LAV-AT-E70-2CBG484I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 349 4239360 637000 484-BGA, FCCSPBGA

Quantity 550 Available (as of May 26, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGA, FCCSPBGANumber of I/O349Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-2CBG484I – Avant™-E FPGA IC, 637,000 logic elements, 484‑BGA

The LAV-AT-E70-2CBG484I is an Avant™-E field-programmable gate array (FPGA) IC from Lattice Semiconductor Corporation, built on the Lattice Avant platform. The device provides a large programmable fabric combined with on-chip memory and extensive I/O to support complex, reconfigurable digital designs.

Engineered for industrial-grade operation, this surface-mount FPGA targets designs that require dense logic resources, embedded memory, and flexible I/O and clocking options as described in the Avant platform documentation.

Key Features

  • Core Logic — 637,000 logic element cells provide substantial programmable logic capacity for complex digital designs.
  • Embedded Memory — Approximately 4.24 Mbits of embedded memory (4,239,360 total RAM bits) for on-chip buffering, state storage, and local data processing.
  • I/O — 349 I/O pins to support broad external interfacing and multi-bank I/O configurations.
  • Clocking and Timing — Platform documentation describes on-chip oscillator, PLLs, global and regional clock structures, and dynamic clock control options for flexible timing architectures.
  • Memory and DSP Blocks — The Avant platform includes sysMEM and sysDSP resources and DDR memory support (DDRPHY) for tightly coupled memory and signal-processing functions.
  • High-Speed Interfaces — Datasheet content references SERDES and PCS building blocks and multi-protocol PHY integration for serial connectivity and protocol handling.
  • Configuration and Reliability — Device configuration features include JTAG and SEU handling mechanisms as described in the platform overview.
  • Package and Mounting — 484‑BGA, FCCSPBGA package; supplier device package listed as 484‑FCCSP (19×19). Surface-mount mounting type.
  • Power — Voltage supply specified at 820 mV.
  • Temperature Range & Grade — Industrial grade with operating temperature from −40 °C to 100 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Programmable System Logic — Implement custom control, glue logic, and complex state machines using the device’s large logic element count and on-chip memory.
  • Memory Interface and Acceleration — Use embedded sysMEM and DDRPHY capabilities for local buffering, memory controllers, and data-path acceleration.
  • High-Speed Serial Connectivity — Leverage SERDES/PCS and multi-protocol PHY resources for protocol bridging, serial links, and interface conversion.
  • Embedded Signal Processing — Combine sysDSP blocks with on-chip RAM to implement DSP pipelines, filters, and real-time data processing functions.

Unique Advantages

  • Substantial Logic Capacity: 637,000 logic elements enable complex designs to be implemented entirely in programmable fabric, reducing external ASIC/FPGA partitioning.
  • Significant On-Chip Memory: Approximately 4.24 Mbits of embedded RAM supports deep buffering and local data storage to simplify system memory architectures.
  • Wide I/O Count: 349 I/Os provide flexibility for multi-bank interfaces and dense peripheral connectivity without excessive external multiplexing.
  • Comprehensive Clocking: On-chip oscillator, PLLs, and hierarchical clock structures described in the platform enable flexible timing domain implementation.
  • Industrial Temperature Rating: Specified −40 °C to 100 °C operating range and industrial grade labeling support deployment in temperature-challenging environments.
  • Platform-Level Integration: Inclusion of sysMEM, sysDSP, DDRPHY, SERDES/PCS, and configuration features documented for the Avant platform simplifies system integration and design planning.

Why Choose LAV-AT-E70-2CBG484I?

The LAV-AT-E70-2CBG484I is positioned for engineers who need a high-capacity, industrial-grade FPGA with integrated memory and extensive I/O. Its large pool of logic elements, significant on-chip RAM, and platform-level features—such as clocking, DSP, DDRPHY, and SERDES/PCS blocks—make it suitable for complex, reconfigurable systems that require on-device processing and flexible interfacing.

Designed as part of the Lattice Avant platform, this device offers a documented set of architecture and configuration capabilities that support scalable designs and streamlined integration during development and deployment.

Request a quote or submit an inquiry to start procurement and receive pricing, availability, and ordering details for LAV-AT-E70-2CBG484I.

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