity options.
• Comprehensive clocking and timing features: On-chip oscillator, PLLs, and dynamic clock control provide flexible clock architectures for synchronized system designs.
• Integrated high-speed interfaces: SERDES/PMA and DDRPHY capabilities simplify implementation of high-speed serial links and external memory interfaces.
• Platform-level design support: The Avant platform documentation details sysMEM, sysDSP, programmable I/O cells, and configuration options to assist system integration and verification.

Why Choose LAV-AT-E70-3LFG676C?

The LAV-AT-E70-3LFG676C combines a high logic element count with on-chip memory, DSP and high-speed I/O building blocks in a compact 676‑FCBGA package, making it suitable for complex programmable systems that need dense logic, significant embedded RAM, and broad I/O capability. Its commercial temperature rating (0 °C to 85 °C) and RoHS compliance align with standard commercial design requirements.

Engineers designing systems that require a balanced mix of logic capacity, memory resources and flexible I/O or PHY options will find the documented Avant platform features—such as clocking, DDR support, SERDES/PMA and configuration mechanisms—helpful for system-level integration and scaling.

Request a quote or submit a pricing request to receive availability and lead-time information for the LAV-AT-E70-3LFG676C.