LAV-AT-E70-3CBG484C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 349 4239360 637000 484-BGA, FCCSPBGA

Quantity 63 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGA, FCCSPBGANumber of I/O349Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-3CBG484C – Avant™-E Field Programmable Gate Array, 637,000 logic elements, 484-FCCSP (19×19)

The LAV-AT-E70-3CBG484C is an Avant™-E FPGA IC from Lattice Semiconductor designed for commercial embedded designs that require large programmable logic capacity, substantial on-chip memory, and flexible I/O. Built on the Lattice Avant platform, the device integrates a high count of logic elements, multi-megabit embedded RAM, and a dense 484‑ball FCCSP package to support compact, logic‑intensive applications.

Architectural highlights documented in the Avant platform overview include programmable functional units, comprehensive clocking resources, on-chip memory organization and DSP resources, and multi-protocol PHY/serdes support—features intended to enable configurable datapath and interface implementations in commercial systems.

Key Features

  • Core Logic — 637,000 logic element cells provide large programmable logic capacity for complex state machines, datapaths, and custom accelerators.
  • Embedded Memory — Approximately 4.24 Mbits (4,239,360 bits) of on-chip RAM with support for single, dual and pseudo‑dual port modes, FIFO modes, memory cascading, and RAM initialization/ROM operation as described in the Avant sysMEM documentation.
  • I/O and Packaging — 349 I/O signals in a 484‑ball FCCSP package (484‑FCCSP, 19×19 mm) for high-density board integration and flexible external interfacing.
  • Power — Device core supply specified at 820 mV.
  • Commercial Temperature Grade — Operating range from 0 °C to 85 °C, suitable for commercial applications.
  • Clocking and Timing — On‑chip oscillator, PLLs, and a multi-layer clocking structure including global, regional and edge clocks plus dynamic clock control options as outlined in the platform overview.
  • Memory and DSP Subsystems — Dedicated sysMEM and sysDSP blocks provide memory and signal‑processing resources for embedded buffering and arithmetic workloads.
  • Programmable I/O and PHY — Programmable I/O cell (PIC) architecture, sysI/O banking, DDRPHY overview and SERDES/PCS blocks enable configurable I/O standards and high‑speed interface support described in the Avant documentation.
  • Configuration and Diagnostics — Enhanced configuration options, JTAG support, and SEU handling mechanisms are included in the Avant platform specification.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • High‑capacity Logic Implementations — Use the large logic element count for complex control, protocol handling, or custom processing blocks in commercial embedded systems.
  • On‑chip Memory‑intensive Designs — Leverage approximately 4.24 Mbits of embedded RAM for buffering, lookup tables, and intermediate data storage without external memory in some designs.
  • Flexible I/O and Interface Control — 349 I/Os and programmable I/O cells support diverse interface needs including memory interfaces, peripheral control, and multi‑protocol PHY integration.
  • DSP and Accelerator Functions — sysDSP and sysMEM resources enable implementation of arithmetic pipelines, filters, and embedded data‑path accelerators within the FPGA fabric.

Unique Advantages

  • High Logic Density: 637,000 logic element cells enable integration of large, complex designs on a single device, reducing the need for multiple FPGAs.
  • Multi‑Megabit Embedded Memory: Approximately 4.24 Mbits of on‑chip RAM with FIFO, cascading, and multi‑port modes simplifies buffering and memory architecture.
  • Rich Clocking Architecture: On‑chip oscillator, PLLs and configurable clock domains provide flexible timing strategies for mixed‑frequency designs.
  • Flexible I/O and PHY Support: 349 I/Os combined with programmable I/O cell architecture and DDR/serdes building blocks support diverse external interfaces.
  • Compact, High‑density Package: 484‑FCCSP (19×19) package supports dense board layouts where area and I/O count are priorities.
  • Commercial Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose LAV-AT-E70-3CBG484C?

The LAV-AT-E70-3CBG484C positions itself as a commercially graded FPGA solution for teams needing substantial programmable logic, multi‑megabit embedded memory, and broad I/O in a compact 484‑ball FCCSP package. Its feature set—documented in the Lattice Avant platform overview—includes programmable functional units, dedicated memory and DSP blocks, configurable clocking, and PHY/serdes capabilities that collectively support complex embedded and interface‑centric designs.

This device is appropriate for commercial OEMs and system designers seeking a single‑chip platform to consolidate logic, memory, and interface functions while relying on the Avant platform documentation and configuration options for integration and deployment.

If you would like pricing, availability, or a formal quote for the LAV-AT-E70-3CBG484C, submit a quote request or contact sales to initiate the inquiry.

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