LAV-AT-E70-3CBG484C
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 349 4239360 637000 484-BGA, FCCSPBGA |
|---|---|
| Quantity | 63 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCCSP (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA, FCCSPBGA | Number of I/O | 349 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-E70-3CBG484C – Avant™-E Field Programmable Gate Array, 637,000 logic elements, 484-FCCSP (19×19)
The LAV-AT-E70-3CBG484C is an Avant™-E FPGA IC from Lattice Semiconductor designed for commercial embedded designs that require large programmable logic capacity, substantial on-chip memory, and flexible I/O. Built on the Lattice Avant platform, the device integrates a high count of logic elements, multi-megabit embedded RAM, and a dense 484‑ball FCCSP package to support compact, logic‑intensive applications.
Architectural highlights documented in the Avant platform overview include programmable functional units, comprehensive clocking resources, on-chip memory organization and DSP resources, and multi-protocol PHY/serdes support—features intended to enable configurable datapath and interface implementations in commercial systems.
Key Features
- Core Logic — 637,000 logic element cells provide large programmable logic capacity for complex state machines, datapaths, and custom accelerators.
- Embedded Memory — Approximately 4.24 Mbits (4,239,360 bits) of on-chip RAM with support for single, dual and pseudo‑dual port modes, FIFO modes, memory cascading, and RAM initialization/ROM operation as described in the Avant sysMEM documentation.
- I/O and Packaging — 349 I/O signals in a 484‑ball FCCSP package (484‑FCCSP, 19×19 mm) for high-density board integration and flexible external interfacing.
- Power — Device core supply specified at 820 mV.
- Commercial Temperature Grade — Operating range from 0 °C to 85 °C, suitable for commercial applications.
- Clocking and Timing — On‑chip oscillator, PLLs, and a multi-layer clocking structure including global, regional and edge clocks plus dynamic clock control options as outlined in the platform overview.
- Memory and DSP Subsystems — Dedicated sysMEM and sysDSP blocks provide memory and signal‑processing resources for embedded buffering and arithmetic workloads.
- Programmable I/O and PHY — Programmable I/O cell (PIC) architecture, sysI/O banking, DDRPHY overview and SERDES/PCS blocks enable configurable I/O standards and high‑speed interface support described in the Avant documentation.
- Configuration and Diagnostics — Enhanced configuration options, JTAG support, and SEU handling mechanisms are included in the Avant platform specification.
- RoHS Compliant — Device is RoHS compliant.
Typical Applications
- High‑capacity Logic Implementations — Use the large logic element count for complex control, protocol handling, or custom processing blocks in commercial embedded systems.
- On‑chip Memory‑intensive Designs — Leverage approximately 4.24 Mbits of embedded RAM for buffering, lookup tables, and intermediate data storage without external memory in some designs.
- Flexible I/O and Interface Control — 349 I/Os and programmable I/O cells support diverse interface needs including memory interfaces, peripheral control, and multi‑protocol PHY integration.
- DSP and Accelerator Functions — sysDSP and sysMEM resources enable implementation of arithmetic pipelines, filters, and embedded data‑path accelerators within the FPGA fabric.
Unique Advantages
- High Logic Density: 637,000 logic element cells enable integration of large, complex designs on a single device, reducing the need for multiple FPGAs.
- Multi‑Megabit Embedded Memory: Approximately 4.24 Mbits of on‑chip RAM with FIFO, cascading, and multi‑port modes simplifies buffering and memory architecture.
- Rich Clocking Architecture: On‑chip oscillator, PLLs and configurable clock domains provide flexible timing strategies for mixed‑frequency designs.
- Flexible I/O and PHY Support: 349 I/Os combined with programmable I/O cell architecture and DDR/serdes building blocks support diverse external interfaces.
- Compact, High‑density Package: 484‑FCCSP (19×19) package supports dense board layouts where area and I/O count are priorities.
- Commercial Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
Why Choose LAV-AT-E70-3CBG484C?
The LAV-AT-E70-3CBG484C positions itself as a commercially graded FPGA solution for teams needing substantial programmable logic, multi‑megabit embedded memory, and broad I/O in a compact 484‑ball FCCSP package. Its feature set—documented in the Lattice Avant platform overview—includes programmable functional units, dedicated memory and DSP blocks, configurable clocking, and PHY/serdes capabilities that collectively support complex embedded and interface‑centric designs.
This device is appropriate for commercial OEMs and system designers seeking a single‑chip platform to consolidate logic, memory, and interface functions while relying on the Avant platform documentation and configuration options for integration and deployment.
If you would like pricing, availability, or a formal quote for the LAV-AT-E70-3CBG484C, submit a quote request or contact sales to initiate the inquiry.