LAV-AT-E70-2CSG841I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 502 4239360 637000 841-BGA, FCCSPBGA

Quantity 759 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package841-FCCSP (15x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case841-BGA, FCCSPBGANumber of I/O502Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-2CSG841I – Avant™-E Field Programmable Gate Array (FPGA), 637,000 logic elements, 841-FCCSP BGA

The LAV-AT-E70-2CSG841I is an Avant™-E platform FPGA from Lattice Semiconductor, provided in an 841-FCCSP BGA package (15 × 13). This industrial-grade, surface-mount FPGA integrates high logic capacity, abundant embedded memory, and a large number of I/O to address complex embedded and industrial applications.

Built on the Lattice Avant platform, the device includes on-chip clocking, memory and DSP subsystems, programmable I/O, and SERDES/PCS support described in the platform overview. It is suited for designs requiring high logic density, substantial on-chip RAM, and robust thermal operation from -40 °C to 100 °C.

Key Features

  • Logic Capacity — 637,000 logic elements to implement complex custom logic, control, and data-path functions.
  • Embedded Memory — Approximately 4.24 Mbits of on-chip RAM (4,239,360 bits) for buffers, state storage, and embedded data structures.
  • Rich I/O — 502 user I/O pins to support extensive peripheral interfacing and multi-channel designs.
  • Package & Mounting — 841-BGA (841-FCCSP, 15×13) surface-mount package for compact board integration.
  • Industrial Temperature Range — Guaranteed operation from -40 °C to 100 °C for demanding environmental conditions.
  • Supply Voltage — Device specified for a supply voltage at 820 mV.
  • Platform Architecture — Lattice Avant platform architecture with Programmable Functional Units (PFU), clocking (on-chip oscillator, PLL, global/regional/edge clocks), sysMEM, sysDSP, and programmable I/O cell structures.
  • Memory and Interface Support — Platform-level support for sysMEM configurations (single/dual/pseudo-dual port, FIFO, RAM init/ROM modes) and DDR memory PHY capabilities.
  • High-speed Interfaces — Series-level SERDES and PCS blocks and multi-protocol PHY/PCS integration as part of the Avant platform.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — High logic density and industrial temperature range enable complex control, sequencing, and deterministic I/O for factory automation.
  • Communications Infrastructure — Large I/O count and platform SERDES/PCS support facilitate protocol bridging, packet processing, and high-speed interface implementations.
  • Edge Computing and Signal Processing — Substantial logic elements and embedded RAM support on-device acceleration and buffering for edge DSP workloads.
  • Memory Interface and Bridging — sysMEM and DDRPHY support enable memory buffering, caching, and interface bridging for embedded systems.

Unique Advantages

  • High Logic Density: 637,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing system complexity.
  • Significant On-Chip RAM: Approximately 4.24 Mbits of embedded memory reduces dependence on external memory for many buffering and state-storage tasks.
  • Extensive I/O Count: 502 I/O pins allow flexible connectivity to sensors, buses, high-speed transceivers, and peripheral devices.
  • Industrial Temperature Operation: Rated from -40 °C to 100 °C to meet thermal requirements for harsh or outdoor deployments.
  • Integrated Avant Platform Capabilities: Platform-level clocking, sysDSP, programmable I/O cells, and SERDES/PCS enable complex timing, DSP, and high-speed interface implementations.
  • Compact Package: 841-FCCSP BGA (15×13) offers a space-efficient footprint for densely packed PCBs.

Why Choose LAV-AT-E70-2CSG841I?

The LAV-AT-E70-2CSG841I positions itself as a high-capacity, industrial-grade FPGA option within the Lattice Avant platform family. Its combination of 637,000 logic elements, approximately 4.24 Mbits of embedded RAM, and 502 I/Os makes it suitable for engineers building complex embedded systems that require consolidated logic, robust memory resources, and substantial interfacing.

Platform features such as programmable clocks, sysMEM, sysDSP, DDRPHY support, and SERDES/PCS capabilities provide a versatile foundation for scalable designs. The device’s industrial temperature rating and compact 841-FCCSP package support deployment in demanding environments where space and thermal resilience are critical.

Request a quote or submit a sourcing inquiry to begin evaluating the LAV-AT-E70-2CSG841I for your next design.

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