LAV-AT-E70-2LFG1156C
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 572 4239360 477000 1156-BBGA |
|---|---|
| Quantity | 1,039 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 572 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 477000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-E70-2LFG1156C – Avant™-E FPGA IC, 477k logic elements, 572 I/O, 1156‑BBGA
The LAV-AT-E70-2LFG1156C is an Avant™-E Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation built on the Lattice Avant platform. This device offers high logic capacity, abundant on‑chip memory, and a large I/O count in a 1156‑ball BGA package for designs that require dense programmable logic and extensive interfacing.
Architecturally aligned with the Avant platform, the device exposes programmable functional units, embedded memory and DSP resources, flexible I/O, and advanced clocking and SerDes/PHY capabilities described in the platform overview. It is supplied in a surface‑mount 1156‑FPBGA (35×35) package and is intended for commercial‑grade applications.
Key Features
- Logic Capacity Approximately 477,000 logic elements (cells) to implement large-scale digital designs and custom logic functions.
- Embedded Memory Approximately 4.24 Mbits of on‑chip RAM for buffering, FIFOs and memory-intensive logic functions.
- High I/O Count 572 I/O pins to support extensive board-level interfaces and parallel connectivity.
- Package and Mounting 1156‑BBGA package; supplier device package listed as 1156‑FPBGA (35×35). Device is designed for surface‑mount assembly.
- Voltage Supply Specification lists a device supply of 820 mV.
- Operating Temperature Commercial temperature range: 0 °C to 85 °C.
- Platform Architecture Built on the Lattice Avant platform with programmable functional unit (PFU) blocks, system memory (sysMEM), sysDSP and programmable I/O described in the platform overview.
- High‑Speed Interfaces and Memory Support The Avant platform overview lists SerDes/PMA, multi‑protocol PCS/PHY integration and DDR memory support for high‑performance interface and memory applications.
- System Features Platform-level features documented in the overview include flexible clocking structures, configuration options, security engine and trace/ID capabilities.
- Compliance RoHS compliant.
Typical Applications
- High‑density digital logic Implement complex, large‑scale custom logic and glue logic where substantial logic element and memory resources are required.
- Interface aggregation Use the device's high I/O count and platform SerDes/PHY capabilities to consolidate multiple board‑level interfaces.
- Memory buffering and data processing Leverage approximately 4.24 Mbits of on‑chip RAM and sysDSP resources for buffering, FIFOs and DSP‑style data handling.
Unique Advantages
- Substantial logic and memory capacity: With roughly 477k logic elements and ~4.24 Mbits of embedded RAM, the part supports large, integrated designs that reduce external component count.
- Extensive I/O integration: 572 I/O pins enable dense board connectivity and flexibility when routing multiple interfaces to FPGA fabric.
- Avant platform capabilities: Platform features such as PFU blocks, sysMEM, sysDSP, programmable I/O and SerDes/PCS support provide a comprehensive programmable fabric described in the Avant overview.
- Compact BGA package: The 1156‑BBGA (1156‑FPBGA, 35×35) package offers a high‑pin‑count solution in a compact footprint for space‑constrained boards.
- Commercial temperature and RoHS compliant: Commercial operating range (0 °C to 85 °C) and RoHS compliance align with standard commercial product requirements.
Why Choose LAV-AT-E70-2LFG1156C?
The LAV-AT-E70-2LFG1156C positions itself as a high‑capacity Avant™-E FPGA option for designs that need a combination of large logic resources, on‑chip memory and extensive I/O in a compact BGA package. Its Avant platform architecture and documented features (PFU, sysMEM, sysDSP, programmable I/O, SerDes/PCS and DDR support) provide a versatile foundation for complex embedded and interface‑heavy designs.
This device is suited to customers who require scalability and integration to reduce BOM and board complexity while retaining the programmable flexibility of an FPGA. The combination of logic density, embedded RAM and platform features supports long‑lived designs that may evolve over time within a commercial temperature environment.
Request a quote or submit an inquiry to receive pricing and availability for the LAV-AT-E70-2LFG1156C and to discuss your design requirements with a product specialist.