LAV-AT-E70-3CSG841C
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 502 4239360 637000 841-BGA, FCCSPBGA |
|---|---|
| Quantity | 283 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 841-FCCSP (15x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 841-BGA, FCCSPBGA | Number of I/O | 502 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-E70-3CSG841C – Avant™-E Field Programmable Gate Array (FPGA) IC 502 4239360 637000 841-BGA, FCCSPBGA
The LAV-AT-E70-3CSG841C is an Avant™-E Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation built on the Avant platform. This device provides 637,000 logic elements, approximately 4.24 Mbits of on-chip RAM, and 502 I/Os in an 841-ball FCCSP/BGA package.
Designed for surface-mount applications, the device is specified for commercial-grade operation from 0 °C to 85 °C, with a supply voltage specified at 820 mV and RoHS compliance.
Key Features
- Logic Capacity — 637,000 logic elements to implement complex programmable logic and custom hardware functions.
- Embedded Memory — Approximately 4.24 Mbits of total on-chip RAM for data buffering, state storage, and memory-intensive functions.
- I/O Density — 502 general-purpose I/Os to support dense interfacing and broad peripheral connectivity.
- Package and Mounting — 841-BGA / 841-FCCSP (15×13) supply-device package for compact surface-mount integration.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial deployments.
- Avant Platform Architecture — Platform-level architecture includes programmable functional unit (PFU) blocks, routing, and a flexible clocking structure (on-chip oscillator, PLLs, global/regional/edge clocks) as described in the Avant documentation.
- Memory and DSP Subsystems — Platform includes sysMEM capabilities (single/dual/pseudo-dual port modes, FIFO modes) and sysDSP support for on-chip memory and DSP functions.
- High-Speed Interface Support — Platform documentation references SERDES/PCS blocks, Multi-Protocol PHY (MPPHY) integration, and DDR PHY support for high-speed serial and memory interfaces.
- Configuration and Reliability Features — Device configuration options include enhanced configuration, JTAG access, and Single Event Upset (SEU) handling mechanisms as documented for the Avant platform.
- Standards and Compliance — RoHS compliant; commercial-grade product classification.
Typical Applications
- Protocol and Interface Bridging — Use the device’s SERDES/PCS and Multi-Protocol PHY support to implement high-speed protocol conversion and interface bridging.
- Memory Controller and Buffering — Leverage sysMEM and DDR PHY support for memory controller logic, data buffering, and FIFO implementations.
- Custom DSP and Acceleration — Implement DSP pipelines and custom compute blocks using the platform’s sysDSP and large logic element count.
- Dense I/O Control — Utilize 502 I/Os for board-level peripheral aggregation, sensor interfacing, and complex I/O routing.
Unique Advantages
- High logic density: 637,000 logic elements enable integration of substantial custom logic without extensive external components.
- Significant on-chip memory: Approximately 4.24 Mbits of embedded RAM supports large buffering and state storage directly on-chip.
- Broad I/O count: 502 I/Os provide flexibility for systems that require many external connections or mixed-signal interfacing.
- Flexible platform capabilities: Avant platform features—clocking, PFU blocks, sysMEM, sysDSP, and SERDES/PHY support—offer adaptable building blocks for diverse designs.
- Compact package: 841-FCCSP (15×13) package for dense PCB layouts while maintaining high I/O and logic capacity.
- Commercial readiness: RoHS compliance and a 0 °C to 85 °C operating range align with standard commercial product requirements.
Why Choose LAV-AT-E70-3CSG841C?
The LAV-AT-E70-3CSG841C combines a large logic element count, substantial on-chip memory, and a high I/O count in a compact 841-ball FCCSP/BGA package, providing a platform-oriented FPGA solution. Its architecture and documented platform features—programmable functional units, flexible clocking, memory and DSP subsystems, plus SERDES and DDR PHY support—make it suitable for designs that require integrated logic, memory buffering, and high-speed interface capabilities within a commercial temperature range.
This device is appropriate for engineering teams seeking a programmable solution with measurable capacity and platform-level features, backed by Avant platform documentation and Lattice Semiconductor’s product support materials.
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